JPS6473654A - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
JPS6473654A
JPS6473654A JP62230518A JP23051887A JPS6473654A JP S6473654 A JPS6473654 A JP S6473654A JP 62230518 A JP62230518 A JP 62230518A JP 23051887 A JP23051887 A JP 23051887A JP S6473654 A JPS6473654 A JP S6473654A
Authority
JP
Japan
Prior art keywords
pin
solder
motherboard
hole
plated layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62230518A
Other languages
Japanese (ja)
Other versions
JP2538937B2 (en
Inventor
Atsumi Hirata
Yoshikazu Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP62230518A priority Critical patent/JP2538937B2/en
Publication of JPS6473654A publication Critical patent/JPS6473654A/en
Application granted granted Critical
Publication of JP2538937B2 publication Critical patent/JP2538937B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To execute fixation surely by using a solder by a method wherein a solder-plated layer is formed at an outer periphery of a pin and a recessed part is formed at the outer periphery of the pin at a part which is to be inserted into a motherboard or the like and is connected. CONSTITUTION:Each pin 3 is inserted into a socket, a through hole 15 or the like formed in a motherboard 5 and is soldered. During this process, the tip part of a protruding part 16 for positioning use comes into contact with the surface of the motherboard 5; the pin 3 is inserted into the through hole 15 in a state that it is positioned between a substrate 2 and the motherboard 5; a recessed part 6 is formed at the pin at a part which is to be inserted into the through hole 15 and near the part. Accordingly, when the pin 3 is fixed to the through hole 15 by a solder by making use of a solder-plated layer 4 formed at an outer face of the pin, the pin 3 can be fixed inside the through hole 15 by using a large quantity of solder with the solder-plated layer 4 formed at a thick layer at the recessed part 6; the pin can be fixed to the motherboard 5 surely by using the solder.
JP62230518A 1987-09-14 1987-09-14 Semiconductor package Expired - Lifetime JP2538937B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62230518A JP2538937B2 (en) 1987-09-14 1987-09-14 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62230518A JP2538937B2 (en) 1987-09-14 1987-09-14 Semiconductor package

Publications (2)

Publication Number Publication Date
JPS6473654A true JPS6473654A (en) 1989-03-17
JP2538937B2 JP2538937B2 (en) 1996-10-02

Family

ID=16909004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62230518A Expired - Lifetime JP2538937B2 (en) 1987-09-14 1987-09-14 Semiconductor package

Country Status (1)

Country Link
JP (1) JP2538937B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0362960A (en) * 1989-07-31 1991-03-19 Matsushita Electric Works Ltd Terminal pin for semiconductor chip carrier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0362960A (en) * 1989-07-31 1991-03-19 Matsushita Electric Works Ltd Terminal pin for semiconductor chip carrier

Also Published As

Publication number Publication date
JP2538937B2 (en) 1996-10-02

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