JPS6480097A - Manufacture of printed wiring board - Google Patents

Manufacture of printed wiring board

Info

Publication number
JPS6480097A
JPS6480097A JP23673387A JP23673387A JPS6480097A JP S6480097 A JPS6480097 A JP S6480097A JP 23673387 A JP23673387 A JP 23673387A JP 23673387 A JP23673387 A JP 23673387A JP S6480097 A JPS6480097 A JP S6480097A
Authority
JP
Japan
Prior art keywords
resist film
hole
film
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23673387A
Other languages
Japanese (ja)
Inventor
Tasuku Fujii
Akihiko Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP23673387A priority Critical patent/JPS6480097A/en
Publication of JPS6480097A publication Critical patent/JPS6480097A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

PURPOSE:To enable the formation of a etching resist film inside even a small through-hole so as to improve a through-hole in reliability by a method wherein a non-photosensitive etching resist film is previously formed inside the through- hole. CONSTITUTION:A non-photosensitive etching resist film 6 is formed on a copper plating 5. The film 6 on the surface of a substrate 1 is made to be peeled off by a buff or the like. A photosensistive etching resist film 7 is made to adhere to only the surface of the substrate 1. The resist film 7 is made not to adhere to the inside of a through-hole 4, since a current is not able to flow through the through-hole 6 because of the film 6 formed inside it. The resist film 7 on which a circuit pattern is printed is made to be exposed to light rays, and the film 7 is made to set. The part of the copper plating 5 other than the part to which the resist film 7 adheres is subjected to etching to form a circuit pattern. The resist film 7 and the film 6 are successively removed so as to obtain a printed wiring board. By these processes, a through-hole can be improved in reliability.
JP23673387A 1987-09-21 1987-09-21 Manufacture of printed wiring board Pending JPS6480097A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23673387A JPS6480097A (en) 1987-09-21 1987-09-21 Manufacture of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23673387A JPS6480097A (en) 1987-09-21 1987-09-21 Manufacture of printed wiring board

Publications (1)

Publication Number Publication Date
JPS6480097A true JPS6480097A (en) 1989-03-24

Family

ID=17004983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23673387A Pending JPS6480097A (en) 1987-09-21 1987-09-21 Manufacture of printed wiring board

Country Status (1)

Country Link
JP (1) JPS6480097A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0599121A1 (en) * 1992-11-23 1994-06-01 Siemens Nixdorf Informationssysteme Aktiengesellschaft Process for producing plated through-hole printed circuit boards having very small solder lands or no solder lands

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0599121A1 (en) * 1992-11-23 1994-06-01 Siemens Nixdorf Informationssysteme Aktiengesellschaft Process for producing plated through-hole printed circuit boards having very small solder lands or no solder lands

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