JPS64793A - Manufacture of circuit device - Google Patents

Manufacture of circuit device

Info

Publication number
JPS64793A
JPS64793A JP63009128A JP912888A JPS64793A JP S64793 A JPS64793 A JP S64793A JP 63009128 A JP63009128 A JP 63009128A JP 912888 A JP912888 A JP 912888A JP S64793 A JPS64793 A JP S64793A
Authority
JP
Japan
Prior art keywords
bonding
spacing
region
determined
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63009128A
Other languages
English (en)
Other versions
JPH01793A (ja
JPH0524679B2 (ja
Inventor
Takao Ushikubo
Yoichi Otsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP63009128A priority Critical patent/JPS64793A/ja
Publication of JPH01793A publication Critical patent/JPH01793A/ja
Publication of JPS64793A publication Critical patent/JPS64793A/ja
Publication of JPH0524679B2 publication Critical patent/JPH0524679B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP63009128A 1987-02-09 1988-01-18 Manufacture of circuit device Granted JPS64793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63009128A JPS64793A (en) 1987-02-09 1988-01-18 Manufacture of circuit device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62-28466 1987-02-09
JP2846687 1987-02-09
JP63009128A JPS64793A (en) 1987-02-09 1988-01-18 Manufacture of circuit device

Publications (3)

Publication Number Publication Date
JPH01793A JPH01793A (ja) 1989-01-05
JPS64793A true JPS64793A (en) 1989-01-05
JPH0524679B2 JPH0524679B2 (ja) 1993-04-08

Family

ID=26343788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63009128A Granted JPS64793A (en) 1987-02-09 1988-01-18 Manufacture of circuit device

Country Status (1)

Country Link
JP (1) JPS64793A (ja)

Also Published As

Publication number Publication date
JPH0524679B2 (ja) 1993-04-08

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees