JPS649628A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS649628A
JPS649628A JP62163979A JP16397987A JPS649628A JP S649628 A JPS649628 A JP S649628A JP 62163979 A JP62163979 A JP 62163979A JP 16397987 A JP16397987 A JP 16397987A JP S649628 A JPS649628 A JP S649628A
Authority
JP
Japan
Prior art keywords
rubber
silicone
prepolymer
lead frame
occur
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62163979A
Other languages
Japanese (ja)
Inventor
Takashi Yokoyama
Masaji Ogata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62163979A priority Critical patent/JPS649628A/en
Publication of JPS649628A publication Critical patent/JPS649628A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Polymerization Catalysts (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To make it possible to maintain high reliability without decreasing adhesion between an element and a lead frame at a high temperature in a high humidity atmosphere, by bonding a semiconductor element to the taps of the lead frame through silicone rubber. CONSTITUTION:Silicone prepolymer is hardened and bonded. In order to harden the silicone prepolymer, the vinyl group at the end of siloxane prepolymer is heated in the presence of organic peroxide so as to yied radical and polymerized. Silicone rubber of this type does not include solvent, and by products are not yielded. Since adhesion is weak when it is used as a single material, however, 1-5wt.% of silicon monomer having a hydroxide group at the end, or silicone coupling agent, is added. When the hardness of the rubber is soft, poor appearance tends to occur. Therefore, it is necessary to use the rubber, whose hardness is 2JIS-A or higher. When the rubber is too hard, disconnection failure is liable to occur. Therefore, the upper limit is made to be 40JIS-A (both at 25 deg.C).
JP62163979A 1987-07-02 1987-07-02 Semiconductor device Pending JPS649628A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62163979A JPS649628A (en) 1987-07-02 1987-07-02 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62163979A JPS649628A (en) 1987-07-02 1987-07-02 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS649628A true JPS649628A (en) 1989-01-12

Family

ID=15784449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62163979A Pending JPS649628A (en) 1987-07-02 1987-07-02 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS649628A (en)

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