JPS6486520A - Exposure method - Google Patents

Abstract

PURPOSE:To prevent the formation of a resist film in the outer circumferential end section of a substrate, and to obviate the generation of defects by a mechanical shock by applying a resist onto the whole surface of a wafer, exposing the specified width of the outer circumferential end including an orientation flat section of the wafer and developing a region including at least the exposed part of outer circumferential end-section of the wafer. CONSTITUTION:A substrate 3 is fixed to a substrate fixing plate 4, and 3 resist solution is dropped from a nozzle 5. The substrate 3 is turned by a shaft 2, and the resist solution is spread onto the surface of the substrate 3 by centrifugal force. Light from a light source 11 is introduced to an optical fiber 10 while the substrate 3 is rotated and a resist film at the outer circumferential end section of the substrate 3 is exposed, and a developer is discharged from a nozzle 12 while the substrate 3 is revolved and the resist film at the outer circumferential end section of the exposed substrate is developed. Accordingly, even when a mechanical shock is applied to the outer circumferential end section of the substrate as gripping by forceps of the outer circumferential end section after pre-baking in the substrate, on which a resist is applied with the exception of the outer circumferential end section, no trouble such as the breaking and granulation of the resist film is generated.