JPWO2024257531A5 - - Google Patents
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- JPWO2024257531A5 JPWO2024257531A5 JP2024564550A JP2024564550A JPWO2024257531A5 JP WO2024257531 A5 JPWO2024257531 A5 JP WO2024257531A5 JP 2024564550 A JP2024564550 A JP 2024564550A JP 2024564550 A JP2024564550 A JP 2024564550A JP WO2024257531 A5 JPWO2024257531 A5 JP WO2024257531A5
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- Prior art keywords
- layer
- capacitor
- external electrode
- thickness direction
- sealing
- Prior art date
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Claims (7)
前記コンデンサ部の少なくとも一方の主面を覆うように設けられた封止層と、を備え、
前記第1コンデンサ層及び前記第2コンデンサ層は、各々、芯部の少なくとも一方の主面に多孔質部を有する陽極板と、前記多孔質部の表面に設けられた誘電体層と、前記誘電体層の表面に設けられた陰極層と、を含み、
前記陰極層は、前記誘電体層の表面に設けられた固体電解質層と、前記固体電解質層の表面に設けられた導電体層と、を含み、
前記第1コンデンサ層中の、前記第2コンデンサ層と対向する前記導電体層は、前記第2コンデンサ層中の、前記第1コンデンサ層と対向する前記導電体層と同一であり、
前記第1コンデンサ層の前記陰極層及び前記第2コンデンサ層の前記陰極層に電気的に接続されるように前記封止層の少なくとも一方の主面に設けられた第1外部電極層と、
前記コンデンサ部及び前記封止層を前記厚さ方向に貫通する第1貫通孔の少なくとも内壁面に設けられ、前記第1外部電極層に電気的に接続される第1スルーホール導体と、をさらに備え、
前記第1スルーホール導体は、前記第1貫通孔の内壁面で、前記導電体層に接続されている、コンデンサ素子。 a capacitor section including a first capacitor layer and a second capacitor layer opposed to each other in a thickness direction;
a sealing layer provided so as to cover at least one main surface of the capacitor portion,
each of the first capacitor layer and the second capacitor layer includes an anode plate having a porous portion on at least one main surface of a core portion, a dielectric layer provided on a surface of the porous portion, and a cathode layer provided on a surface of the dielectric layer;
the cathode layer includes a solid electrolyte layer provided on a surface of the dielectric layer, and a conductor layer provided on the surface of the solid electrolyte layer,
the conductive layer in the first capacitor layer facing the second capacitor layer is the same as the conductive layer in the second capacitor layer facing the first capacitor layer;
a first external electrode layer provided on at least one main surface of the sealing layer so as to be electrically connected to the cathode layer of the first capacitor layer and the cathode layer of the second capacitor layer;
a first through-hole conductor provided on at least an inner wall surface of a first through hole penetrating the capacitor portion and the sealing layer in the thickness direction, the first through-hole conductor being electrically connected to the first external electrode layer,
The first through-hole conductor is connected to the conductive layer on an inner wall surface of the first through hole .
前記厚さ方向からの平面視で、前記第1外部電極層及び前記第2外部電極層の少なくとも一方は、前記同一の前記導電体層と少なくとも一部が重なるように配置されている、請求項1に記載のコンデンサ素子。 a second external electrode layer provided on at least one main surface of the sealing layer so as to be electrically connected to the anode plate of the first capacitor layer and the anode plate of the second capacitor layer;
The capacitor element according to claim 1 , wherein at least one of the first external electrode layer and the second external electrode layer is arranged so as to at least partially overlap the same conductive layer in a plan view from the thickness direction.
前記第2スルーホール導体は、前記第2貫通孔の内壁面で、前記第1コンデンサ層の前記陽極板及び前記第2コンデンサ層の前記陽極板に電気的に接続されている、請求項4に記載のコンデンサ素子。 a second through-hole conductor provided on at least an inner wall surface of a second through hole penetrating the capacitor portion and the sealing layer in the thickness direction, the second through-hole conductor being electrically connected to the second external electrode layer ,
The capacitor element according to claim 4 , wherein the second through-hole conductor is electrically connected to the anode plate of the first capacitor layer and the anode plate of the second capacitor layer on an inner wall surface of the second through hole.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023099239 | 2023-06-16 | ||
| JP2023099239 | 2023-06-16 | ||
| PCT/JP2024/017758 WO2024257531A1 (en) | 2023-06-16 | 2024-05-14 | Capacitor element |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024257531A1 JPWO2024257531A1 (en) | 2024-12-19 |
| JP7619540B1 JP7619540B1 (en) | 2025-01-22 |
| JPWO2024257531A5 true JPWO2024257531A5 (en) | 2025-05-27 |
Family
ID=93852044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024564550A Active JP7619540B1 (en) | 2023-06-16 | 2024-05-14 | Capacitor Element |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7619540B1 (en) |
| CN (1) | CN223785015U (en) |
| WO (1) | WO2024257531A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20250140483A1 (en) * | 2023-10-30 | 2025-05-01 | Saras Micro Devices, Inc. | Integrated passive devices with enhanced form factor |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004158577A (en) * | 2002-11-05 | 2004-06-03 | Japan Carlit Co Ltd:The | Manufacturing method of laminated large area aluminum solid electrolytic capacitor and capacitor by the method |
| JP2007227716A (en) * | 2006-02-24 | 2007-09-06 | Nichicon Corp | Laminated solid electrolytic capacitor and manufacturing method therefor |
| JP5181154B2 (en) * | 2009-07-30 | 2013-04-10 | ニチコン株式会社 | Multilayer solid electrolytic capacitor |
| JP5429392B2 (en) * | 2010-09-29 | 2014-02-26 | 株式会社村田製作所 | Solid electrolytic capacitor and manufacturing method thereof |
| JP5267586B2 (en) * | 2011-01-28 | 2013-08-21 | 株式会社村田製作所 | Solid electrolytic capacitor and manufacturing method thereof |
| JP2015043350A (en) * | 2011-12-20 | 2015-03-05 | ルビコン・カーリット株式会社 | Device and device manufacturing method |
-
2024
- 2024-05-14 CN CN202490000066.8U patent/CN223785015U/en active Active
- 2024-05-14 WO PCT/JP2024/017758 patent/WO2024257531A1/en not_active Ceased
- 2024-05-14 JP JP2024564550A patent/JP7619540B1/en active Active
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