JPS647539A - Formation of multilayer interconnection - Google Patents
Formation of multilayer interconnectionInfo
- Publication number
- JPS647539A JPS647539A JP62161078A JP16107887A JPS647539A JP S647539 A JPS647539 A JP S647539A JP 62161078 A JP62161078 A JP 62161078A JP 16107887 A JP16107887 A JP 16107887A JP S647539 A JPS647539 A JP S647539A
- Authority
- JP
- Japan
- Prior art keywords
- film
- layers
- apertures
- resist
- interlayer insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To prevent parts of apertures from enlarging by a method wherein a coated glass film on first wiring layers is removed by a spatter etching method and a lift-off method that takes place by removing a resist and the film on the first wiring layers consists of a single-layer film consisting of a second interlayer insulating film only, which is formed by a CVD method or a sputtering method and so on. CONSTITUTION:First wiring layers 23 are formed on an IC substrate 21 and thereafter, a coated glass film 26 is formed as a resist 24 used for forming the layers 23 is left on the layers 23. After that, the film 26 on the layers 23 is completely removed using a spatter etching method and a lift-off method that takes place by removing the resist. After that, a second interlayer insulating film 27 is formed on the flat surfaces of the exposed layers 23 and the flat surface of the residual coated glass film between the wiring layers and apertures 28, which lead to the layers 23, are formed in this film 27. Thereby, the film on the layers 23 becomes a single-layer film consisting of the film 27 and the enlargement of parts of the apertures, which is caused by the difference between the etching rates at the time of formation of the apertures 28 in the interlayer insulating film, can be prevented.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62161078A JPS647539A (en) | 1987-06-30 | 1987-06-30 | Formation of multilayer interconnection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62161078A JPS647539A (en) | 1987-06-30 | 1987-06-30 | Formation of multilayer interconnection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS647539A true JPS647539A (en) | 1989-01-11 |
Family
ID=15728209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62161078A Pending JPS647539A (en) | 1987-06-30 | 1987-06-30 | Formation of multilayer interconnection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS647539A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10361597B2 (en) | 2016-02-17 | 2019-07-23 | Audi Ag | Electric machine for a motor vehicle, coil carrier for an electric machine, and motor vehicle |
-
1987
- 1987-06-30 JP JP62161078A patent/JPS647539A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10361597B2 (en) | 2016-02-17 | 2019-07-23 | Audi Ag | Electric machine for a motor vehicle, coil carrier for an electric machine, and motor vehicle |
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