JPS6450422A - Resist coating method - Google Patents

Resist coating method

Info

Publication number
JPS6450422A
JPS6450422A JP62206309A JP20630987A JPS6450422A JP S6450422 A JPS6450422 A JP S6450422A JP 62206309 A JP62206309 A JP 62206309A JP 20630987 A JP20630987 A JP 20630987A JP S6450422 A JPS6450422 A JP S6450422A
Authority
JP
Japan
Prior art keywords
resist
superconductive
grains
magnetic field
coating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62206309A
Other languages
Japanese (ja)
Inventor
Yoshio Kawamura
Kazuo Sato
Akizo Toda
Shinji Tanaka
Norio Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62206309A priority Critical patent/JPS6450422A/en
Publication of JPS6450422A publication Critical patent/JPS6450422A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)

Abstract

PURPOSE:To flatten a processed film on an irregular substrate or an lower layer film of multilayered resist, by containing fine grains of superconductive ceramics in the resist. CONSTITUTION:A VLSI wafer 3 having a step structure is sucked and fixed on a sucking stage 4. Resist 1, which includes fine grains 2 of atomized superconductive ceramics, is applied in an appropriate magnetic field at suitable atmospheric temperature. In the sucking stage 4, an electromagnetic coil is incorporated so as to form the magnetic field so that uniform Meissner effect acts on the superconductive ceramic grains. Therefore, the superconductive ceramic grains 2 can apply the uniform force on the resist in the direction of the surface of the resist. Thus the surface of the resist is flattened.
JP62206309A 1987-08-21 1987-08-21 Resist coating method Pending JPS6450422A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62206309A JPS6450422A (en) 1987-08-21 1987-08-21 Resist coating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62206309A JPS6450422A (en) 1987-08-21 1987-08-21 Resist coating method

Publications (1)

Publication Number Publication Date
JPS6450422A true JPS6450422A (en) 1989-02-27

Family

ID=16521167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62206309A Pending JPS6450422A (en) 1987-08-21 1987-08-21 Resist coating method

Country Status (1)

Country Link
JP (1) JPS6450422A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05234875A (en) * 1992-02-21 1993-09-10 Tokyo Electron Ltd Forming method for film
US8276257B2 (en) 2004-07-30 2012-10-02 Hitachi Global Storage Technologies Netherlands B.V. Method for making coplanar write head pole tips
US8460035B2 (en) 2008-12-17 2013-06-11 Fujikura Ltd. Connector assembly including a cable with a USB 3.0 signal line, a USB 2.0 signal line, a power line and a ground line

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05234875A (en) * 1992-02-21 1993-09-10 Tokyo Electron Ltd Forming method for film
US8276257B2 (en) 2004-07-30 2012-10-02 Hitachi Global Storage Technologies Netherlands B.V. Method for making coplanar write head pole tips
US8460035B2 (en) 2008-12-17 2013-06-11 Fujikura Ltd. Connector assembly including a cable with a USB 3.0 signal line, a USB 2.0 signal line, a power line and a ground line

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