JPS64657Y2 - - Google Patents

Info

Publication number
JPS64657Y2
JPS64657Y2 JP14520783U JP14520783U JPS64657Y2 JP S64657 Y2 JPS64657 Y2 JP S64657Y2 JP 14520783 U JP14520783 U JP 14520783U JP 14520783 U JP14520783 U JP 14520783U JP S64657 Y2 JPS64657 Y2 JP S64657Y2
Authority
JP
Japan
Prior art keywords
power supply
strip
shaped
conductors
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14520783U
Other languages
Japanese (ja)
Other versions
JPS6052664U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14520783U priority Critical patent/JPS6052664U/en
Publication of JPS6052664U publication Critical patent/JPS6052664U/en
Application granted granted Critical
Publication of JPS64657Y2 publication Critical patent/JPS64657Y2/ja
Granted legal-status Critical Current

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  • Insulated Conductors (AREA)
  • Connection Or Junction Boxes (AREA)

Description

【考案の詳細な説明】 この種の従来の給電母線は、銅板等からなる二
枚の帯状導体を薄い適当な絶縁材を挾むように張
り合せてそれらの接続用端子を残して外装絶縁被
覆した構造を有し、現今のように回路基板に高密
度で多数実装されるIC又はLSI等の電子回路部品
に対して低い特性インピーダンスをもつ良好な給
配電を行なわせることが可能であり、また、この
ような給電母線の採用により、回路基板に形成す
べき給配電用配線パターンを低減して高密度実装
化を有効に促進させる等、特に回路基板における
給配電用電路を合理的に構成する手段として極め
て有益である。
[Detailed explanation of the invention] This type of conventional power supply bus has a structure in which two strip-shaped conductors made of copper plates or the like are pasted together with a thin appropriate insulating material sandwiched between them, and the connecting terminals are left behind and covered with external insulation. It is possible to perform good power supply and distribution with low characteristic impedance to electronic circuit components such as ICs or LSIs that are mounted in large numbers at high density on circuit boards as of today. By adopting such power supply busbars, the number of power supply and distribution wiring patterns to be formed on circuit boards can be reduced, effectively promoting high-density packaging, and in particular, as a means of rationally configuring power supply and distribution lines on circuit boards. Extremely useful.

ところで、例えば端子数が14ピンないしは40ピ
ンなど形状の異なるIC又はLSI等の能動電子回路
素子部品を回路基板に多数混載するような場合、
これらに対応して給電母線も種々長さの異なるも
のを縦横に実装する必要に迫られるので、給電母
線としては長さなど種々異なるものを多種類製作
しなければならず、その為に工程も錯雑なものと
なる。また、従来の給電母線の構造は、既述の如
く、二枚の帯状導体を絶縁状態で張り合せたよう
なものである為、このような給電母線を折り曲げ
るか又は適当な長さに切断して実装するには種々
の不都合があること、更に回路基板に対する半田
付け実装時においても、回路基板と給電母線との
冷却スピードの相違によつて給電母線にそり等を
発生することなど、実装面で種々の問題点があ
る。
By the way, when a large number of active electronic circuit components such as ICs or LSIs with different shapes such as 14 or 40 pins are mounted on a circuit board,
In response to this, it is necessary to mount power supply buses of various lengths vertically and horizontally, so it is necessary to manufacture many types of power supply buses of various lengths, and the process is also required. It becomes complicated. In addition, as mentioned above, the structure of conventional power supply busbars is like two strip-shaped conductors pasted together in an insulated state, so it is necessary to bend or cut such a power supply busbar to an appropriate length. There are various inconveniences when mounting on a circuit board, and even when mounting on a circuit board by soldering, warpage may occur on the power supply bus due to the difference in cooling speed between the circuit board and the power supply bus. There are various problems with this.

本考案は、そこで、従来のように、少なくとも
二枚の帯状導体を絶縁シート材を介して重ね合せ
るような積層構造ではなく、各々の長手方向端縁
が隣接状態となるように絶縁材の表裏に帯状導体
を互いに重なり合わないように各別に配装し、両
帯状導体の各接続用端子が同一側に突出するよう
に適宜外装絶縁被覆処理した構造の回路基板用給
電母線を提供するものである。このような給電母
線は、従つて帯状導体がその厚み方向に隣接した
状態で配装されるので、その断面構造をみるとほ
ぼ一枚物の形状となり、それ故、任意の位置で適
当な長さに切断したり折り曲げて実装することが
可能となり、また半田付け実装時においてもそり
等の発生を僅少に抑えられるようになる。
Therefore, the present invention does not have a laminated structure in which at least two strip-shaped conductors are overlapped with an insulating sheet material interposed therebetween, as in the past, but the front and back sides of the insulating material are stacked so that their longitudinal edges are adjacent to each other. To provide a power supply bus bar for a circuit board having a structure in which band-shaped conductors are arranged separately so as not to overlap each other, and the outer insulation coating is appropriately treated so that each connection terminal of both band-shaped conductors protrudes to the same side. be. In such a power supply bus, strip-shaped conductors are arranged adjacent to each other in the thickness direction, so when looking at its cross-sectional structure, it has the shape of almost a single piece. It becomes possible to mount by cutting or bending, and also to minimize the occurrence of warpage during soldering.

図面はその一実施例を概念的に示すもので、第
1図及び第2図において、1及び2は各々その長
手方向の同一側に所要のピツチ及びオフセツトを
有するように突出形成した端子1A,2Aを多数
有する銅板等からなる帯状の導体を示し、これら
両導体1,2は図示の如く層間絶縁フイルムのよ
うなフイルム状絶縁材3を介してそれらの帯状本
体部が重なり合わないように所要の間隔を置いて
上下に並設されている。4及び5はこれら両導体
1,2の表面を絶縁被覆する為の外装絶縁フイル
ムを示す。このような給電母線6を製造するに
は、例えば第1図の如く外装絶縁フイルム4の中
央より上側部位に一方の導体1の本体部が延在す
るように位置合せしてこの導体1を仮接合し、次
に該導体1上にその端子1Aの基部を十分に覆う
ような幅であつて上記フイルム4と実質的に同等
の幅の層間フイルム状絶縁材3を重ね合わせて仮
接合した後、他の導体2の本体部が上記導体1の
本体部と重なり合わないように下方にずらした位
置に並設しながら上記同様仮接合し、最後に残る
外装絶縁フイルム5をその上に重ね合せて仮接合
して第2図の如き積層体を形成し、全体を加熱圧
接して積層成形処理することによつて、図示の如
く、端子1A,2Aが同一側方に突出した縦型の
給電母線6を得ることができる。なお、このよう
な製造手法に代えて、先ず層間フイルム状絶縁材
3の表裏に両導体1及び2を図示の如く上下に並
設配装して各々仮接合してこれら両導体1,2が
ほぼ同一面上に位置するように構成した状態でデ
ツプ方式又はモールド方式による外装絶縁被覆処
理を施すことも可能である。
The drawing conceptually shows one embodiment of the present invention, and in FIGS. 1 and 2, terminals 1A and 2 are respectively formed protrudingly on the same side in the longitudinal direction so as to have the required pitch and offset. A strip-shaped conductor made of a copper plate or the like having a large number of 2A is shown, and both conductors 1 and 2 are separated by a film-shaped insulating material 3 such as an interlayer insulating film as shown in the figure, so that their strip-shaped main bodies do not overlap. They are arranged one above the other with an interval of . Reference numerals 4 and 5 indicate exterior insulating films for insulating the surfaces of both conductors 1 and 2. In order to manufacture such a power supply bus 6, for example, as shown in FIG. After bonding, an interlayer film-like insulating material 3 having a width that sufficiently covers the base of the terminal 1A and substantially the same width as the film 4 is superimposed on the conductor 1 and temporarily bonded. , the main body part of the other conductor 2 is placed side by side in a downwardly shifted position so that it does not overlap with the main body part of the conductor 1, and is temporarily joined in the same manner as above, and the last remaining exterior insulating film 5 is superimposed on it. By temporarily joining them together to form a laminate as shown in Fig. 2, and then applying heat and pressure welding to form a laminate, a vertical power supply with terminals 1A and 2A protruding to the same side as shown in the figure can be obtained. A busbar 6 can be obtained. In addition, instead of such a manufacturing method, first, both conductors 1 and 2 are arranged vertically in parallel on the front and back sides of the interlayer film-like insulating material 3 as shown in the figure, and are temporarily joined to each other. It is also possible to perform an exterior insulation coating treatment using a deep method or a mold method while the components are arranged so as to be located on substantially the same plane.

いずれにしても本考案に係る回路基板用給電母
線は、各々の端子を同一側方に突出するように少
なくとも二枚の帯状導体をフイルム状絶縁材の表
裏に互いに重なり合わないように各別に配置して
外装絶縁被覆するように構成してあり、これによ
つて各導体はその長手方向に絶縁材を介して単に
積層されることなく、上下に相互が位置をずらし
て所要の間隔で並設されてその厚み方向にほぼ一
枚物の状態となるように絶縁された構造となるの
で、従来の単なる積層構造のものと比較すると、
全体の厚さを可及的に薄く形成できるようにな
る。そして各導体はその本体部が所要の間隔で長
手方向に平行に延在して重なり合うことがないの
で、このような構造のものは、端子以外の任意個
所で切断しても両導体がシヨートする等の恐れも
なく、また、薄い一枚物の構造となるので、第3
図の如く適宜折り曲げて実装することも容易であ
る他、回路基板に対する半田付け実装時において
も従来のようにそり等を発生する度合が僅少化さ
れるなどの有利性を備える。従つて、同一種類の
長い給電母線を多数製作し、実装時にこれを適当
長さに切断するか又は任意折り曲げて実装処理で
きることとなり、製品の標準化を有効に促進しな
がら、これを低コストに提供できるという特長が
ある。また、この給電母線は従来の如く導体が幅
方向に積層されない為、導体間に形成する浮遊容
量は実質的に皆無となるので、単なる給配電の目
的のみならず、電路の浮遊容量を嫌うような信号
授受の用途にも好適である等の特性を有し、それ
故、回路基板の電路並びに信号路に対して高い実
装自由度を以つて採用することができる。
In any case, the power supply bus for a circuit board according to the present invention has at least two strip-shaped conductors arranged separately on the front and back sides of a film-shaped insulating material so that each terminal protrudes to the same side so that they do not overlap with each other. The structure is such that each conductor is coated with external insulation, so that each conductor is not simply laminated with insulation material interposed in its longitudinal direction, but is placed side by side at a required interval with the positions shifted vertically. Since it has a structure that is insulated so that it is almost a single piece in the thickness direction, compared to the conventional laminated structure,
The overall thickness can be made as thin as possible. Since the main bodies of each conductor extend parallel to each other at the required intervals in the longitudinal direction and do not overlap, with such a structure, both conductors will be shot even if they are cut at any point other than the terminal. There is no fear of such problems, and since the structure is thin and one-piece,
In addition to being easy to bend and mount as shown in the figure, it also has the advantage that the degree of warping, etc. that occurs in the conventional method is minimized when soldering to a circuit board. Therefore, it is possible to manufacture a large number of long power supply buses of the same type and then cut them to an appropriate length or bend them arbitrarily during mounting, which can be done at low cost while effectively promoting product standardization. It has the advantage of being possible. In addition, since the conductors of this power supply bus are not stacked in the width direction like in the past, there is virtually no stray capacitance formed between the conductors, so it is not only used for the purpose of power supply and distribution, but also for the purpose of avoiding stray capacitance in the electric circuit. It has characteristics such as being suitable for applications such as signal transmission and reception, and therefore can be employed with a high degree of freedom in mounting for electric paths and signal paths of circuit boards.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例による回路基板用給
電母線の概念的な部分切欠平面図、第2図は第1
図の要部断面構成図、第3図は実装態様例を示す
斜視図である。 1,2……帯状導体、1A,2A……端子、3
……層間フイルム状絶縁材、4,5……フイルム
状外装絶縁材。
FIG. 1 is a conceptual partial cutaway plan view of a power supply bus for a circuit board according to an embodiment of the present invention, and FIG.
FIG. 3 is a cross-sectional configuration diagram of main parts in the figure, and FIG. 3 is a perspective view showing an example of a mounting mode. 1, 2... Strip conductor, 1A, 2A... Terminal, 3
...Interlayer film-like insulation material, 4, 5... Film-like exterior insulation material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 各々長手方向の同一側に端子を多数突出形成し
た少なくとも二枚の帯状導体を有し、これら帯状
導体をフイルム状絶縁材の表裏に互いに重なり合
わないように各別に配装し、上記各端子を除いて
全体を外装絶縁被覆するように構成したことを特
徴とする回路基板用給電母線。
Each strip-shaped conductor has at least two strip-shaped conductors each having a large number of terminals protruding from the same side in the longitudinal direction, and these strip-shaped conductors are separately arranged on the front and back sides of a film-shaped insulating material so as not to overlap each other, and each of the above-mentioned terminals is A power supply bus for a circuit board, characterized in that the entire portion except for the exterior insulation is coated.
JP14520783U 1983-09-20 1983-09-20 Power supply busbar for circuit board Granted JPS6052664U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14520783U JPS6052664U (en) 1983-09-20 1983-09-20 Power supply busbar for circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14520783U JPS6052664U (en) 1983-09-20 1983-09-20 Power supply busbar for circuit board

Publications (2)

Publication Number Publication Date
JPS6052664U JPS6052664U (en) 1985-04-13
JPS64657Y2 true JPS64657Y2 (en) 1989-01-09

Family

ID=30323583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14520783U Granted JPS6052664U (en) 1983-09-20 1983-09-20 Power supply busbar for circuit board

Country Status (1)

Country Link
JP (1) JPS6052664U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009076320A (en) * 2007-09-20 2009-04-09 Yaskawa Electric Corp Laminated bus bar circuit board manufacturing apparatus and manufacturing method, bus bar manufactured thereby, and power conversion apparatus

Also Published As

Publication number Publication date
JPS6052664U (en) 1985-04-13

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