JPS6473082A - Plating paint and plating method using said paint - Google Patents
Plating paint and plating method using said paintInfo
- Publication number
- JPS6473082A JPS6473082A JP23057087A JP23057087A JPS6473082A JP S6473082 A JPS6473082 A JP S6473082A JP 23057087 A JP23057087 A JP 23057087A JP 23057087 A JP23057087 A JP 23057087A JP S6473082 A JPS6473082 A JP S6473082A
- Authority
- JP
- Japan
- Prior art keywords
- metal ions
- metal
- plating
- plated
- paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title abstract 5
- 239000003973 paint Substances 0.000 title abstract 4
- 238000000034 method Methods 0.000 title 1
- 229910021645 metal ion Inorganic materials 0.000 abstract 6
- 239000000463 material Substances 0.000 abstract 5
- 239000003638 chemical reducing agent Substances 0.000 abstract 4
- 239000002184 metal Substances 0.000 abstract 4
- 229910052751 metal Inorganic materials 0.000 abstract 4
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- 239000002904 solvent Substances 0.000 abstract 3
- 150000003839 salts Chemical class 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 abstract 1
- 239000002202 Polyethylene glycol Substances 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 abstract 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 abstract 1
- 239000005018 casein Substances 0.000 abstract 1
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 abstract 1
- 235000021240 caseins Nutrition 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 239000003292 glue Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 abstract 1
- 229920001223 polyethylene glycol Polymers 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 235000002906 tartaric acid Nutrition 0.000 abstract 1
- 239000011975 tartaric acid Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Chemically Coating (AREA)
Abstract
PURPOSE:To execute plating with high positional accuracy on a material to be plated by coating a plating paint consisting metal ions, reducing agent, solvent, and viscosity imparting agent to the material to be plated and depositing the metal near the surface of the material to be plated. CONSTITUTION:The plating paint contg. the metal ions, the reducing agent of the metal ions, the solvent of the metal ions and the viscosity imparting agent is coated on the material to be plated and the metal ions are reduced to the metal by the reducing agent and are deposited near the surface of said material. The inorg. metal salt or complex salt of at least one metal selected from copper, silver, gold, and Ni is used for the metal ions and the concn. thereof is set about 10-30wt.%. One kind selected from phosphite, sulfite and tartaric acid is used for the reducing agent and the concn. thereof is set at about 5-10wt.%. One kind of the group consisting of polyethylene glycol, casein and glue is used for the viscosity imparting agent and the viscosity thereof is set at about 3-4cps. The solvent is an aq. soln. and the pH is about 7-10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23057087A JPS6473082A (en) | 1987-09-14 | 1987-09-14 | Plating paint and plating method using said paint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23057087A JPS6473082A (en) | 1987-09-14 | 1987-09-14 | Plating paint and plating method using said paint |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6473082A true JPS6473082A (en) | 1989-03-17 |
Family
ID=16909823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23057087A Pending JPS6473082A (en) | 1987-09-14 | 1987-09-14 | Plating paint and plating method using said paint |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6473082A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0379100A (en) * | 1989-08-22 | 1991-04-04 | Matsushita Electric Ind Co Ltd | Light transmission paste and precipitating method for metal copper using the same |
| JPH10287980A (en) * | 1997-04-17 | 1998-10-27 | Hitachi Ltd | Method for forming electrode of semiconductor device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54117329A (en) * | 1978-03-06 | 1979-09-12 | Ngk Spark Plug Co | Electroless plating method |
| JPS574704A (en) * | 1980-06-10 | 1982-01-11 | Dantani Plywood Co | Manufacture of artificial figure decorative veneer |
-
1987
- 1987-09-14 JP JP23057087A patent/JPS6473082A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54117329A (en) * | 1978-03-06 | 1979-09-12 | Ngk Spark Plug Co | Electroless plating method |
| JPS574704A (en) * | 1980-06-10 | 1982-01-11 | Dantani Plywood Co | Manufacture of artificial figure decorative veneer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0379100A (en) * | 1989-08-22 | 1991-04-04 | Matsushita Electric Ind Co Ltd | Light transmission paste and precipitating method for metal copper using the same |
| JPH10287980A (en) * | 1997-04-17 | 1998-10-27 | Hitachi Ltd | Method for forming electrode of semiconductor device |
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