JPS6486541A - Heat-conductive module - Google Patents

Heat-conductive module

Info

Publication number
JPS6486541A
JPS6486541A JP62267654A JP26765487A JPS6486541A JP S6486541 A JPS6486541 A JP S6486541A JP 62267654 A JP62267654 A JP 62267654A JP 26765487 A JP26765487 A JP 26765487A JP S6486541 A JPS6486541 A JP S6486541A
Authority
JP
Japan
Prior art keywords
piston
end surface
exposed end
electric elements
grease
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62267654A
Other languages
Japanese (ja)
Inventor
Hoon Deebuido
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balfour Beatty PLC
Original Assignee
BICC PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BICC PLC filed Critical BICC PLC
Publication of JPS6486541A publication Critical patent/JPS6486541A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/242—Arrangements for cooling characterised by their places of attachment or cooling paths comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To provide effective thermal contact between an electric element and an exposed end surface of a piston, by causing the piston to be pushed against the action of a spring device combined with the piston, extruding a grease-like medium to the exposed end surface of the piston, and causing the grease-like medium to flow between the exposed end surface and the electric element. CONSTITUTION: An exposed end surface 9 of a piston 4 of each thermal conduction module 26 thermally contacts associated electric elements 21, 22 from which heat is removed. The piston 4 protrudes against the action of a coil spring 6, and a grease-like medium 10 exudes from a through-hole 8 opening in the exposed end surface 9 and flows between the exposed end surface and the electric elements 21, 22 so as to realize effective thermal contact between the electric elements and the exposed end surface of the piston. Since the grease- like medium having a high thermal conductivity substantially fills the space between the electric elements 21, 22 and the exposed end surface 9, the efficiency of thermal conduction from the electric elements to the piston under the spring load is improved, and the efficiency of thermal conduction to a thermal conductor 24 via a tubular housing 1 is also high.
JP62267654A 1986-10-24 1987-10-24 Heat-conductive module Pending JPS6486541A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB868625472A GB8625472D0 (en) 1986-10-24 1986-10-24 Circuit board installation

Publications (1)

Publication Number Publication Date
JPS6486541A true JPS6486541A (en) 1989-03-31

Family

ID=10606235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62267654A Pending JPS6486541A (en) 1986-10-24 1987-10-24 Heat-conductive module

Country Status (4)

Country Link
JP (1) JPS6486541A (en)
DE (2) DE8714174U1 (en)
FR (1) FR2605829A1 (en)
GB (2) GB8625472D0 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012060132A (en) * 2010-09-10 2012-03-22 Honeywell Internatl Inc Electrical component assembly for thermal transfer

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4040288A1 (en) * 1990-12-17 1992-07-02 Ant Nachrichtentech ELECTRONIC ASSEMBLY WITH METAL HOUSING
DE9100467U1 (en) * 1991-01-16 1992-05-21 Robert Bosch Gmbh, 7000 Stuttgart Housing of an electrical control unit
DE4104888C2 (en) * 1991-02-18 1994-09-08 Ant Nachrichtentech Electronic assembly with metal housing
DE4118398C2 (en) * 1991-06-05 1994-07-21 Ant Nachrichtentech Electronics assembly with metal housing
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
DE4404035A1 (en) * 1994-02-09 1995-08-10 Sel Alcatel Ag Thermal conduction device for electrical components
DE19901445C2 (en) * 1999-01-15 2002-07-11 Siemens Ag Semiconductor cooling arrangement
US6501658B2 (en) * 2001-02-16 2002-12-31 Intel Corporation Heatsink mounting with shock absorbers
DE10142975B4 (en) * 2001-09-01 2009-05-07 Conti Temic Microelectronic Gmbh Heat sink for elktronische components and method for attaching the same
US8024936B2 (en) 2004-11-16 2011-09-27 Halliburton Energy Services, Inc. Cooling apparatus, systems, and methods
WO2006060673A1 (en) 2004-12-03 2006-06-08 Halliburton Energy Services, Inc. Rechargeable energy storage device in a downhole operation
US7242593B2 (en) * 2005-07-08 2007-07-10 Ims Inc. Thermally efficient motor housing assembly
EP2634798A1 (en) * 2012-02-29 2013-09-04 Siemens Aktiengesellschaft Electric device with cooling housing
EP2669943A1 (en) * 2012-05-28 2013-12-04 Alcatel Lucent Methods and apparatus for providing transfer of a heat load between a heat source and a heat receiver
EP2811515A1 (en) * 2013-06-07 2014-12-10 Alcatel Lucent Thermal connector and heat distribution device for a thermal connector
EP3098557B1 (en) * 2015-05-26 2019-03-27 Advantech Co., Ltd. Dynamic heat conduction system
US20240090131A1 (en) * 2022-09-14 2024-03-14 Hamilton Sundstrand Corporation Thermal management for flat no lead packages

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4193445A (en) * 1978-06-29 1980-03-18 International Business Machines Corporation Conduction cooled module
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
DE3477101D1 (en) * 1983-03-25 1989-04-13 Mitsubishi Electric Corp Heat radiator assembly for cooling electronic parts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012060132A (en) * 2010-09-10 2012-03-22 Honeywell Internatl Inc Electrical component assembly for thermal transfer

Also Published As

Publication number Publication date
GB8724682D0 (en) 1987-11-25
FR2605829A1 (en) 1988-04-29
GB8625472D0 (en) 1986-11-26
DE3735985A1 (en) 1988-05-11
GB2197538A (en) 1988-05-18
GB2197538B (en) 1990-04-04
DE8714174U1 (en) 1988-03-03
DE3735985C2 (en) 1992-10-15

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