JPWO2020213402A1 - - Google Patents

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Publication number
JPWO2020213402A1
JPWO2020213402A1 JP2021514869A JP2021514869A JPWO2020213402A1 JP WO2020213402 A1 JPWO2020213402 A1 JP WO2020213402A1 JP 2021514869 A JP2021514869 A JP 2021514869A JP 2021514869 A JP2021514869 A JP 2021514869A JP WO2020213402 A1 JPWO2020213402 A1 JP WO2020213402A1
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JP
Japan
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JP2021514869A
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JP7211494B2 (ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5465—Silicon-containing compounds containing nitrogen containing at least one C=N bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/02—Inorganic compounds
    • C09K2200/0239—Oxides, hydroxides, carbonates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/068—Containing also other elements than carbon, oxygen or nitrogen in the polymer main chain
    • C09K2200/0685—Containing silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021514869A 2019-04-17 2020-04-01 室温硬化性オルガノポリシロキサン組成物及びその製造方法 Active JP7211494B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019078627 2019-04-17
JP2019078627 2019-04-17
PCT/JP2020/015035 WO2020213402A1 (ja) 2019-04-17 2020-04-01 室温硬化性オルガノポリシロキサン組成物及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2020213402A1 true JPWO2020213402A1 (ja) 2020-10-22
JP7211494B2 JP7211494B2 (ja) 2023-01-24

Family

ID=72837782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021514869A Active JP7211494B2 (ja) 2019-04-17 2020-04-01 室温硬化性オルガノポリシロキサン組成物及びその製造方法

Country Status (5)

Country Link
US (1) US12565566B2 (ja)
JP (1) JP7211494B2 (ja)
KR (1) KR102919168B1 (ja)
CN (1) CN113710742B (ja)
WO (1) WO2020213402A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024070866A1 (ja) * 2022-09-29 2024-04-04 信越化学工業株式会社 付加反応硬化型オルガノポリシロキサン組成物及びその製造方法
CN118480267B (zh) * 2024-07-01 2024-10-01 湖南北思孚新材料有限公司 一种发泡硅橡胶的制备方法及其形成的防火材料

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014015557A (ja) * 2012-07-10 2014-01-30 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6383167A (ja) 1986-09-29 1988-04-13 Toray Silicone Co Ltd 室温硬化性オルガノポリシロキサン組成物
CA2067678C (en) * 1991-11-18 1995-08-08 Louis H. Toporcer Flame retardant elastomeric composition
JP3614958B2 (ja) 1995-11-29 2005-01-26 東レ・ダウコーニング・シリコーン株式会社 室温硬化性シリコーンエラストマー組成物
WO2003010227A1 (en) * 2001-07-26 2003-02-06 Dow Corning Toray Silicone Co., Ltd. Room-temperature-curable organopolysiloxane composition
US6838499B2 (en) * 2002-02-19 2005-01-04 Shin-Etsu Chemical Co., Ltd. Curable compositions
JP4440517B2 (ja) * 2002-05-07 2010-03-24 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物及び該組成物を接着剤として用いた部品
JP2004182942A (ja) 2002-12-06 2004-07-02 Ge Toshiba Silicones Co Ltd 室温硬化性オルガノポリシロキサン組成物
JP2004359752A (ja) * 2003-06-03 2004-12-24 Shin Etsu Polymer Co Ltd シリコーン接着剤
JP4045439B2 (ja) * 2003-09-22 2008-02-13 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
JP4912746B2 (ja) 2006-05-24 2012-04-11 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
JP2007284687A (ja) * 2007-06-08 2007-11-01 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物及び該組成物を接着剤として用いた部品
EP2223968B1 (en) * 2007-12-19 2013-07-31 Momentive Performance Materials Japan LLC Room-temperature-curable polyorganosiloxane composition
CN104981518B (zh) * 2012-12-28 2019-01-29 美国陶氏有机硅公司 用于换能器的可固化有机聚硅氧烷组合物和此类可固化有机硅组合物在换能器方面的应用
EP3085739B1 (en) * 2013-12-17 2020-03-11 Shin-Etsu Chemical Co., Ltd. Multicomponent room temperature-curable organopolysiloxane composition, cured product of said composition, and molded product comprising said cured product
JP6350672B2 (ja) * 2014-10-17 2018-07-04 信越化学工業株式会社 剥離シート用重剥離添加剤及び剥離シート用オルガノポリシロキサン組成物並びに剥離シート
CN105238061B (zh) * 2015-11-25 2018-06-15 泸州北方化学工业有限公司 发泡硅橡胶胶料、低密度硅橡胶海绵及其制备方法
JP6733241B2 (ja) * 2016-03-18 2020-07-29 信越化学工業株式会社 付加硬化性シリコーンゴム組成物、その製造方法及び硬化物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014015557A (ja) * 2012-07-10 2014-01-30 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物

Also Published As

Publication number Publication date
KR20220013485A (ko) 2022-02-04
WO2020213402A1 (ja) 2020-10-22
KR102919168B1 (ko) 2026-01-29
US20220169798A1 (en) 2022-06-02
US12565566B2 (en) 2026-03-03
JP7211494B2 (ja) 2023-01-24
CN113710742A (zh) 2021-11-26
CN113710742B (zh) 2023-09-26

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