JPS647550A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS647550A JPS647550A JP62163742A JP16374287A JPS647550A JP S647550 A JPS647550 A JP S647550A JP 62163742 A JP62163742 A JP 62163742A JP 16374287 A JP16374287 A JP 16374287A JP S647550 A JPS647550 A JP S647550A
- Authority
- JP
- Japan
- Prior art keywords
- silicon nitride
- layer
- nitride film
- polycrystalline silicon
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
- H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
- H10D84/209—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only resistors
Landscapes
- Semiconductor Integrated Circuits (AREA)
Abstract
PURPOSE:To realize with stability a high resistance value not to be affected by later processes by a method wherein the entire surface of a polycrystalline silicon layer, except where electrode wiring connections are planned, is covered by a silicon nitride film. CONSTITUTION:An semiconductor device of this design is constituted of an insulating film 2 formed on a semiconductor substrate 1, a first silicon nitride film 3 formed on the insulating film 2, a polycrystalline silicon layer 4 selectively formed on the first silicon nitride film 3, a second silicon nitride film 5 covering the polycrystalline silicon layer 4, and electrode wirings 6 connecting to the polycrystalline silicon layer 4 in an opening selectively formed in the second silicon nitride layer 5. Such silicon nitride films 3 and 5 will be so closely packed as to be suitable for preventing diffusion of impurities from the outside. This design produces a semiconductor device provided with a microstructure resistance layer higher in resistance and stability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62163742A JPS647550A (en) | 1987-06-29 | 1987-06-29 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62163742A JPS647550A (en) | 1987-06-29 | 1987-06-29 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS647550A true JPS647550A (en) | 1989-01-11 |
Family
ID=15779815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62163742A Pending JPS647550A (en) | 1987-06-29 | 1987-06-29 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS647550A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5465005A (en) * | 1991-10-30 | 1995-11-07 | Texas Instruments Incorporated | Polysilicon resistor structure including polysilicon contacts |
| JP2017079254A (en) * | 2015-10-20 | 2017-04-27 | 新日本無線株式会社 | Semiconductor device |
-
1987
- 1987-06-29 JP JP62163742A patent/JPS647550A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5465005A (en) * | 1991-10-30 | 1995-11-07 | Texas Instruments Incorporated | Polysilicon resistor structure including polysilicon contacts |
| US6261915B1 (en) | 1991-10-30 | 2001-07-17 | Texas Instruments Incorporated | Process of making polysilicon resistor |
| JP2017079254A (en) * | 2015-10-20 | 2017-04-27 | 新日本無線株式会社 | Semiconductor device |
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