JPS6489351A - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number: JPS6489351A
Authority: JP; Japan
Prior art keywords: heat; cap; substrate; fins; wax
Prior art date: 1987-09-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP24548287A

Other languages

English (en)

Other versions

JP2523688B2 (ja

Inventor

Masaru Ishizuka

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Toshiba Corp

Original Assignee

Toshiba Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-09-29

Filing date

1987-09-29

Publication date

1989-04-03

1987-09-29 Application filed by Toshiba Corp filed Critical Toshiba Corp

1987-09-29 Priority to JP62245482A priority Critical patent/JP2523688B2/ja

1989-04-03 Publication of JPS6489351A publication Critical patent/JPS6489351A/ja

1996-08-14 Application granted granted Critical

1996-08-14 Publication of JP2523688B2 publication Critical patent/JP2523688B2/ja

2011-08-14 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Landscapes

Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

JP62245482A 1987-09-29 1987-09-29 半導体パッケ―ジ Expired - Lifetime JP2523688B2 (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP62245482A JP2523688B2 (ja)	1987-09-29	1987-09-29	半導体パッケ―ジ

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP62245482A JP2523688B2 (ja)	1987-09-29	1987-09-29	半導体パッケ―ジ

Publications (2)

Publication Number	Publication Date
JPS6489351A true JPS6489351A (en)	1989-04-03
JP2523688B2 JP2523688B2 (ja)	1996-08-14

Family

ID=17134314

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP62245482A Expired - Lifetime JP2523688B2 (ja)	1987-09-29	1987-09-29	半導体パッケ―ジ

Country Status (1)

Country	Link
JP (1)	JP2523688B2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5844310A (en) *	1996-08-09	1998-12-01	Hitachi Metals, Ltd.	Heat spreader semiconductor device with heat spreader and method for producing same
JP2006220537A (ja) *	2005-02-10	2006-08-24	Three M Innovative Properties Co	漏水センサ
JP2009283861A (ja) *	2008-05-26	2009-12-03	Toyota Central R&D Labs Inc	半導体装置

1987
- 1987-09-29 JP JP62245482A patent/JP2523688B2/ja not_active Expired - Lifetime

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5844310A (en) *	1996-08-09	1998-12-01	Hitachi Metals, Ltd.	Heat spreader semiconductor device with heat spreader and method for producing same
US6032362A (en) *	1996-08-09	2000-03-07	Hitachi Metals, Ltd.	Method for producing a heat spreader and semiconductor device with a heat spreader
JP2006220537A (ja) *	2005-02-10	2006-08-24	Three M Innovative Properties Co	漏水センサ
JP2009283861A (ja) *	2008-05-26	2009-12-03	Toyota Central R&D Labs Inc	半導体装置

Also Published As

Publication number	Publication date
JP2523688B2 (ja)	1996-08-14

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Legal Events

Date

Code

Title

Description

2007-09-29

EXPY

Cancellation because of completion of term

2007-12-05

FPAY

Renewal fee payment

Free format text: PAYMENT UNTIL: 20080531

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