JPS6480596A - Vessel for incorporating ic of ic card - Google Patents

Vessel for incorporating ic of ic card

Info

Publication number
JPS6480596A
JPS6480596A JP62239665A JP23966587A JPS6480596A JP S6480596 A JPS6480596 A JP S6480596A JP 62239665 A JP62239665 A JP 62239665A JP 23966587 A JP23966587 A JP 23966587A JP S6480596 A JPS6480596 A JP S6480596A
Authority
JP
Japan
Prior art keywords
stair boards
card
ridge
productivity
assembled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62239665A
Other languages
Japanese (ja)
Inventor
Takeshi Masui
Chihiro Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP62239665A priority Critical patent/JPS6480596A/en
Publication of JPS6480596A publication Critical patent/JPS6480596A/en
Pending legal-status Critical Current

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  • Credit Cards Or The Like (AREA)

Abstract

PURPOSE: To improve the productivity by a method wherein a pair of stair boards whose thickness of both plastic fabricated edges is greater than that of the central section are assembled at right angle direction and the entire part of ridge-line section is connected, the inner part thereof being formed into a hollow rectangular parallelepiped. CONSTITUTION: A pair of sectional rectangular stair boards 11 and 12 whose thickness T2 and T4 of both edges are greater than thickness T1 and T3 of the central section are formed by a plastic fabrication method considering the functions required for manufacture of IC card such as bending, rigidity against impingement, punching and welding characteristics, etc. Thereafter, both stair boards 11 and 12 are assembled at right angle direction and the entire part of a ridge-line section 13 is connected by welding which results in making a hollow rectangular parallelepiped to form IC container 10. High yield rate and productivity can be obtained by this method.
JP62239665A 1987-09-24 1987-09-24 Vessel for incorporating ic of ic card Pending JPS6480596A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62239665A JPS6480596A (en) 1987-09-24 1987-09-24 Vessel for incorporating ic of ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62239665A JPS6480596A (en) 1987-09-24 1987-09-24 Vessel for incorporating ic of ic card

Publications (1)

Publication Number Publication Date
JPS6480596A true JPS6480596A (en) 1989-03-27

Family

ID=17048082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62239665A Pending JPS6480596A (en) 1987-09-24 1987-09-24 Vessel for incorporating ic of ic card

Country Status (1)

Country Link
JP (1) JPS6480596A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH039893A (en) * 1989-06-07 1991-01-17 Ibiden Co Ltd Printed wiring board for ic card
JP2005116762A (en) * 2003-10-07 2005-04-28 Fujitsu Ltd Semiconductor device protection method, semiconductor device cover, semiconductor device unit, and semiconductor device packaging structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH039893A (en) * 1989-06-07 1991-01-17 Ibiden Co Ltd Printed wiring board for ic card
JP2005116762A (en) * 2003-10-07 2005-04-28 Fujitsu Ltd Semiconductor device protection method, semiconductor device cover, semiconductor device unit, and semiconductor device packaging structure
US8164181B2 (en) 2003-10-07 2012-04-24 Fujitsu Semiconductor Limited Semiconductor device packaging structure
US8268670B2 (en) 2003-10-07 2012-09-18 Fujitsu Semiconductor Limited Method of semiconductor device protection

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