JPS6464391A - Manufacture of circuit board - Google Patents
Manufacture of circuit boardInfo
- Publication number
- JPS6464391A JPS6464391A JP22239187A JP22239187A JPS6464391A JP S6464391 A JPS6464391 A JP S6464391A JP 22239187 A JP22239187 A JP 22239187A JP 22239187 A JP22239187 A JP 22239187A JP S6464391 A JPS6464391 A JP S6464391A
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- face side
- copper
- face
- rough
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 5
- 239000011889 copper foil Substances 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000011347 resin Substances 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract 1
- 239000005751 Copper oxide Substances 0.000 abstract 1
- 229910000431 copper oxide Inorganic materials 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000011282 treatment Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE:To form a circuit pattern whose close adhesion performance is good by a method wherein electrolytic metal foil is incorporated into a molding metal mold in such a way that its rough face side faces toward the inside of a cavity and that its smooth face side closely adheres to an inner wall of the cavity and a molten resin is injected into the cavity, cooled and solidified. CONSTITUTION:Electrolytic copper foil 12 is incorporated into a molding metal mold 22 in such a way that its rough face side faces toward the inside of a cavity 20 and that its smooth face side closely adheres to an inner wall of the cavity 20. The electrolytic copper foil 12 is formed in such a way that copper is electrodeposited on a drum electrode; one face side is a mirror-like smooth face; a copper particle is formed on the other rough face. A particle of copper oxide adheres to the rough face side; various treatments are executed on the face; accordingly, the face becomes rougher; fine protrusions whose tip parts have swollen are formed. Then, a molten resin is injected into the cavity 20 through an injection port 24, cooled and solidified; a molded body 26 where the electrolytic copper foil 12 has adhered closely to a resin substrate 10 is obtained. An unnecessary part is cut and removed from the molded body 26; a copper-pasted laminated board 28 is obtained. In addition, an etching operation is executed, and a circuit board having a prescribed circuit pattern is obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22239187A JPS6464391A (en) | 1987-09-04 | 1987-09-04 | Manufacture of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22239187A JPS6464391A (en) | 1987-09-04 | 1987-09-04 | Manufacture of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6464391A true JPS6464391A (en) | 1989-03-10 |
Family
ID=16781630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22239187A Pending JPS6464391A (en) | 1987-09-04 | 1987-09-04 | Manufacture of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6464391A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011058173A1 (en) * | 2009-11-16 | 2011-05-19 | Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. | Method and device for producing a composite component, and composite component |
| EP3209099A1 (en) * | 2016-02-22 | 2017-08-23 | ITZ Innovations- und Technologiezentrum GmbH | Method of maufacturing a lighting component and lighting component manufactured by said method |
-
1987
- 1987-09-04 JP JP22239187A patent/JPS6464391A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011058173A1 (en) * | 2009-11-16 | 2011-05-19 | Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. | Method and device for producing a composite component, and composite component |
| EP3209099A1 (en) * | 2016-02-22 | 2017-08-23 | ITZ Innovations- und Technologiezentrum GmbH | Method of maufacturing a lighting component and lighting component manufactured by said method |
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