JPS6464231A - Conveyor - Google Patents

Conveyor

Info

Publication number
JPS6464231A
JPS6464231A JP21911187A JP21911187A JPS6464231A JP S6464231 A JPS6464231 A JP S6464231A JP 21911187 A JP21911187 A JP 21911187A JP 21911187 A JP21911187 A JP 21911187A JP S6464231 A JPS6464231 A JP S6464231A
Authority
JP
Japan
Prior art keywords
knots
intermediating
conveying
follower
knot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21911187A
Other languages
Japanese (ja)
Inventor
Hiroshi Iimori
Hiroshi Yamada
Akira Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP21911187A priority Critical patent/JPS6464231A/en
Publication of JPS6464231A publication Critical patent/JPS6464231A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To reduce dusting characteristics, to save space and to enable conveyance smoothly by arranging a conveying arm consisting of a four-bar link mechanism, a fixing knot of which is fixed into an anteroom, into a vacuum treater and holding an article to be treated to an intermediating knot for the conveying arm. CONSTITUTION:A conveying arm 5a conveying a tray 12, on which an article to be treated 11 is placed, into a treating chamber 1 from a loading mechanism 13 and a conveying arm 5b conveying the tray 12 to a separating mechanism 14 from the treating chamber 1 are installed into an anteroom 2. Each conveying arm 5a, 5b is composed of four-bar link mechanisms made up of fixing knots 2b, drive knots 6, intermediating knots 7 and follower knots 8. One ends of the drive knots 6 and one ends of the follower knots 8 are respectively connected rotatably at the specified positions of the fixing knots 2b, and the other ends of the drive knots 6 and the follower knots 8 are engaged by the intermediating knots 7. Holding arms 10 are fixed at one ends of the intermediating knots 7. The intermediating knot 7 and the follower knot 8 are formed to a straight shape at the atmospheric air side terminal of the locus 17 of the center of the article to be treated 11, and a point P3, a point P4 and a point P5 are arranged on a straight line. Accordingly, the conveying arms can be operated smoothly.
JP21911187A 1987-09-03 1987-09-03 Conveyor Pending JPS6464231A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21911187A JPS6464231A (en) 1987-09-03 1987-09-03 Conveyor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21911187A JPS6464231A (en) 1987-09-03 1987-09-03 Conveyor

Publications (1)

Publication Number Publication Date
JPS6464231A true JPS6464231A (en) 1989-03-10

Family

ID=16730422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21911187A Pending JPS6464231A (en) 1987-09-03 1987-09-03 Conveyor

Country Status (1)

Country Link
JP (1) JPS6464231A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5364222A (en) * 1992-02-05 1994-11-15 Tokyo Electron Limited Apparatus for processing wafer-shaped substrates
US5382127A (en) * 1992-08-04 1995-01-17 International Business Machines Corporation Pressurized interface apparatus for transferring a semiconductor wafer between a pressurized sealable transportable container and a processing equipment
US5486080A (en) * 1994-06-30 1996-01-23 Diamond Semiconductor Group, Inc. High speed movement of workpieces in vacuum processing
US6748293B1 (en) 2003-03-24 2004-06-08 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for high speed object handling
US6752579B2 (en) 1995-07-19 2004-06-22 Hitachi, Ltd. Vacuum processing apparatus and semiconductor manufacturing line using the same
JP2006156762A (en) * 2004-11-30 2006-06-15 Sumitomo Eaton Noba Kk Wafer processing apparatus, wafer processing method, and ion implantation apparatus

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5364222A (en) * 1992-02-05 1994-11-15 Tokyo Electron Limited Apparatus for processing wafer-shaped substrates
US5382127A (en) * 1992-08-04 1995-01-17 International Business Machines Corporation Pressurized interface apparatus for transferring a semiconductor wafer between a pressurized sealable transportable container and a processing equipment
US5486080A (en) * 1994-06-30 1996-01-23 Diamond Semiconductor Group, Inc. High speed movement of workpieces in vacuum processing
US6752579B2 (en) 1995-07-19 2004-06-22 Hitachi, Ltd. Vacuum processing apparatus and semiconductor manufacturing line using the same
US6895685B2 (en) 1995-07-19 2005-05-24 Hitachi, Ltd. Vacuum processing apparatus and semiconductor manufacturing line using the same
US7347656B2 (en) 1995-07-19 2008-03-25 Hitachi, Ltd. Vacuum processing apparatus and semiconductor manufacturing line using the same
US6748293B1 (en) 2003-03-24 2004-06-08 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for high speed object handling
JP2006156762A (en) * 2004-11-30 2006-06-15 Sumitomo Eaton Noba Kk Wafer processing apparatus, wafer processing method, and ion implantation apparatus
US8096744B2 (en) 2004-11-30 2012-01-17 Sen Corporation, An Shi And Axcelis Company Wafer processing system, wafer processing method, and ion implantation system

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