JPS648630A - Cleaning method - Google Patents

Cleaning method

Info

Publication number
JPS648630A
JPS648630A JP16474187A JP16474187A JPS648630A JP S648630 A JPS648630 A JP S648630A JP 16474187 A JP16474187 A JP 16474187A JP 16474187 A JP16474187 A JP 16474187A JP S648630 A JPS648630 A JP S648630A
Authority
JP
Japan
Prior art keywords
chamber
ozone
tank
matter
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16474187A
Other languages
Japanese (ja)
Inventor
Yutaka Amamiya
Shunichi Iimuro
Nobuo Konishi
Yoichi Kurono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP16474187A priority Critical patent/JPS648630A/en
Publication of JPS648630A publication Critical patent/JPS648630A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To prevent a static electricity from generating due to a collision when cleaning fluid is injected to a matter to be cleaned or a friction of air by dissolving ozone in water, and cleaning the matter to perform oxidative destruction of organic materials, on the matter to be cleaned. CONSTITUTION:An upper chamber 1 is raised, a semiconductor wafer 11 is conveyed into a cleaning chamber, supported fixedly on an induction motor 10, and the chamber 1 is moved down to be connected to a lower chamber 2. The chamber is sealed in this state. Then, pure water is introduced by a pure water inlet tube 5 into a bubbler tank 4, ozone is introduced by an ozone inlet tube 6 which is arrived at the bottom of the tank 4 through the upper face of the tank 4, bubbled in the tank 4 to dissolve the ozone in the water. Cleaning fluid formed by the dissolving is injected through a supply tube by a high pressure pump 7 from a high pressure nozzle 3 provided at the center of the upper face of the chamber 1 on a semiconductor wafer 11 which is, for example, rotated at 1000rpm by the motor 10. Thus, organic materials on the wafer 11 is subjected to oxidative destruction.
JP16474187A 1986-09-22 1987-06-30 Cleaning method Pending JPS648630A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16474187A JPS648630A (en) 1986-09-22 1987-06-30 Cleaning method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22460886 1986-09-22
JP16474187A JPS648630A (en) 1986-09-22 1987-06-30 Cleaning method

Publications (1)

Publication Number Publication Date
JPS648630A true JPS648630A (en) 1989-01-12

Family

ID=26489735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16474187A Pending JPS648630A (en) 1986-09-22 1987-06-30 Cleaning method

Country Status (1)

Country Link
JP (1) JPS648630A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0341729A (en) * 1989-07-07 1991-02-22 Tokyo Electron Ltd Substrate cleaning
WO1992006489A1 (en) * 1990-10-09 1992-04-16 Chlorine Engineers Corp., Ltd. Method of removing organic coating
WO1992022087A1 (en) * 1991-05-31 1992-12-10 Tadahiro Ohmi Method for cleaning and apparatus thereof
EP0548596A3 (en) * 1991-11-29 1994-08-17 Chlorine Eng Corp Ltd Method and apparatus for cleaning substrate
US5378317A (en) * 1990-10-09 1995-01-03 Chlorine Engineers Corp., Ltd. Method for removing organic film
US6277203B1 (en) 1998-09-29 2001-08-21 Lam Research Corporation Method and apparatus for cleaning low K dielectric and metal wafer surfaces
US6325081B1 (en) * 1996-07-03 2001-12-04 Kabushiki Kaisha Ultraclean Technology Research Institute Washing apparatus and washing method
US6817370B2 (en) 1997-05-09 2004-11-16 Semitool, Inc. Method for processing the surface of a workpiece
US6837252B2 (en) 1997-05-09 2005-01-04 Semitool, Inc. Apparatus for treating a workpiece with steam and ozone
EP2202782A3 (en) * 2008-12-25 2010-10-06 Siltronic AG Micro-Bubble generating device
CN107081569A (en) * 2017-03-27 2017-08-22 宁波工程学院 Precision component jet light adorns device and method

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0341729A (en) * 1989-07-07 1991-02-22 Tokyo Electron Ltd Substrate cleaning
WO1992006489A1 (en) * 1990-10-09 1992-04-16 Chlorine Engineers Corp., Ltd. Method of removing organic coating
US5378317A (en) * 1990-10-09 1995-01-03 Chlorine Engineers Corp., Ltd. Method for removing organic film
WO1992022087A1 (en) * 1991-05-31 1992-12-10 Tadahiro Ohmi Method for cleaning and apparatus thereof
EP0548596A3 (en) * 1991-11-29 1994-08-17 Chlorine Eng Corp Ltd Method and apparatus for cleaning substrate
US6325081B1 (en) * 1996-07-03 2001-12-04 Kabushiki Kaisha Ultraclean Technology Research Institute Washing apparatus and washing method
US6837252B2 (en) 1997-05-09 2005-01-04 Semitool, Inc. Apparatus for treating a workpiece with steam and ozone
US6817370B2 (en) 1997-05-09 2004-11-16 Semitool, Inc. Method for processing the surface of a workpiece
US6319330B1 (en) 1998-09-29 2001-11-20 Lam Research Corporation Method and apparatus for cleaning low K dielectric and metal wafer surfaces
US6277203B1 (en) 1998-09-29 2001-08-21 Lam Research Corporation Method and apparatus for cleaning low K dielectric and metal wafer surfaces
EP2202782A3 (en) * 2008-12-25 2010-10-06 Siltronic AG Micro-Bubble generating device
US8408221B2 (en) 2008-12-25 2013-04-02 Siltronic Ag Micro bubble generating device and silicon wafer cleaning apparatus
CN107081569A (en) * 2017-03-27 2017-08-22 宁波工程学院 Precision component jet light adorns device and method

Similar Documents

Publication Publication Date Title
JPS648630A (en) Cleaning method
KR101720500B1 (en) Cleaning method
KR930011129A (en) Substrate Processing Method and Processing Equipment
EP0431190A1 (en) Fluid treater and method of stopping the same
US7216656B2 (en) Semiconductor substrate cleansing apparatus
US6045621A (en) Method for cleaning objects using a fluid charge
JPS57201016A (en) Cleaning method for semiconductor manufacturing apparatus
JP4347426B2 (en) Cleaning processing equipment
JPS5176667A (en)
JPS6481230A (en) Treatment device
JPH057799A (en) Pressure levitation separation method
JPS57204132A (en) Washing method for silicon wafer
JPH029124A (en) Washing device for semiconductor substrate with water
JP2503763B2 (en) Fluid treatment device and method for stopping the same
JPH03139832A (en) Jet scrubber
JPH0458527A (en) Cleaning method
KR970052674A (en) Wafer cleaning device
JPS54124681A (en) Production of resin seal type semiconductor device
RU2058201C1 (en) Method and machine for washing reversible packing material
KR0128244Y1 (en) Semiconductor Wafer Cleaning Equipment
WO2000024687A1 (en) Method and apparatus for cleaning objects using dilute ammonium bearing solutions
JPS57159027A (en) Wafer cleaning device
KR930011126A (en) Semiconductor Substrate Surface Cleaner
JPS6463085A (en) Cleaning method and apparatus
KR860002026Y1 (en) Oxygen generator