JPS6489548A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6489548A
JPS6489548A JP62248393A JP24839387A JPS6489548A JP S6489548 A JPS6489548 A JP S6489548A JP 62248393 A JP62248393 A JP 62248393A JP 24839387 A JP24839387 A JP 24839387A JP S6489548 A JPS6489548 A JP S6489548A
Authority
JP
Japan
Prior art keywords
metallization
base ceramic
semiconductor device
semiconductor
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62248393A
Other languages
Japanese (ja)
Inventor
Masahide Yamauchi
Masaharu Koyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62248393A priority Critical patent/JPS6489548A/en
Publication of JPS6489548A publication Critical patent/JPS6489548A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Wire Bonding (AREA)
  • Microwave Amplifiers (AREA)

Abstract

PURPOSE:To allow an I/O signal of a semiconductor device to have a desired frequency characteristic, to improve electromagnetic shielding effect of a semiconductor package, and to obtain the semiconductor device with high airtightness by forming a grounding conductor by metallizing the back side of a base ceramic, and forming a metallization connecting between the semiconductor and I/O leads located on the base ceramic by a microwave strip line. CONSTITUTION:A semiconductor device is so formed that the back side of a base ceramic 1 is metallized 18 on the entire surface and is made to be a grounding conductor, while a metallization 16 connecting a semiconductor element 7 and I/O leads 3, 4 formed on the base ceramic 1 is formed by a microwave strip line so that a predetermined impedance can be obtained. The widths of the I/O leads 3, 4 to be connected to the metallization 16 are same as that of the metallization 16. Side metallizations 9 are formed on both inside and outside walls in the side of a base ceramic grounding metallization of a top ceramic 2.
JP62248393A 1987-09-30 1987-09-30 Semiconductor device Pending JPS6489548A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62248393A JPS6489548A (en) 1987-09-30 1987-09-30 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62248393A JPS6489548A (en) 1987-09-30 1987-09-30 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6489548A true JPS6489548A (en) 1989-04-04

Family

ID=17177441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62248393A Pending JPS6489548A (en) 1987-09-30 1987-09-30 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6489548A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04297101A (en) * 1991-03-13 1992-10-21 Mitsubishi Electric Corp Semiconductor package
JP2014229866A (en) * 2013-05-27 2014-12-08 京セラ株式会社 Substrate for mounting electronic component and electronic component mounting package using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04297101A (en) * 1991-03-13 1992-10-21 Mitsubishi Electric Corp Semiconductor package
JP2014229866A (en) * 2013-05-27 2014-12-08 京セラ株式会社 Substrate for mounting electronic component and electronic component mounting package using the same

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