JPS648630A - Cleaning method - Google Patents
Cleaning methodInfo
- Publication number
- JPS648630A JPS648630A JP16474187A JP16474187A JPS648630A JP S648630 A JPS648630 A JP S648630A JP 16474187 A JP16474187 A JP 16474187A JP 16474187 A JP16474187 A JP 16474187A JP S648630 A JPS648630 A JP S648630A
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- ozone
- tank
- matter
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title abstract 5
- 238000000034 method Methods 0.000 title 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 abstract 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 4
- 230000006378 damage Effects 0.000 abstract 2
- 239000012530 fluid Substances 0.000 abstract 2
- 239000011368 organic material Substances 0.000 abstract 2
- 230000001590 oxidative effect Effects 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 230000005611 electricity Effects 0.000 abstract 1
- 230000006698 induction Effects 0.000 abstract 1
- 230000003068 static effect Effects 0.000 abstract 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
PURPOSE:To prevent a static electricity from generating due to a collision when cleaning fluid is injected to a matter to be cleaned or a friction of air by dissolving ozone in water, and cleaning the matter to perform oxidative destruction of organic materials, on the matter to be cleaned. CONSTITUTION:An upper chamber 1 is raised, a semiconductor wafer 11 is conveyed into a cleaning chamber, supported fixedly on an induction motor 10, and the chamber 1 is moved down to be connected to a lower chamber 2. The chamber is sealed in this state. Then, pure water is introduced by a pure water inlet tube 5 into a bubbler tank 4, ozone is introduced by an ozone inlet tube 6 which is arrived at the bottom of the tank 4 through the upper face of the tank 4, bubbled in the tank 4 to dissolve the ozone in the water. Cleaning fluid formed by the dissolving is injected through a supply tube by a high pressure pump 7 from a high pressure nozzle 3 provided at the center of the upper face of the chamber 1 on a semiconductor wafer 11 which is, for example, rotated at 1000rpm by the motor 10. Thus, organic materials on the wafer 11 is subjected to oxidative destruction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16474187A JPS648630A (en) | 1986-09-22 | 1987-06-30 | Cleaning method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22460886 | 1986-09-22 | ||
| JP16474187A JPS648630A (en) | 1986-09-22 | 1987-06-30 | Cleaning method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS648630A true JPS648630A (en) | 1989-01-12 |
Family
ID=26489735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16474187A Pending JPS648630A (en) | 1986-09-22 | 1987-06-30 | Cleaning method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS648630A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0341729A (en) * | 1989-07-07 | 1991-02-22 | Tokyo Electron Ltd | Substrate cleaning |
| WO1992006489A1 (en) * | 1990-10-09 | 1992-04-16 | Chlorine Engineers Corp., Ltd. | Method of removing organic coating |
| WO1992022087A1 (en) * | 1991-05-31 | 1992-12-10 | Tadahiro Ohmi | Method for cleaning and apparatus thereof |
| EP0548596A3 (en) * | 1991-11-29 | 1994-08-17 | Chlorine Eng Corp Ltd | Method and apparatus for cleaning substrate |
| US5378317A (en) * | 1990-10-09 | 1995-01-03 | Chlorine Engineers Corp., Ltd. | Method for removing organic film |
| US6277203B1 (en) | 1998-09-29 | 2001-08-21 | Lam Research Corporation | Method and apparatus for cleaning low K dielectric and metal wafer surfaces |
| US6325081B1 (en) * | 1996-07-03 | 2001-12-04 | Kabushiki Kaisha Ultraclean Technology Research Institute | Washing apparatus and washing method |
| US6817370B2 (en) | 1997-05-09 | 2004-11-16 | Semitool, Inc. | Method for processing the surface of a workpiece |
| US6837252B2 (en) | 1997-05-09 | 2005-01-04 | Semitool, Inc. | Apparatus for treating a workpiece with steam and ozone |
| EP2202782A3 (en) * | 2008-12-25 | 2010-10-06 | Siltronic AG | Micro-Bubble generating device |
| CN107081569A (en) * | 2017-03-27 | 2017-08-22 | 宁波工程学院 | Precision component jet light adorns device and method |
-
1987
- 1987-06-30 JP JP16474187A patent/JPS648630A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0341729A (en) * | 1989-07-07 | 1991-02-22 | Tokyo Electron Ltd | Substrate cleaning |
| WO1992006489A1 (en) * | 1990-10-09 | 1992-04-16 | Chlorine Engineers Corp., Ltd. | Method of removing organic coating |
| US5378317A (en) * | 1990-10-09 | 1995-01-03 | Chlorine Engineers Corp., Ltd. | Method for removing organic film |
| WO1992022087A1 (en) * | 1991-05-31 | 1992-12-10 | Tadahiro Ohmi | Method for cleaning and apparatus thereof |
| EP0548596A3 (en) * | 1991-11-29 | 1994-08-17 | Chlorine Eng Corp Ltd | Method and apparatus for cleaning substrate |
| US6325081B1 (en) * | 1996-07-03 | 2001-12-04 | Kabushiki Kaisha Ultraclean Technology Research Institute | Washing apparatus and washing method |
| US6837252B2 (en) | 1997-05-09 | 2005-01-04 | Semitool, Inc. | Apparatus for treating a workpiece with steam and ozone |
| US6817370B2 (en) | 1997-05-09 | 2004-11-16 | Semitool, Inc. | Method for processing the surface of a workpiece |
| US6319330B1 (en) | 1998-09-29 | 2001-11-20 | Lam Research Corporation | Method and apparatus for cleaning low K dielectric and metal wafer surfaces |
| US6277203B1 (en) | 1998-09-29 | 2001-08-21 | Lam Research Corporation | Method and apparatus for cleaning low K dielectric and metal wafer surfaces |
| EP2202782A3 (en) * | 2008-12-25 | 2010-10-06 | Siltronic AG | Micro-Bubble generating device |
| US8408221B2 (en) | 2008-12-25 | 2013-04-02 | Siltronic Ag | Micro bubble generating device and silicon wafer cleaning apparatus |
| CN107081569A (en) * | 2017-03-27 | 2017-08-22 | 宁波工程学院 | Precision component jet light adorns device and method |
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