JPWO2024257530A1 - - Google Patents
Info
- Publication number
- JPWO2024257530A1 JPWO2024257530A1 JP2024564758A JP2024564758A JPWO2024257530A1 JP WO2024257530 A1 JPWO2024257530 A1 JP WO2024257530A1 JP 2024564758 A JP2024564758 A JP 2024564758A JP 2024564758 A JP2024564758 A JP 2024564758A JP WO2024257530 A1 JPWO2024257530 A1 JP WO2024257530A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023099240 | 2023-06-16 | ||
| JP2023099240 | 2023-06-16 | ||
| PCT/JP2024/017754 WO2024257530A1 (ja) | 2023-06-16 | 2024-05-14 | コンデンサ素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024257530A1 true JPWO2024257530A1 ( ) | 2024-12-19 |
| JP7619541B1 JP7619541B1 (ja) | 2025-01-22 |
| JPWO2024257530A5 JPWO2024257530A5 ( ) | 2025-05-27 |
Family
ID=93852047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024564758A Active JP7619541B1 (ja) | 2023-06-16 | 2024-05-14 | コンデンサ素子 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250166927A1 ( ) |
| JP (1) | JP7619541B1 ( ) |
| CN (1) | CN119631152A ( ) |
| TW (1) | TWI898543B ( ) |
| WO (1) | WO2024257530A1 ( ) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20250140483A1 (en) * | 2023-10-30 | 2025-05-01 | Saras Micro Devices, Inc. | Integrated passive devices with enhanced form factor |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003086463A (ja) * | 2001-09-10 | 2003-03-20 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサの製造方法 |
| JP3711343B2 (ja) * | 2002-06-26 | 2005-11-02 | 株式会社トッパンＮｅｃサーキットソリューションズ | 印刷配線板及びその製造方法並びに半導体装置 |
| JP2006147606A (ja) * | 2004-11-16 | 2006-06-08 | Nec Toppan Circuit Solutions Inc | シート状コンデンサとその製造方法 |
| JP2007073787A (ja) * | 2005-09-08 | 2007-03-22 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサ内蔵回路基板とその製造方法 |
| CN110291602B (zh) * | 2017-02-17 | 2021-12-10 | 株式会社村田制作所 | 固体电解电容器及其制造方法 |
| JP7180561B2 (ja) * | 2019-03-29 | 2022-11-30 | 株式会社村田製作所 | コンデンサアレイ、及び、複合電子部品 |
| JP7435823B2 (ja) * | 2021-06-16 | 2024-02-21 | 株式会社村田製作所 | コンデンサアレイ |
| WO2023100630A1 (ja) * | 2021-12-01 | 2023-06-08 | 株式会社村田製作所 | モジュール及び半導体複合装置 |
-
2024
- 2024-04-17 TW TW113114295A patent/TWI898543B/zh active
- 2024-05-14 JP JP2024564758A patent/JP7619541B1/ja active Active
- 2024-05-14 CN CN202480003565.7A patent/CN119631152A/zh active Pending
- 2024-05-14 WO PCT/JP2024/017754 patent/WO2024257530A1/ja not_active Ceased
-
2025
- 2025-01-02 US US19/007,874 patent/US20250166927A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20250166927A1 (en) | 2025-05-22 |
| JP7619541B1 (ja) | 2025-01-22 |
| WO2024257530A1 (ja) | 2024-12-19 |
| TWI898543B (zh) | 2025-09-21 |
| TW202501516A (zh) | 2025-01-01 |
| CN119631152A (zh) | 2025-03-14 |
Similar Documents
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