JPS6467840A - Formation of thick film electrode - Google Patents

Formation of thick film electrode

Info

Publication number
JPS6467840A
JPS6467840A JP22299787A JP22299787A JPS6467840A JP S6467840 A JPS6467840 A JP S6467840A JP 22299787 A JP22299787 A JP 22299787A JP 22299787 A JP22299787 A JP 22299787A JP S6467840 A JPS6467840 A JP S6467840A
Authority
JP
Japan
Prior art keywords
thick film
glass substrate
film electrode
baking
conductor paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22299787A
Other languages
Japanese (ja)
Inventor
Masao Ikehata
Yoshitaka Terao
Hideo Sawai
Hiromi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP22299787A priority Critical patent/JPS6467840A/en
Publication of JPS6467840A publication Critical patent/JPS6467840A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To stick the thick film conductor paste firmly to a glass substrate at the maker-recommended baking temperature or lower by forming the surface of the glass substrate into a rough surface by a physical means then printing and baking the thick film conductor paste. CONSTITUTION:The surface of a glass substrate is formed into a rough surface by a physical means, e.g., polishing by a wire brush or sand, and the maximum roughness indicating the difference between the maximum value and the minimum value of the surface roughness in the fixed distance is set to about 7mum, for example. The surface of the glass substrate formed into the rough surface is cleaned by ultrasonic waves or the like to remove the stuck fine powder or the like, and the thick film conductor paste such as nickel is screen-printed. After it is dried for 15min at 150 deg.C, it is baked at the peak temperature of 520 deg.C to form a thick film electrode. The adhesive strength between the glass substrate and the thick film electrode can be thereby improved, and the thick film electrode is prevented from peeling off during the post-processes such as patterning and baking of dielectric paste.
JP22299787A 1987-09-08 1987-09-08 Formation of thick film electrode Pending JPS6467840A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22299787A JPS6467840A (en) 1987-09-08 1987-09-08 Formation of thick film electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22299787A JPS6467840A (en) 1987-09-08 1987-09-08 Formation of thick film electrode

Publications (1)

Publication Number Publication Date
JPS6467840A true JPS6467840A (en) 1989-03-14

Family

ID=16791196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22299787A Pending JPS6467840A (en) 1987-09-08 1987-09-08 Formation of thick film electrode

Country Status (1)

Country Link
JP (1) JPS6467840A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5926075A (en) * 1995-07-19 1999-07-20 Tdk Corporation Antenna switch

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5926075A (en) * 1995-07-19 1999-07-20 Tdk Corporation Antenna switch

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