JPS6475697A - Method for electroplating hot dipped material - Google Patents

Method for electroplating hot dipped material

Info

Publication number
JPS6475697A
JPS6475697A JP23253187A JP23253187A JPS6475697A JP S6475697 A JPS6475697 A JP S6475697A JP 23253187 A JP23253187 A JP 23253187A JP 23253187 A JP23253187 A JP 23253187A JP S6475697 A JPS6475697 A JP S6475697A
Authority
JP
Japan
Prior art keywords
hot dipped
dipped material
electroplated
cells
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23253187A
Other languages
Japanese (ja)
Inventor
Yutaka Ogawa
Fusahiro Sekimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP23253187A priority Critical patent/JPS6475697A/en
Publication of JPS6475697A publication Critical patent/JPS6475697A/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:To prevent the deterioration of the quality of a hot dipped material by etching when one side of the hot dipped material is electroplated, by supplying electric current for cathodic protection to the other side not to be electroplated. CONSTITUTION:When one side of a hot dipped material is electroplated, electric current for cathodic protection is supplied to the other side not to be electroplated to prevent etching in cells and to facilitate the one-side electroplating. In case of electroplating only in part of the cells, electric current for cathodic protection is supplied to both sides of the hot dipped material in the other plating cells to prevent etching in the cells in which electric current for plating is not supplied.
JP23253187A 1987-09-18 1987-09-18 Method for electroplating hot dipped material Pending JPS6475697A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23253187A JPS6475697A (en) 1987-09-18 1987-09-18 Method for electroplating hot dipped material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23253187A JPS6475697A (en) 1987-09-18 1987-09-18 Method for electroplating hot dipped material

Publications (1)

Publication Number Publication Date
JPS6475697A true JPS6475697A (en) 1989-03-22

Family

ID=16940798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23253187A Pending JPS6475697A (en) 1987-09-18 1987-09-18 Method for electroplating hot dipped material

Country Status (1)

Country Link
JP (1) JPS6475697A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020250650A1 (en) * 2019-06-14 2020-12-17 株式会社荏原製作所 Plating method, plating device, and non-volatile storage medium in which program is stored

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020250650A1 (en) * 2019-06-14 2020-12-17 株式会社荏原製作所 Plating method, plating device, and non-volatile storage medium in which program is stored
JP2020204061A (en) * 2019-06-14 2020-12-24 株式会社荏原製作所 Plating method, plating device, and nonvolatile memory medium that memorizes program
US11542629B2 (en) 2019-06-14 2023-01-03 Ebara Corporation Method of plating, apparatus for plating, and non-volatile storage medium that stores program

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