JPS6489331A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To avoid an important memory cell provided at the center of a chip and to entirely eliminate damages by forming the shape of a collect in a flat square shape smaller than the outer periphery of the chip when the chip is sucked with the collet, and transferred onto a die pad of a semiconductor frame to automatically die bond it. CONSTITUTION:When a semiconductor chip 3 formed with an important memory cell substantially at the center of its surface is sucked and transferred with a collet 4, abutted against a die pad provided on a semiconductor frame, and bonded to the pad in an automatic die bonding step, it is conducted as follows. The collet does not employ a normal round collet, but is formed in a flat square shape smaller than the outer periphery of the chip 3. Thus, when it is sucked, since a wide cavity is generated on the lower face of the collet 4, it is not brought into contact with an important memory cell, thereby eliminating the damage of the cell.