JPS6457724A - Resin seal device for semiconductor - Google Patents

Resin seal device for semiconductor

Info

Publication number
JPS6457724A
JPS6457724A JP62215587A JP21558787A JPS6457724A JP S6457724 A JPS6457724 A JP S6457724A JP 62215587 A JP62215587 A JP 62215587A JP 21558787 A JP21558787 A JP 21558787A JP S6457724 A JPS6457724 A JP S6457724A
Authority
JP
Japan
Prior art keywords
force
resin
seal device
semiconductor
clearance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62215587A
Other languages
English (en)
Inventor
Taizo Ejima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62215587A priority Critical patent/JPS6457724A/ja
Publication of JPS6457724A publication Critical patent/JPS6457724A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/80—Measuring, controlling or regulating of relative position of mould parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP62215587A 1987-08-28 1987-08-28 Resin seal device for semiconductor Pending JPS6457724A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62215587A JPS6457724A (en) 1987-08-28 1987-08-28 Resin seal device for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62215587A JPS6457724A (en) 1987-08-28 1987-08-28 Resin seal device for semiconductor

Publications (1)

Publication Number Publication Date
JPS6457724A true JPS6457724A (en) 1989-03-06

Family

ID=16674902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62215587A Pending JPS6457724A (en) 1987-08-28 1987-08-28 Resin seal device for semiconductor

Country Status (1)

Country Link
JP (1) JPS6457724A (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1002083C2 (nl) * 1996-01-12 1997-07-15 Fico Bv Werkwijze en inrichting voor het sluiten van vormhelften.
JP2005536044A (ja) * 2002-08-13 2005-11-24 オーテーベー、グループ、ベスローテン、フェンノートシャップ 少なくとも１つの電子構成部品をコンパウンドで完全にまたは部分的に覆うための方法および装置。
JP2012156149A (ja) * 2011-01-21 2012-08-16 Daiichi Seiko Co Ltd 樹脂封止装置および樹脂封止方法
CN104416846A (zh) * 2013-08-21 2015-03-18 恩格尔奥地利有限公司 用于运行成型机的闭合单元的方法
WO2017111594A1 (en) * 2015-12-23 2017-06-29 Besi Netherlands B.V. Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators
CN110694322A (zh) * 2019-10-17 2020-01-17 李静业 一种地暖管道过滤装置
CN113161257A (zh) * 2020-01-14 2021-07-23 杰宜斯科技有限公司 电子装置

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1002083C2 (nl) * 1996-01-12 1997-07-15 Fico Bv Werkwijze en inrichting voor het sluiten van vormhelften.
JP2005536044A (ja) * 2002-08-13 2005-11-24 オーテーベー、グループ、ベスローテン、フェンノートシャップ 少なくとも１つの電子構成部品をコンパウンドで完全にまたは部分的に覆うための方法および装置。
JP2012156149A (ja) * 2011-01-21 2012-08-16 Daiichi Seiko Co Ltd 樹脂封止装置および樹脂封止方法
CN104416846A (zh) * 2013-08-21 2015-03-18 恩格尔奥地利有限公司 用于运行成型机的闭合单元的方法
KR20180098545A (ko) * 2015-12-23 2018-09-04 베시 네덜란드 비.브이. 적어도 2개의 개별적인 제어가능 액추에이터를 이용하여 전자 컴포넌트를 봉지하기 위한 프레스, 액추에이터 세트, 및 방법
CN108431948A (zh) * 2015-12-23 2018-08-21 贝斯荷兰有限公司 利用至少两个单独的可控致动器封装电子元件的压机、致动器组和方法
WO2017111594A1 (en) * 2015-12-23 2017-06-29 Besi Netherlands B.V. Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators
JP2019501039A (ja) * 2015-12-23 2019-01-17 ベシ ネーデルランズ ビー．ヴイ．Ｂｅｓｉ Ｎｅｔｈｅｒｌａｎｄｓ Ｂ．Ｖ． 少なくとも２つの個別制御可能なアクチュエータを有する電子部品封止用のプレス機、アクチュエータセットおよび方法
CN108431948B (zh) * 2015-12-23 2021-11-12 贝斯荷兰有限公司 利用至少两个单独的可控致动器封装电子元件的压机、致动器组和方法
US11217463B2 (en) 2015-12-23 2022-01-04 Besi Netherlands B.V. Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators
US11842909B2 (en) 2015-12-23 2023-12-12 Besi Netherlands B.V. Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators
DE112016006001B4 (de) * 2015-12-23 2025-06-05 Besi Netherlands B.V. Presse und Verfahren zum Einkapseln elektronischer Bauelemente mit mindestens zwei individuell steuerbaren Aktuatoren
CN110694322A (zh) * 2019-10-17 2020-01-17 李静业 一种地暖管道过滤装置
CN113161257A (zh) * 2020-01-14 2021-07-23 杰宜斯科技有限公司 电子装置

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