JPS6448500A - Lead pin bend detector for flat package type ic - Google Patents

Lead pin bend detector for flat package type ic

Info

Publication number
JPS6448500A
JPS6448500A JP62204197A JP20419787A JPS6448500A JP S6448500 A JPS6448500 A JP S6448500A JP 62204197 A JP62204197 A JP 62204197A JP 20419787 A JP20419787 A JP 20419787A JP S6448500 A JPS6448500 A JP S6448500A
Authority
JP
Japan
Prior art keywords
image sensor
lead pin
highly sensitive
linear image
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62204197A
Other languages
Japanese (ja)
Inventor
Norihisa Nakamura
Shunichi Hanabusa
Makoto Hairi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP62204197A priority Critical patent/JPS6448500A/en
Publication of JPS6448500A publication Critical patent/JPS6448500A/en
Pending legal-status Critical Current

Links

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To make it possible to detect with high accuracy a bend of a lead pin in the perpendicular direction by irradiating a slit light onto several pins well-arranged on a linear image sensor wherein a highly sensitive photodiode is aligned linearly, and reading the outputs of the linear image sensor. CONSTITUTION:A flat package type IC 6 is arranged on a linear image sensor 2, wherein a highly sensitive photodiode 4 is linearly aligned, so that the pins on the IC are arranged distant from the highly sensitive photodiode 4, and a slit light 12 is irradiated onto the highly sensitive photodiode 4 with the light being partially shielded by each of the pins 8. The output from the photodiode 4 is small where the light is shielded by lead pins free from bend. According to the constitution, by reading the output from the linear image sensor, the bend of the lead pin 8 in the perpendicular direction can be detected with high accuracy.
JP62204197A 1987-08-19 1987-08-19 Lead pin bend detector for flat package type ic Pending JPS6448500A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62204197A JPS6448500A (en) 1987-08-19 1987-08-19 Lead pin bend detector for flat package type ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62204197A JPS6448500A (en) 1987-08-19 1987-08-19 Lead pin bend detector for flat package type ic

Publications (1)

Publication Number Publication Date
JPS6448500A true JPS6448500A (en) 1989-02-22

Family

ID=16486440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62204197A Pending JPS6448500A (en) 1987-08-19 1987-08-19 Lead pin bend detector for flat package type ic

Country Status (1)

Country Link
JP (1) JPS6448500A (en)

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