JPS6477507A - Slicing device for semiconductor substrate - Google Patents

Slicing device for semiconductor substrate

Info

Publication number
JPS6477507A
JPS6477507A JP23435387A JP23435387A JPS6477507A JP S6477507 A JPS6477507 A JP S6477507A JP 23435387 A JP23435387 A JP 23435387A JP 23435387 A JP23435387 A JP 23435387A JP S6477507 A JPS6477507 A JP S6477507A
Authority
JP
Japan
Prior art keywords
substrate
semiconductor substrate
base
edge part
principal plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23435387A
Other languages
Japanese (ja)
Inventor
Yoshisato Hosoki
Masanobu Ogino
Yoshinori Natsume
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP23435387A priority Critical patent/JPS6477507A/en
Publication of JPS6477507A publication Critical patent/JPS6477507A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/005—Cutting sheet laminae in planes between faces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To make it possible to cut off and divide a flat plate semiconductor substrate parallel to the principal plane of the substrate by a method wherein a semiconductor substrate holding mechanism, which holds the substrate by abutting against the principal plane of the flat plate semiconductor substrate and at the same time the abutting surface of which is arranged so as to be parallel to the surface of revolution of an ID slicing saw blade, is provided. CONSTITUTION:An ID slicing saw blade 22 consists of an annular base 22 and a cutting edge part 23, which is provided at the inner peripheral edge part of the base 22. The outer peripheral edge part of the base 22 is fixed to the upper end of a rotor 24 so as to dispose the base 22 horizontally under tension by means of bolts 24a. The holding mechanism of a flat plate semiconductor substrate 26 consists of a first and second vacuum chucks 20a and 20b. After the first principal plane of the semiconductor substrate 26 is sucked by vacuum by being seated onto the abutting surface 20c of the first vacuum chuck 20a, the second principal plane of the substrate 26 is held by suction by being pushed by the shucking surface of the second vacuum chuck 20b. Next, the tip of the cutting edge part 23 of the slicing saw blade is set to locate at the middle of the thickness of the substrate 26. Next, by translating the substrate 26 in parallel to the rotating base 22 by means of a feeding mechanism 21, the substrate 26 is bisected vertically, resulting in obtaining two sheets of semiconductor substrate having nearly the same thickness.
JP23435387A 1987-09-18 1987-09-18 Slicing device for semiconductor substrate Pending JPS6477507A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23435387A JPS6477507A (en) 1987-09-18 1987-09-18 Slicing device for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23435387A JPS6477507A (en) 1987-09-18 1987-09-18 Slicing device for semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS6477507A true JPS6477507A (en) 1989-03-23

Family

ID=16969671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23435387A Pending JPS6477507A (en) 1987-09-18 1987-09-18 Slicing device for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS6477507A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0339203A (en) * 1989-07-06 1991-02-20 Tokyo Seimitsu Co Ltd Cutting method for cylindrical material and its cutting device
WO2010109141A1 (en) * 2009-03-27 2010-09-30 Jean-Pierre Medina Method and machine for producing a semiconductor, of the photovoltaic cell type, or a similar electronic component
US20140053382A1 (en) * 2012-08-23 2014-02-27 Michael Xiaoxuan Yang Methods and apparatus for separating a substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5945104A (en) * 1982-09-09 1984-03-13 株式会社東芝 Cutter for hard and brittle member

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5945104A (en) * 1982-09-09 1984-03-13 株式会社東芝 Cutter for hard and brittle member

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0339203A (en) * 1989-07-06 1991-02-20 Tokyo Seimitsu Co Ltd Cutting method for cylindrical material and its cutting device
WO2010109141A1 (en) * 2009-03-27 2010-09-30 Jean-Pierre Medina Method and machine for producing a semiconductor, of the photovoltaic cell type, or a similar electronic component
US20140053382A1 (en) * 2012-08-23 2014-02-27 Michael Xiaoxuan Yang Methods and apparatus for separating a substrate
CN104813447A (en) * 2012-08-23 2015-07-29 麦克·晓晅·杨 Method and apparatus for separating substrates and processing components
US9190294B2 (en) * 2012-08-23 2015-11-17 Michael Xiaoxuan Yang Methods and apparatus for separating a substrate
CN104813447B (en) * 2012-08-23 2017-06-27 麦克·晓晅·杨 Method and apparatus for separating substrates and processing components

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