JPS645663A - Method for soldering lead wire onto aluminum plate - Google Patents

Method for soldering lead wire onto aluminum plate

Info

Publication number
JPS645663A
JPS645663A JP16042787A JP16042787A JPS645663A JP S645663 A JPS645663 A JP S645663A JP 16042787 A JP16042787 A JP 16042787A JP 16042787 A JP16042787 A JP 16042787A JP S645663 A JPS645663 A JP S645663A
Authority
JP
Japan
Prior art keywords
paste
paste layer
layer
plate
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16042787A
Other languages
Japanese (ja)
Other versions
JPH0240419B2 (en
Inventor
Fumio Nakaya
Shinichi Wakita
Hisatoshi Murakami
Tsunehiko Terada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Priority to JP16042787A priority Critical patent/JPH0240419B2/en
Publication of JPS645663A publication Critical patent/JPS645663A/en
Publication of JPH0240419B2 publication Critical patent/JPH0240419B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)

Abstract

PURPOSE:To easily enable to solder even an Al plate in a small piece shape by using an ordinary inexpensive Pb-Sn solder by interposing a Ni paste between the surface of a surface treated Al plate and a Cu paste and using a rosin flux for the Cu paste layer. CONSTITUTION:The Ni paste consisting of a scaly Ni powder, acryl/melamine resin mixture, dispersant, triethanolamine and curing catalyst is coated on a surface treated Al plate 1 and hardened by heating to form a Ni paste layer 2. The Cu paste consisting of a metal Cu powder resol type phenol resin, saturated fatty acid or unsaturated fatty acid or these metallic salts, metal chelate forming agent and a soldering promotor is in succession coated on the Ni paste layer 2 and hardened by heating to form a Cu paste layer 3. A lead wire 5 is soldered to the Cu paste layer 3 by using a rosin flux and a solder layer 4 is formed.
JP16042787A 1987-06-26 1987-06-26 ARUMIBANHENORIIDOSENHANDAZUKEHOHO Expired - Lifetime JPH0240419B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16042787A JPH0240419B2 (en) 1987-06-26 1987-06-26 ARUMIBANHENORIIDOSENHANDAZUKEHOHO

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16042787A JPH0240419B2 (en) 1987-06-26 1987-06-26 ARUMIBANHENORIIDOSENHANDAZUKEHOHO

Publications (2)

Publication Number Publication Date
JPS645663A true JPS645663A (en) 1989-01-10
JPH0240419B2 JPH0240419B2 (en) 1990-09-11

Family

ID=15714695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16042787A Expired - Lifetime JPH0240419B2 (en) 1987-06-26 1987-06-26 ARUMIBANHENORIIDOSENHANDAZUKEHOHO

Country Status (1)

Country Link
JP (1) JPH0240419B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994029062A1 (en) * 1993-06-07 1994-12-22 Nippon Yakin Kogyo Co., Ltd. Exhaust gas cleaning metal carrier and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994029062A1 (en) * 1993-06-07 1994-12-22 Nippon Yakin Kogyo Co., Ltd. Exhaust gas cleaning metal carrier and method of manufacturing the same

Also Published As

Publication number Publication date
JPH0240419B2 (en) 1990-09-11

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees