JPS6468947A - Formation of aluminum wiring - Google Patents

Formation of aluminum wiring

Info

Publication number
JPS6468947A
JPS6468947A JP22741487A JP22741487A JPS6468947A JP S6468947 A JPS6468947 A JP S6468947A JP 22741487 A JP22741487 A JP 22741487A JP 22741487 A JP22741487 A JP 22741487A JP S6468947 A JPS6468947 A JP S6468947A
Authority
JP
Japan
Prior art keywords
aluminum
aluminum wiring
oxide film
film
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22741487A
Other languages
Japanese (ja)
Inventor
Shuichi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP22741487A priority Critical patent/JPS6468947A/en
Publication of JPS6468947A publication Critical patent/JPS6468947A/en
Pending legal-status Critical Current

Links

Landscapes

  • Local Oxidation Of Silicon (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To obtain a semiconductor integrated circuit without the occurrence of any partial deficit of an aluminum wiring. by forming the aluminum wiring of an aluminum layer by using a chemical etching method, thereafter, depositing an insulating film thereon, and imparting shocks to the insulating film by a sputtering method and the like using gas. CONSTITUTION:An oxide film 12 is grown on a silicon substrate 11. An aluminum layer 13 is deposited thereon. The aluminum layer is patterned, and an aluminum wiring 14 is formed. An oxide film 15 is grown by 1mum by a CVD method. Then ion shock is imparted on the oxide film 15 by argon sputtering, and the film is etched away by 0.1mum. Hydrogen ions in the aluminum wiring are discharged out of the aluminum by the shock energy. The ions are further discharged into outer air through the oxide film. When this integrated circuit is sealed with a resin, any partial deficit of the aluminum wiring does not occur at all.
JP22741487A 1987-09-09 1987-09-09 Formation of aluminum wiring Pending JPS6468947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22741487A JPS6468947A (en) 1987-09-09 1987-09-09 Formation of aluminum wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22741487A JPS6468947A (en) 1987-09-09 1987-09-09 Formation of aluminum wiring

Publications (1)

Publication Number Publication Date
JPS6468947A true JPS6468947A (en) 1989-03-15

Family

ID=16860469

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22741487A Pending JPS6468947A (en) 1987-09-09 1987-09-09 Formation of aluminum wiring

Country Status (1)

Country Link
JP (1) JPS6468947A (en)

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