JPS6459990A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS6459990A JPS6459990A JP21701287A JP21701287A JPS6459990A JP S6459990 A JPS6459990 A JP S6459990A JP 21701287 A JP21701287 A JP 21701287A JP 21701287 A JP21701287 A JP 21701287A JP S6459990 A JPS6459990 A JP S6459990A
- Authority
- JP
- Japan
- Prior art keywords
- prepregs
- hole
- metal
- molded
- metal board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002184 metal Substances 0.000 abstract 11
- 229910052751 metal Inorganic materials 0.000 abstract 11
- 239000011888 foil Substances 0.000 abstract 5
- 238000000034 method Methods 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
PURPOSE:To obtain flat surfaces after prepregs are molded by a method wherein the prepregs are provided on one of the surfaces of a metal board in which a hole for a through-hole is drilled and molded by heat and pressure in a vacuum and the prepregs are provided on both the surfaces of the metal board and metal foils are provided on the prepregs and the laminated prepregs and foils are molded again by heat and pressure. CONSTITUTION:A hole 9 with a diameter of 1.5mm for a through-hole is drilled in a metal board 8. After that, two laminated prepregs 10 are provided on one of the surfaces of the metal board 8 and molded by heat and pressure in a vacuum of 5-7torr. By this process, the hole 9 in the metal plate 8 is filled with resin of the prepregs 10 and the resin forms an insulating layer between the metal board 8 and the through-hole. Then, one prepreg 10 is provided on the molded prepregs 10 on the metal board 8 and three prepregs 10 are provided on the other surface of the metal board 8 and copper metal foils 11 are provided on both the surfaces of the prepregs 10. The laminated foils and prepregs are molded again by heat and pressure. After that, a through-hole which is approximately coaxial with the hole 9 and has a diameter smaller than the hole 9 is drilled and plating is applied to the through-hole and a circuit pattern is formed. With this constitution, the surfaces of the metal foils are levelled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21701287A JPS6459990A (en) | 1987-08-31 | 1987-08-31 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21701287A JPS6459990A (en) | 1987-08-31 | 1987-08-31 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6459990A true JPS6459990A (en) | 1989-03-07 |
Family
ID=16697443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21701287A Pending JPS6459990A (en) | 1987-08-31 | 1987-08-31 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6459990A (en) |
-
1987
- 1987-08-31 JP JP21701287A patent/JPS6459990A/en active Pending
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