JPS648731U - - Google Patents

Info

Publication number
JPS648731U
JPS648731U JP1987102815U JP10281587U JPS648731U JP S648731 U JPS648731 U JP S648731U JP 1987102815 U JP1987102815 U JP 1987102815U JP 10281587 U JP10281587 U JP 10281587U JP S648731 U JPS648731 U JP S648731U
Authority
JP
Japan
Prior art keywords
collet
storage section
resin
resin storage
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987102815U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987102815U priority Critical patent/JPS648731U/ja
Publication of JPS648731U publication Critical patent/JPS648731U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る樹脂ダイボンデイング装
置の実施例の縦断面図、第２図は従来の樹脂ボン
デイング装置の縦断面図である。 図中、１１……リードフレーム、１２……ダイ
パツド、１３……樹脂ダイボンデイング装置、１
４，１４Ａ……樹脂、１５……カートリツジケー
ス、１６……ラバプランジヤー、１７……硬質部
材、１８……デイスペンスコレツト、１９……コ
ントローラ、２０……配管、２１……アダプタア
センブリである。

Claims (1)

    【実用新案登録請求の範囲】
  1. 本体に着脱自在に係合したデイスペンスコレツ
    ト、このコレツト内に着脱自在に配置されたカー
    トリツジ式の樹脂収納部、この樹脂収納部の先端
    側に配置された所定メツシユの硬質部材を備えた
    樹脂ダイボンデイング装置。
JP1987102815U 1987-07-02 1987-07-02 Pending JPS648731U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987102815U JPS648731U (ja) 1987-07-02 1987-07-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987102815U JPS648731U (ja) 1987-07-02 1987-07-02

Publications (1)

Publication Number Publication Date
JPS648731U true JPS648731U (ja) 1989-01-18

Family

ID=31333070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987102815U Pending JPS648731U (ja) 1987-07-02 1987-07-02

Country Status (1)

Country Link
JP (1) JPS648731U (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8694663B2 (en) 2001-09-06 2014-04-08 Qualcomm Incorporated System for transferring digital data at a high rate between a host and a client over a communication path for presentation to a user
US8692839B2 (en) 2005-11-23 2014-04-08 Qualcomm Incorporated Methods and systems for updating a buffer
US8692838B2 (en) 2004-11-24 2014-04-08 Qualcomm Incorporated Methods and systems for updating a buffer
US8694652B2 (en) 2003-10-15 2014-04-08 Qualcomm Incorporated Method, system and computer program for adding a field to a client capability packet sent from a client to a host
US8873584B2 (en) 2004-11-24 2014-10-28 Qualcomm Incorporated Digital data interface device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8694663B2 (en) 2001-09-06 2014-04-08 Qualcomm Incorporated System for transferring digital data at a high rate between a host and a client over a communication path for presentation to a user
US8694652B2 (en) 2003-10-15 2014-04-08 Qualcomm Incorporated Method, system and computer program for adding a field to a client capability packet sent from a client to a host
US8692838B2 (en) 2004-11-24 2014-04-08 Qualcomm Incorporated Methods and systems for updating a buffer
US8873584B2 (en) 2004-11-24 2014-10-28 Qualcomm Incorporated Digital data interface device
US8692839B2 (en) 2005-11-23 2014-04-08 Qualcomm Incorporated Methods and systems for updating a buffer

Similar Documents

Publication Publication Date Title
JPS633840U (ja)
JPH01131684U (ja)
JPS6279834U (ja)
JPS6094468U (ja) ねじ込み部品着脱具
JPH0188851U (ja)
JPS63199040U (ja)
JPH0213501U (ja)
JPH01102703U (ja)
JPS644216U (ja)
JPS5858793U (ja) 温度表示付シヤワ−
JPS61144947U (ja)
JPS5870860U (ja) 研摩ベルト押圧コンタクトホイ−ル
JPS6073656U (ja) 油圧ブレーキホースの継手装置
JPS6179486U (ja)
JPS5815014U (ja) 切断装置
JPS63131357U (ja)
JPS6122215U (ja) パイプ曲げ用心金装置
JPS6243008U (ja)
JPH01101555U (ja)
JPS634957U (ja)
JPH01105312U (ja)
JPH0244096U (ja)
JPH031160U (ja)
JPS59175041U (ja) 細口チユ−ブ
JPH02143907U (ja)