JPS64815B2 - - Google Patents

Info

Publication number
JPS64815B2
JPS64815B2 JP58224307A JP22430783A JPS64815B2 JP S64815 B2 JPS64815 B2 JP S64815B2 JP 58224307 A JP58224307 A JP 58224307A JP 22430783 A JP22430783 A JP 22430783A JP S64815 B2 JPS64815 B2 JP S64815B2
Authority
JP
Japan
Prior art keywords
heat
solid
liquid
circuit components
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58224307A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60117647A (ja
Inventor
Toshuki Saito
Hisafumi Ookubo
Yoshiaki Kaneko
Yasuyuki Tokumitsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58224307A priority Critical patent/JPS60117647A/ja
Priority to CA000468677A priority patent/CA1230184A/fr
Priority to DE8484114439T priority patent/DE3482527D1/de
Priority to EP84114439A priority patent/EP0144071B1/fr
Publication of JPS60117647A publication Critical patent/JPS60117647A/ja
Priority to US07/088,520 priority patent/US4796155A/en
Publication of JPS64815B2 publication Critical patent/JPS64815B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/30—Arrangements for thermal protection or thermal control wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
    • H10W40/305—Arrangements for thermal protection or thermal control wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid the fluid being a liquefied gas, e.g. liquid nitrogen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58224307A 1983-11-29 1983-11-30 液冷型高周波固体装置 Granted JPS60117647A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP58224307A JPS60117647A (ja) 1983-11-30 1983-11-30 液冷型高周波固体装置
CA000468677A CA1230184A (fr) 1983-11-29 1984-11-27 Dispositif a semiconducteur haute frequence a refroidissement par un liquide
DE8484114439T DE3482527D1 (de) 1983-11-29 1984-11-29 Vorrichtung vom typ fluessigkeitskuehlung einer hochfrequenz-festkoerperanordnung.
EP84114439A EP0144071B1 (fr) 1983-11-29 1984-11-29 Arrangement du type refroidissement par liquide d'un dispositif à état solide à haute fréquence
US07/088,520 US4796155A (en) 1983-11-29 1987-08-20 Liquid cooling type high frequency solid state device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58224307A JPS60117647A (ja) 1983-11-30 1983-11-30 液冷型高周波固体装置

Publications (2)

Publication Number Publication Date
JPS60117647A JPS60117647A (ja) 1985-06-25
JPS64815B2 true JPS64815B2 (fr) 1989-01-09

Family

ID=16811709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58224307A Granted JPS60117647A (ja) 1983-11-29 1983-11-30 液冷型高周波固体装置

Country Status (1)

Country Link
JP (1) JPS60117647A (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022179901A (ja) * 2021-05-24 2022-12-06 株式会社オートネットワーク技術研究所 電気機器

Also Published As

Publication number Publication date
JPS60117647A (ja) 1985-06-25

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