JPS6473794A - Composite circuit substrate - Google Patents

Abstract

PURPOSE:To connect a parent circuit to a child circuit easily and effectively, by allowing the electrode arrangement part of the parent circuit and the electrode arrangement part of the child circuit to be welded with pressure through an anisotropic conductive film. CONSTITUTION:An parent circuit substrate 11 has a circuit pattern 13 on the upper surface of a plate-shaped insulating substrate 12 and a hole 15 is formed on each side of an electrode arrangement part 14 serving as a connection to a child circuit substrate 21 to form a hook part. First, an anisotropic conductive film 31 is disposed on the arrangement part 14 of the parent circuit substrate 11 and a hook part 25 of the child circuit substrate 21 is inserted into the hole 15 of the parent circuit substrate 11. The hook part 25 is not engaged when the electrode arrangement part 14 of the child circuit substrate 21 comes in contact lightly on the anisotropic conductive film 31, but the hook part 25 is engaged with the edge of the hole 15 when the electrode arrangement part 24 is slightly and elastically deformed with the child circuit substrate 21 further pushed downward. Therefore, in this state, the electrode arrangement part 14 of the parent circuit substrate 11 and the electrode arrangement part 24 of the child circuit substrate 21 are welded with pressure through the anisotropic conductive film 31, so that a reliable electric connection state can be obtained.