JPS648749U - - Google Patents

Info

Publication number
JPS648749U
JPS648749U JP10465287U JP10465287U JPS648749U JP S648749 U JPS648749 U JP S648749U JP 10465287 U JP10465287 U JP 10465287U JP 10465287 U JP10465287 U JP 10465287U JP S648749 U JPS648749 U JP S648749U
Authority
JP
Japan
Prior art keywords
external lead
led out
lead terminals
package
seals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10465287U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10465287U priority Critical patent/JPS648749U/ja
Publication of JPS648749U publication Critical patent/JPS648749U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aは本考案の一実施例のICパツケージ
の一部を示す平面図、第1図bは本考案の一実施
例のICパツケージの一部を示す縦断面図、第2
図は本考案の他の実施例のICパツケージの一部
を示す平面図、第3図は従来のICパツケージの
一部を示す平面図である。 1……樹脂モールド部分、2……外部リード端
子。
FIG. 1a is a plan view showing a part of an IC package according to an embodiment of the present invention, FIG. 1b is a longitudinal sectional view showing a part of an IC package according to an embodiment of the present invention, and FIG.
This figure is a plan view showing a part of an IC package according to another embodiment of the present invention, and FIG. 3 is a plan view showing a part of a conventional IC package. 1... Resin molded part, 2... External lead terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ペレツトを封止する外装部の少なくとも
2つの側面からそれぞれ複数本の外部リード端子
が導出されたICパツケージにおいて少なくとも
1側面から導出された前記複数本の外部リード端
子は相隣り合うもの同士の長さが異なつているこ
とを特徴とするICパツケージ。
In an IC package, in which a plurality of external lead terminals are led out from at least two side surfaces of an exterior part that seals a semiconductor pellet, the plurality of external lead terminals led out from at least one side surface are arranged so that the lengths of adjacent ones are equal to each other. An IC package characterized by different sizes.
JP10465287U 1987-07-07 1987-07-07 Pending JPS648749U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10465287U JPS648749U (en) 1987-07-07 1987-07-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10465287U JPS648749U (en) 1987-07-07 1987-07-07

Publications (1)

Publication Number Publication Date
JPS648749U true JPS648749U (en) 1989-01-18

Family

ID=31336565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10465287U Pending JPS648749U (en) 1987-07-07 1987-07-07

Country Status (1)

Country Link
JP (1) JPS648749U (en)

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