JPS6466351A - Nonslip blank for building - Google Patents
Nonslip blank for buildingInfo
- Publication number
- JPS6466351A JPS6466351A JP62221879A JP22187987A JPS6466351A JP S6466351 A JPS6466351 A JP S6466351A JP 62221879 A JP62221879 A JP 62221879A JP 22187987 A JP22187987 A JP 22187987A JP S6466351 A JPS6466351 A JP S6466351A
- Authority
- JP
- Japan
- Prior art keywords
- nonslip
- fixed
- metallic sheet
- building
- body part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005452 bending Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000002994 raw material Substances 0.000 abstract 1
Landscapes
- Floor Finish (AREA)
- Steps, Ramps, And Handrails (AREA)
Abstract
PURPOSE: To improve nonslip performance by a method wherein continual nonslip uneven surface parts are formed on the surface part of a soft and sheet- form body part and a metallic sheet is fixed on the back thereof. CONSTITUTION: This raw material used in a building, especially stairs, is formed by bending a metallic sheet material having a horizontal element 21 corresponding to a tread 11 of stairs 1 and a rise surface 12 corresponding to a vertical piece 22. The upper end part of the vertical piece 22 is bent backward, a groove- form lock part 23 is formed at the front end part of the horizontal piece 21, and an engaging part 41 of a body part 4 on which a metallic sheet 5 is stuck is inserted for fixing. After an anchor is buried in the tread 11, the horizontal piece 21 is fixed by a locking element, and a body part 4 is fixed on the horizontal piece for laying. This constitution improves a nonslip function.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62221879A JPS6466351A (en) | 1987-09-07 | 1987-09-07 | Nonslip blank for building |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62221879A JPS6466351A (en) | 1987-09-07 | 1987-09-07 | Nonslip blank for building |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6466351A true JPS6466351A (en) | 1989-03-13 |
| JPH052064B2 JPH052064B2 (en) | 1993-01-11 |
Family
ID=16773614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62221879A Granted JPS6466351A (en) | 1987-09-07 | 1987-09-07 | Nonslip blank for building |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6466351A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02246542A (en) * | 1989-03-20 | 1990-10-02 | Nec Home Electron Ltd | Digital correlator |
| US5777380A (en) * | 1995-03-17 | 1998-07-07 | Seiko Epson Corporation | Resin sealing type semiconductor device having thin portions formed on the leads |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54131313A (en) * | 1978-04-01 | 1979-10-12 | Naka Tech Lab | Nonnslip for building |
| JPS59126858A (en) * | 1983-01-10 | 1984-07-21 | 株式会社ナカ技術研究所 | Anti-slip material and extrusion molding thereof |
-
1987
- 1987-09-07 JP JP62221879A patent/JPS6466351A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54131313A (en) * | 1978-04-01 | 1979-10-12 | Naka Tech Lab | Nonnslip for building |
| JPS59126858A (en) * | 1983-01-10 | 1984-07-21 | 株式会社ナカ技術研究所 | Anti-slip material and extrusion molding thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02246542A (en) * | 1989-03-20 | 1990-10-02 | Nec Home Electron Ltd | Digital correlator |
| US5777380A (en) * | 1995-03-17 | 1998-07-07 | Seiko Epson Corporation | Resin sealing type semiconductor device having thin portions formed on the leads |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH052064B2 (en) | 1993-01-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |