JPS6457628A - Electronic component with conductive layer - Google Patents

Electronic component with conductive layer

Info

Publication number
JPS6457628A
JPS6457628A JP62214025A JP21402587A JPS6457628A JP S6457628 A JPS6457628 A JP S6457628A JP 62214025 A JP62214025 A JP 62214025A JP 21402587 A JP21402587 A JP 21402587A JP S6457628 A JPS6457628 A JP S6457628A
Authority
JP
Japan
Prior art keywords
tin
conductive layer
platinum containing
layers
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62214025A
Other languages
Japanese (ja)
Other versions
JP2627509B2 (en
Inventor
Yoshihiro Hosoi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP62214025A priority Critical patent/JP2627509B2/en
Publication of JPS6457628A publication Critical patent/JPS6457628A/en
Application granted granted Critical
Publication of JP2627509B2 publication Critical patent/JP2627509B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To obtain an electronic component having a conductive layer composed of tin or platinum containing tin which is capable of solid connection to an external electric circuit and the like, even if thermal hysteresis like burn-in test or the like is applied, by stacking and fixing two or more metal layers composed of the respective specific nickel layers as the base of a conductive layer composed of tin or platinum containing tin. CONSTITUTION:The title electronic component has a conductive layer 6 composed of tin or platinum containing tin, on a metal surface 3 arranged on the surface of an insulative substrate 1. As the base of the conductive layer 6 composed of tin or platinum containing tin, a metal layer is stacked and fixed which is composed of at least the following two layers; a first nickel layer 4 whose cobalt content is less than to equal to 3.0wt.%, and a second nickel layer 5 of 0.3-2.0mum thick whose cobalt content is 5.0-30.0wt.%. For example, an external lead terminal 3 is joined to metallized metal 2 on the side surface of the insulative substrate 1 of a semiconductor element accommodating package, via eutectic silver solder. On the surface of the external lead 3, the above- mentioned first and second nickel layers 4, 5 and the conductive layer 6 composed of tin or platinum containing tin are stacked and fixed.
JP62214025A 1987-08-27 1987-08-27 Electronic component having conductive layer Expired - Lifetime JP2627509B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62214025A JP2627509B2 (en) 1987-08-27 1987-08-27 Electronic component having conductive layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62214025A JP2627509B2 (en) 1987-08-27 1987-08-27 Electronic component having conductive layer

Publications (2)

Publication Number Publication Date
JPS6457628A true JPS6457628A (en) 1989-03-03
JP2627509B2 JP2627509B2 (en) 1997-07-09

Family

ID=16649028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62214025A Expired - Lifetime JP2627509B2 (en) 1987-08-27 1987-08-27 Electronic component having conductive layer

Country Status (1)

Country Link
JP (1) JP2627509B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6034765A (en) * 1983-08-05 1985-02-22 Matsushita Electric Works Ltd Extruder for viscous material
US4970034A (en) * 1988-09-23 1990-11-13 W. R. Grace & Co.-Conn. Process for preparing isotropic microporous polysulfone membranes
US5096585A (en) * 1991-01-28 1992-03-17 W. R. Grace & Co.-Conn. Process for preparing protein non-adsorptive microporous polysulfone membranes
US5151227A (en) * 1991-03-18 1992-09-29 W. R. Grace & Co.-Conn. Process for continuous spinning of hollow-fiber membranes using a solvent mixture as a precipitation medium

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092647A (en) * 1983-10-27 1985-05-24 Toshiba Corp External lead for electronic part
JPS60127752A (en) * 1983-12-14 1985-07-08 Ngk Spark Plug Co Ltd Ni-plating of lead of ic package
JPS6288350A (en) * 1985-10-15 1987-04-22 Furukawa Electric Co Ltd:The Lead frame for electronic part

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092647A (en) * 1983-10-27 1985-05-24 Toshiba Corp External lead for electronic part
JPS60127752A (en) * 1983-12-14 1985-07-08 Ngk Spark Plug Co Ltd Ni-plating of lead of ic package
JPS6288350A (en) * 1985-10-15 1987-04-22 Furukawa Electric Co Ltd:The Lead frame for electronic part

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6034765A (en) * 1983-08-05 1985-02-22 Matsushita Electric Works Ltd Extruder for viscous material
US4970034A (en) * 1988-09-23 1990-11-13 W. R. Grace & Co.-Conn. Process for preparing isotropic microporous polysulfone membranes
US5096585A (en) * 1991-01-28 1992-03-17 W. R. Grace & Co.-Conn. Process for preparing protein non-adsorptive microporous polysulfone membranes
US5151227A (en) * 1991-03-18 1992-09-29 W. R. Grace & Co.-Conn. Process for continuous spinning of hollow-fiber membranes using a solvent mixture as a precipitation medium

Also Published As

Publication number Publication date
JP2627509B2 (en) 1997-07-09

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