JPS649713A - Resin molding die - Google Patents

Resin molding die

Info

Publication number
JPS649713A
JPS649713A JP16578287A JP16578287A JPS649713A JP S649713 A JPS649713 A JP S649713A JP 16578287 A JP16578287 A JP 16578287A JP 16578287 A JP16578287 A JP 16578287A JP S649713 A JPS649713 A JP S649713A
Authority
JP
Japan
Prior art keywords
gate
template
resin
molded part
cavity plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16578287A
Other languages
Japanese (ja)
Inventor
Kazuo Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16578287A priority Critical patent/JPS649713A/en
Publication of JPS649713A publication Critical patent/JPS649713A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE:To detach a gate filling resin and a molded part automatically through mold opening, and to manufacture a resin molded product at low cost by installing a specific cavity plate near a gate for injecting a molten resin in a mold. CONSTITUTION:A gate 17 for injecting a molten resin is mounted between a first template 12 and a second template 13 abutted against the first template 12, and a cavity plate 14 with compression coil springs 19 is set up on the second template 13 side in the vicinity of the gate 17. The resin 32 is injected into a cavity 4 from the gate 17, and solidified, thus acquiring a molded part 31. The cavity plate 14 is separated from the first template 12 at a time later than the second plate 13, and the molded part 31 and the gate filling resin 32 are detached automatically.
JP16578287A 1987-07-02 1987-07-02 Resin molding die Pending JPS649713A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16578287A JPS649713A (en) 1987-07-02 1987-07-02 Resin molding die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16578287A JPS649713A (en) 1987-07-02 1987-07-02 Resin molding die

Publications (1)

Publication Number Publication Date
JPS649713A true JPS649713A (en) 1989-01-13

Family

ID=15818910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16578287A Pending JPS649713A (en) 1987-07-02 1987-07-02 Resin molding die

Country Status (1)

Country Link
JP (1) JPS649713A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0642138U (en) * 1992-11-16 1994-06-03 本田技研工業株式会社 Gate groove structure in resin mold
JP2006240279A (en) * 2004-08-20 2006-09-14 Ntn Corp SEAL RING, MOLDING METHOD THEREOF, AND MOLD FOR MOLDING
US7236959B2 (en) * 2000-11-17 2007-06-26 Sanyo Electric Co., Ltd. Method for collectively receiving at high voltage and distributing at low voltage, and collective housing using same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0642138U (en) * 1992-11-16 1994-06-03 本田技研工業株式会社 Gate groove structure in resin mold
US7236959B2 (en) * 2000-11-17 2007-06-26 Sanyo Electric Co., Ltd. Method for collectively receiving at high voltage and distributing at low voltage, and collective housing using same
JP2006240279A (en) * 2004-08-20 2006-09-14 Ntn Corp SEAL RING, MOLDING METHOD THEREOF, AND MOLD FOR MOLDING

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