JPWO2020004512A1 - はんだペースト - Google Patents

はんだペースト Download PDF

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Publication number
JPWO2020004512A1
JPWO2020004512A1 JP2020527608A JP2020527608A JPWO2020004512A1 JP WO2020004512 A1 JPWO2020004512 A1 JP WO2020004512A1 JP 2020527608 A JP2020527608 A JP 2020527608A JP 2020527608 A JP2020527608 A JP 2020527608A JP WO2020004512 A1 JPWO2020004512 A1 JP WO2020004512A1
Authority
JP
Japan
Prior art keywords
solder
particles
mass
solder particles
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020527608A
Other languages
English (en)
Japanese (ja)
Inventor
振一郎 須方
振一郎 須方
邦彦 赤井
邦彦 赤井
芳則 江尻
芳則 江尻
悠平 岡田
悠平 岡田
敏光 森谷
敏光 森谷
勝将 宮地
勝将 宮地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2020004512A1 publication Critical patent/JPWO2020004512A1/ja
Priority to JP2023126468A priority Critical patent/JP2023153935A/ja
Priority to JP2025021205A priority patent/JP2025069454A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)
JP2020527608A 2018-06-26 2019-06-26 はんだペースト Pending JPWO2020004512A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023126468A JP2023153935A (ja) 2018-06-26 2023-08-02 はんだペースト
JP2025021205A JP2025069454A (ja) 2018-06-26 2025-02-13 はんだペースト

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2018121088 2018-06-26
JP2018121088 2018-06-26
JP2019014851 2019-01-30
JP2019014851 2019-01-30
PCT/JP2019/025498 WO2020004512A1 (fr) 2018-06-26 2019-06-26 Pâte à souder

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023126468A Division JP2023153935A (ja) 2018-06-26 2023-08-02 はんだペースト

Publications (1)

Publication Number Publication Date
JPWO2020004512A1 true JPWO2020004512A1 (ja) 2021-08-02

Family

ID=68985476

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2020527608A Pending JPWO2020004512A1 (ja) 2018-06-26 2019-06-26 はんだペースト
JP2023126468A Pending JP2023153935A (ja) 2018-06-26 2023-08-02 はんだペースト
JP2025021205A Pending JP2025069454A (ja) 2018-06-26 2025-02-13 はんだペースト

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023126468A Pending JP2023153935A (ja) 2018-06-26 2023-08-02 はんだペースト
JP2025021205A Pending JP2025069454A (ja) 2018-06-26 2025-02-13 はんだペースト

Country Status (3)

Country Link
JP (3) JPWO2020004512A1 (fr)
TW (1) TW202000764A (fr)
WO (1) WO2020004512A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4084051A4 (fr) * 2019-12-27 2023-08-02 Resonac Corporation Élément de formation de perle de soudure, procédé de fabrication d'un élément de formation de perle de soudure, et procédé de fabrication d'un substrat d'électrode pourvu d'une perle de soudure
JP7080939B2 (ja) * 2020-09-04 2022-06-06 株式会社新菱 低融点接合部材およびその製造方法ならびに半導体電子回路およびその実装方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01184201A (ja) * 1988-01-14 1989-07-21 Electroplating Eng Of Japan Co 金属パウダー及びそのペースト
JPH0523887A (ja) * 1991-07-19 1993-02-02 Matsushita Electric Ind Co Ltd 金属ボールの形成方法
JP2010036234A (ja) * 2008-08-07 2010-02-18 Mitsui Mining & Smelting Co Ltd はんだ粉及びはんだペースト
JP2016126878A (ja) * 2014-12-26 2016-07-11 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2740699B2 (ja) * 1991-07-08 1998-04-15 アルプス電気株式会社 端子接続構造、端子接続方法および導電性粒子製造方法
WO2006043377A1 (fr) * 2004-10-19 2006-04-27 Senju Metal Industry Co., Ltd. Tole pour former une perle de soudure et son procede de fabrication
JP2014058147A (ja) * 2012-09-19 2014-04-03 Tokyo Ohka Kogyo Co Ltd はんだ球製造用のモールドの製造方法、及びはんだ球の製造方法
JP2019029135A (ja) * 2017-07-27 2019-02-21 日立化成株式会社 異方性導電フィルム及びその製造方法、並びに接続構造体及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01184201A (ja) * 1988-01-14 1989-07-21 Electroplating Eng Of Japan Co 金属パウダー及びそのペースト
JPH0523887A (ja) * 1991-07-19 1993-02-02 Matsushita Electric Ind Co Ltd 金属ボールの形成方法
JP2010036234A (ja) * 2008-08-07 2010-02-18 Mitsui Mining & Smelting Co Ltd はんだ粉及びはんだペースト
JP2016126878A (ja) * 2014-12-26 2016-07-11 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法

Also Published As

Publication number Publication date
JP2025069454A (ja) 2025-04-30
JP2023153935A (ja) 2023-10-18
TW202000764A (zh) 2020-01-01
WO2020004512A1 (fr) 2020-01-02

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