JPS6489372A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6489372A
JPS6489372A JP62245452A JP24545287A JPS6489372A JP S6489372 A JPS6489372 A JP S6489372A JP 62245452 A JP62245452 A JP 62245452A JP 24545287 A JP24545287 A JP 24545287A JP S6489372 A JPS6489372 A JP S6489372A
Authority
JP
Japan
Prior art keywords
film
insulating film
gate electrode
electrodes
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62245452A
Other languages
Japanese (ja)
Inventor
Kuniyoshi Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62245452A priority Critical patent/JPS6489372A/en
Publication of JPS6489372A publication Critical patent/JPS6489372A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices

Landscapes

  • Non-Volatile Memory (AREA)

Abstract

PURPOSE:To suppress a leakage current and to shorten an erasing time by so forming a first insulating film made of a composite film between a control electrode and a floating gate electrode that the end of the first film of a drain arranging direction side is retreated from both ends of a floating gate electrode toward its inside. CONSTITUTION:A floating gate electrode 43 is formed through a gate insulating film 35 on a channel region between a source region 46 and a drain region 47 on a P-type silicon substrate 31, and a control gate electrode 44 is formed through an insulating film on the electrode 43. The insulating film between the electrodes 43 and 44 is formed of a first insulating film made of a composite film including a silicon nitride film 39 and second insulating films formed at both sides of the first film, and the first film is so formed as to retreat at the ends of source, drain arranging direction side from both ends of the electrodes 43 toward its inside. Thus, a leakage current between the gate electrodes can be sufficiently suppressed, and a semiconductor device which has sufficiently good ultraviolet ray erasing characteristic can be formed.
JP62245452A 1987-09-29 1987-09-29 Semiconductor device Pending JPS6489372A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62245452A JPS6489372A (en) 1987-09-29 1987-09-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62245452A JPS6489372A (en) 1987-09-29 1987-09-29 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6489372A true JPS6489372A (en) 1989-04-03

Family

ID=17133874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62245452A Pending JPS6489372A (en) 1987-09-29 1987-09-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6489372A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5291047A (en) * 1990-10-12 1994-03-01 Nec Corporation Floating gate type electrically programmable read only memory cell with variable threshold level in erased state
JPH0677438A (en) * 1990-09-22 1994-03-18 Samsung Electron Co Ltd Manufacture and structure for nonvolatile semiconductor memory device provided with storage cell array and with peripheral circuit
US7199425B2 (en) 2003-05-26 2007-04-03 Kabushiki Kaisha Toshiba Non-volatile memory cells
JP2008153540A (en) * 2006-12-19 2008-07-03 Toshiba Corp Nonvolatile semiconductor memory

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0677438A (en) * 1990-09-22 1994-03-18 Samsung Electron Co Ltd Manufacture and structure for nonvolatile semiconductor memory device provided with storage cell array and with peripheral circuit
US5291047A (en) * 1990-10-12 1994-03-01 Nec Corporation Floating gate type electrically programmable read only memory cell with variable threshold level in erased state
US7199425B2 (en) 2003-05-26 2007-04-03 Kabushiki Kaisha Toshiba Non-volatile memory cells
US7391076B2 (en) 2003-05-26 2008-06-24 Kabushiki Kaisha Toshiba Non-volatile memory cells
JP2008153540A (en) * 2006-12-19 2008-07-03 Toshiba Corp Nonvolatile semiconductor memory

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