JPS6477190A - Manufacture of semiconductor laser device - Google Patents

Manufacture of semiconductor laser device

Info

Publication number
JPS6477190A
JPS6477190A JP19546888A JP19546888A JPS6477190A JP S6477190 A JPS6477190 A JP S6477190A JP 19546888 A JP19546888 A JP 19546888A JP 19546888 A JP19546888 A JP 19546888A JP S6477190 A JPS6477190 A JP S6477190A
Authority
JP
Japan
Prior art keywords
type
layer
stripe
groove section
clad layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19546888A
Other languages
Japanese (ja)
Other versions
JPH0542150B2 (en
Inventor
Naoto Mogi
Yukio Watanabe
Naohiro Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP19546888A priority Critical patent/JPS6477190A/en
Publication of JPS6477190A publication Critical patent/JPS6477190A/en
Publication of JPH0542150B2 publication Critical patent/JPH0542150B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To reduce the reactive current flowing through an active layer on both sides of a stripe-shape groove section, by forming a conversion layer of P-type in a clad layer of N-type. CONSTITUTION:A photoresist 21 is coated on a current blocking layer 15 and a stripe-shaped opening is then formed in the photoresist 21. Subsequently, the current blocking layer 15 is selectively etched using the resist 21 as a mask to form a stripe shaped groove section 22. Next, after the resist 21 is removed, prior to the second crystal growth, heat treatment is performed at high temperature in the As pressurized atmosphere. Therefore, impurities of P-type contained in a clad layer 14 of P-type are diffused into a clad layer 12 of N-type. As a result, the part of the clad layer 12 of N-type which is in contact with an active layer 1, except the part thereof under the stripe-shaped groove section 22, is converted the conductivity type thereof from N-type to P-type so that a ccnversion layer 19 of P-type is formed by self-aligning. Accordingly, the reactive current flowing through the outside of the stripe-shaped luminous region can be sufficiently reduced, and the semiconductor laser device with a low threshold value can be produced.
JP19546888A 1988-08-05 1988-08-05 Manufacture of semiconductor laser device Granted JPS6477190A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19546888A JPS6477190A (en) 1988-08-05 1988-08-05 Manufacture of semiconductor laser device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19546888A JPS6477190A (en) 1988-08-05 1988-08-05 Manufacture of semiconductor laser device

Publications (2)

Publication Number Publication Date
JPS6477190A true JPS6477190A (en) 1989-03-23
JPH0542150B2 JPH0542150B2 (en) 1993-06-25

Family

ID=16341582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19546888A Granted JPS6477190A (en) 1988-08-05 1988-08-05 Manufacture of semiconductor laser device

Country Status (1)

Country Link
JP (1) JPS6477190A (en)

Also Published As

Publication number Publication date
JPH0542150B2 (en) 1993-06-25

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