JPS5792191A - Partial plating method - Google Patents

Partial plating method

Info

Publication number
JPS5792191A
JPS5792191A JP16840880A JP16840880A JPS5792191A JP S5792191 A JPS5792191 A JP S5792191A JP 16840880 A JP16840880 A JP 16840880A JP 16840880 A JP16840880 A JP 16840880A JP S5792191 A JPS5792191 A JP S5792191A
Authority
JP
Japan
Prior art keywords
plating
soln
parts
plated
anodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16840880A
Other languages
Japanese (ja)
Inventor
Tomio Terada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP16840880A priority Critical patent/JPS5792191A/en
Publication of JPS5792191A publication Critical patent/JPS5792191A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To enable correct partial plating without using a cover jig by coating the specified parts of a material to be plated with a plating soln. thickened to a viscous state and immersing anodes in the plating soln. to plate only the specified parts.
CONSTITUTION: A material 11 to be plated is horizontally placed on a stationary jig 10, and the required surface parts of the material 11 are coated with a fixed quantity of a plating soln. 12 thickened to a viscous state. The soln. 12 protrudes almost semispherically by the surface tension and sticks to the surface of the material 11. Plating electrodes 13 are then put in the soln. 12 at the central parts, the material 11 as a cathode and the electrodes 13 as anodes are connected to a DC power source 14, and an electric current is supplied to carry out necessary plating. Thus, the required parts of the material 11 can be plated partially.
COPYRIGHT: (C)1982,JPO&Japio
JP16840880A 1980-11-29 1980-11-29 Partial plating method Pending JPS5792191A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16840880A JPS5792191A (en) 1980-11-29 1980-11-29 Partial plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16840880A JPS5792191A (en) 1980-11-29 1980-11-29 Partial plating method

Publications (1)

Publication Number Publication Date
JPS5792191A true JPS5792191A (en) 1982-06-08

Family

ID=15867561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16840880A Pending JPS5792191A (en) 1980-11-29 1980-11-29 Partial plating method

Country Status (1)

Country Link
JP (1) JPS5792191A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61276993A (en) * 1985-05-31 1986-12-06 Electroplating Eng Of Japan Co Viscous plating liquid and plating method thereof
JPWO2021157504A1 (en) * 2020-02-06 2021-08-12

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61276993A (en) * 1985-05-31 1986-12-06 Electroplating Eng Of Japan Co Viscous plating liquid and plating method thereof
JPWO2021157504A1 (en) * 2020-02-06 2021-08-12
WO2021157504A1 (en) * 2020-02-06 2021-08-12 東京エレクトロン株式会社 Plating method and plating device

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