JPS646263Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to a drilling device for drilling nail holes in the peaks of corrugated roof tiles.

[Background technology]

In the conventional punching device of this kind, the shape of the convex surface of the receiving die on which the crest of the wavy tile is placed, and the concave curved back surface of the presser plate that presses the crest of the wavy tile onto the receiving die from the front side. The shape of the tile was matched to the shape of the front and back sides of the peaks of the wavy tile, respectively.The wavy tile was held between a holding plate and a receiving die, and a nail hole was punched in the top of the wavy tile using a punching pin. When punching, the curvature radius of the peaks of the wavy tile usually varies, so the holding plate and the receiving die do not always come into close contact with the wavy tile, and when the punching pin detaches from the wavy tile, so-called surface curling or hair cracks occur. After installing corrugated tiles by nailing, water leaked from the nailed part and caused frost damage.

[Purpose of invention]

The present invention was developed in view of the above circumstances, and its purpose is to prevent so-called surface curling and hair cracks when drilling nail holes in wavy tiles, which usually have variations in the radius of curvature of the peaks. It is an object of the present invention to provide a perforating device for corrugated roof tiles that does not cause such defects as described above.

[Disclosure of invention]

The corrugated tile perforation device A of the present invention comprises a receiving die 3 on which the ridges 2 of the wavy tile 1 are placed, a presser plate 4 that presses the ridges 2 of the wavy tile 1 onto the receiving die 3 from the surface side, and a wavy tile punching device A. A device for punching a wavy tile, which is equipped with a punching pin 6 for punching a nail hole 5 in the top of the crest 2 of the wavy tile 1 while holding the crest 2 of the tile 1 between a die 3 and a holding plate 4. In this step, the radius of curvature r ₁ of the convex curved surface 3a of the receiving die 3 is made smaller than the radius of curvature r 2 of the back surface 2b of the crest 2 of the wavy tile 1, and the radius _{of curvature r 3 of} the concave curved back surface 4a of the holding plate 4 is made smaller. The radius of curvature of the surface 2a of the crest 2 of the wavy tile 1 is made larger than _r4 , and this configuration achieves the above object.

The present invention will be described below based on embodiments shown in the accompanying drawings. Reference numeral 7 denotes a main body of the apparatus, which can be raised and lowered by a lifting device 8. A presser cylinder 10 is arranged on the upper frame 9 of the main body 7 of the apparatus, and a rod 11 is made to protrude downward. A guide shaft 13 is suspended from both ends of a horizontal plate 12 bolted to the lower end of the rod 11. This guide shaft 13 is connected to a slide bearing 15 disposed on the lower frame 14 of the device main body 7.
It is supported by A concave curved back surface 4 made of urethane rubber is connected to the lower end of the guide shaft 13 via a support plate 16.
A presser plate 4 having a shape a is attached, and the presser plate 4 is urged downward by a presser cylinder 10 via a guide shaft 13 and a rod 11. The pressing force of the presser cylinder 10 is, for example, 37 to 62.8 kg/cm ² , and the pressure can be adjusted within the range of 3 to 5 kg/cm ² .
It can be changed as appropriate depending on the thickness, etc. Presser plate 4
A receiver die 3 is disposed directly below the receiving die 3 so that the center of curvature of its protruding surface 3a is on the same line as the center of curvature of its concave back surface 4a. A punching pin 6 is made to protrude from the lower frame 14 of the apparatus main body 7 via a fixing metal fitting 17 bolted approximately in the center between the slide bearings 15. The support plate 16, the presser plate 4, and the receiving die 3 are provided with slide holes 18, 19, and 20 for the punching pin 6 whose centers are coaxial. Furthermore, the radius of curvature r ₁ of the convexly curved surface 3 a of the receiving die 3 is smaller than the radius of curvature r ₂ of the back surface of the peak portion 2 of the wavy tile 1 , and the radius of curvature r ₃ of the concave curved back surface 4 a of the holding plate 4
is made larger than the radius of curvature _r4 of the surface 2a of the peak portion 2 of the wavy tile 1. For example, r ₁ = 36mm, r ₂ = 39
mm, r ₃ = 48 mm, r ₄ = 45 mm.

Next, the operation of the punching device A configured as described above will be explained. The ridge portion 2 of the corrugated stone wire slate serving as the corrugated tile 1 in which the nail hole 5 is to be bored is placed on the receiving die 3 as shown by the imaginary line in FIG. Thereafter, the main body 7 of the device is lowered by the lifting device 8, and the peak portion 2 of the wavy tile 1 is pressed from the front side by the pressing plate 4. In this case, the radius of curvature r ₁ of the convexly curved surface 3 a of the receiving die 3 is smaller than the radius of curvature r ₂ of the back surface of the crest 2 of the wavy tile 1 , and the radius of curvature r ₃ of the concave curved back surface 4 a of the holding plate 4 is Since the radius of curvature r ₄ of the surface 2a of the peak portion 2 is larger, only the top portion of the wavy tile 1 is held between the receiving die 3 and the holding plate 4 as shown in FIG. When the device main body 7 is further lowered in this state, the presser plate 4 rises against the presser force of the presser cylinder 10 while holding the wavy tile 1, while being fixed to the lower frame 14 via the fixing fittings 17. The punching pin 6 further descends, passes through the slide holes 18 and 19 of the support plate 16 and the presser plate 4, and punches the nail hole 5 at the top of the crest 2 of the corrugated tile 1, and the slide hole 20 of the receiving die 3. rush into. After that, when the main body 7 of the device is raised by the lifting device 8, the presser plate 4 is moved to the presser cylinder 10.
The punching pin 6 is urged downward and descends while holding down the top of the crest 2 of the wavy tile 1, and conversely, the punching pin 6 rises and leaves the slide holes 19, 18 of the holding plate 4 and the support plate 16, and then When the apparatus main body is raised, the presser plate 4 is raised together with the apparatus main body 7. In this way, nail holes 5 can be bored at predetermined locations on the tops of the peaks 2 of the wavy tiles 1.

[Effect of idea]

In the present invention, the radius of curvature of the convexly curved surface of the receiving die is made smaller than the radius of curvature of the back surface of the ridges of the wavy tile, and the radius of curvature of the concave curved back surface of the holding plate is made smaller than the radius of curvature of the back surface of the ridges of the wavy tile. Since the radius of curvature is larger than the radius of curvature, when a wavy tile is sandwiched between the receiving die and the holding plate, even if there is variation in the radius of curvature of the crest of the wavy tile, the top of the crest of the wavy tile The front and back surfaces of the die will be firmly in contact with the concave curved surface of the receiving die and the concave curved surface of the holding plate, and in this state, a nail hole will be punched at the top of the peak using a punching pin.
There is no occurrence of so-called surface peeling or hair cracks on the peaks of the wavy tiles.

[Brief explanation of the drawing]

Figure 1 is a side view showing one embodiment of the present invention;
The figure is a partially omitted front view of the same as the above, and FIG. 3 is a cross-sectional view showing the effect of the same. A... Perforation device, 1... Wavy tile, 2... Mountain part,
3... Receiving die, 4... Holding plate, 5... Nail hole,
6...Punching pin.

Claims (1)

[Scope of utility model registration request] A receiving die on which the ridges of the wavy tile are placed, a presser plate that presses the ridges of the wavy tile onto the receiving die from the front side, and a wavy tile with the crests of the wavy tile held between the die and the presser plate. In a corrugated tile punching device equipped with a punching pin for punching a nail hole at the top of a crest of a tile, the radius of curvature of the protruding surface of the receiving die is made smaller than the radius of curvature of the back surface of the crest of the wavy tile. A perforating device for corrugated tiles, in which the radius of curvature of the concave back surface of the holding plate is larger than the radius of curvature of the surface of the peaks of the corrugated tiles.