KR100938325B1 - 에너지 전달 시스템 - Google Patents
에너지 전달 시스템 Download PDFInfo
- Publication number
- KR100938325B1 KR100938325B1 KR1020097018129A KR20097018129A KR100938325B1 KR 100938325 B1 KR100938325 B1 KR 100938325B1 KR 1020097018129 A KR1020097018129 A KR 1020097018129A KR 20097018129 A KR20097018129 A KR 20097018129A KR 100938325 B1 KR100938325 B1 KR 100938325B1
- Authority
- KR
- South Korea
- Prior art keywords
- beams
- deflectors
- delivery system
- laser
- energy delivery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/106—Beam splitting or combining systems for splitting or combining a plurality of identical beams or images, e.g. image replication
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/14—Beam splitting or combining systems operating by reflection only
- G02B27/143—Beam splitting or combining systems operating by reflection only using macroscopically faceted or segmented reflective surfaces
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/14—Beam splitting or combining systems operating by reflection only
- G02B27/145—Beam splitting or combining systems operating by reflection only having sequential partially reflecting surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic materials
- B23K2103/42—Plastics other than composite materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Abstract
Description
Claims (24)
- 기판으로의 에너지 전달 시스템에 있어서, 상기 시스템은,- 다수의 방사 빔을 포함하는 한개 이상의 방사 에너지 소스,- 선택적으로 위치설정가능한 다수의 제 1 디플렉터들, 그리고- 선택적으로 위치설정가능한 다수의 제 2 디플렉터들을 포함하고, 이때,상기 다수의 제 1 빔은 다수의 제 1 위치로 상기 다수의 빔들을 향하게 하기 위해 제 1 시간 구간동안 선택적으로 위치설정가능한 다수의 제 1 디플렉터에게로 향하며,선택적으로 위치설정가능한 상기 다수의 제 2 디플렉터들은 상기 제 1 시간 구간동안 선택적으로 위치설정되며, 그리고상기 다수의 제 1 방사 빔은 다수의 제 2 위치로 상기 다수의 빔들을 향하게 하기 위해 제 2 시간 구간동안 선택적으로 위치설정가능한 다수의 제 2 디플렉터에게로 향하는 것을 특징으로 하는 에너지 전달 시스템.
- 제 1 항에 있어서, 상기 한개 이상의 방사 에너지 소스는 펄스형 방사 에너지 소스를 포함하고, 상기 다수의 빔 각각은 방사 에너지 펄스들에 의해 형성되는 것을 특징으로 하는 에너지 전달 시스템.
- 제 1 항에 있어서, 상기 한개 이상의 방사 에너지 소스는 한개 이상의 펄스형 레이저를 포함하고, 상기 다수의 방사 빔들은 한개 이상의 펄스형 레이저 빔을 포함하는 것을 특징으로 하는 에너지 전달 시스템.
- 제 3 항에 있어서, 상기 한개 이상의 펄스형 레이저가 Q-스위치 레이저인 것을 특징으로 하는 에너지 전달 시스템.
- 제 1 항에 있어서, 상기 다수의 빔이 선택가능한 숫자의 빔을 포함하는 것을 특징으로 하는 에너지 전달 시스템.
- 제 1 항에 있어서, 상기 다수의 빔들 각각은 선태가능한 방향으로 향하는 것을 특징으로 하는 에너지 전달 시스템.
- 제 5 항에 있어서, 상기 다수의 빔 각각은 선택가능한 방향으로 향하는 것을 특징으로 하는 에너지 전달 시스템.
- 제 7 항에 있어서, 상기 다수의 제 1 디플렉터 중 한개 이상이 음향광학적 디플렉터를 포함하고, 상기 디플렉터의 동작이 제어 신호에 의해 통제되는 것을 특징으로 하는 에너지 전달 시스템.
- 제 8 항에 있어서, 상기 음향광학적 디플렉터는 상기 제어 신호에 의해 제어되는 음파 발생기를 포함하고, 상기 음파 발생기는 상기 빔의 수를 결정하는 음파를 발생시키는 것을 특징으로 하는 에너지 전달 시스템.
- 제 8 항에 있어서, 상기 음향광학적 디플렉터는 상기 제어 신호에 의해 제어되는 음파 발생기를 포함하고, 상기 음파 발생기는 상기 빔의 상기 선택가능한 방향을 결정하는 음파를 발생시키는 것을 특징으로 하는 에너지 전달 시스템.
- 제 9 항에 있어서, 상기 음파는 상기 빔의 상기 선택가능한 방향을 또한 결정하는 것을 특징으로 하는 에너지 전달 시스템.
- 제 11 항에 있어서, 상기 음파는 공간적으로 구분되는 다수의 음파 세그먼트를 포함하고, 공간적으로 구분되는 상기 각각의 음파 세그먼트는 개별적 주파수를 가진 상기 제어 신호의 일부분에 의해 형성되는 것을 특징으로 하는 에너지 전달 시스템.
- 제 12 항에 있어서, 공간적으로 구분되는 상기 각각의 음파 세그먼트가 해당 빔의 공간적으로 구분되는 해당 방향을 결정하고, 상기 방향은 상기 음파 세그먼트에 해당하는 제어 신호 부분의 주파수의 함수인 것을 특징으로 하는 에너지 전달 시스템.
- 제 12 항에 있어서, 공간적으로 구분되는 상기 음파 세그먼트의 수가 해당 빔의 수를 결정하는 것을 특징으로 하는 에너지 전달 시스템.
- 제 2 항에 있어서,상기 다수의 빔은 선택가능한 숫자의 빔들을 포함하고,상기 한개 이상의 방사 에너지 소스는 재설정 시간 구간 내에 상기 빔의 수와 방향 중 한가지 이상을 변경시킬 수 있고, 그리고상기 방사 에너지 펄스들은 상기 재설정 시간 구간보다 큰 시간차만큼 시간상으로 서로로부터 이격되는 것을 특징으로 하는 에너지 전달 시스템.
- 제 2 항에 있어서,선택적으로 위치설정가능한 다수의 제 1 디플렉터들은 리디렉션 시간 구간 내에 상기 빔의 방향을 변경시킬 수 있고, 그리고상기 방사 에너지 펄스들은 상기 리디렉션 시간 구간보다 작은 시간차만큼 시간상으로 서로로부터 이격되는 것을 특징으로 하는 에너지 전달 시스템.
- 제 15 항에 있어서,선택적으로 위치설정가능한 다수의 제 1 디플렉터들은 리디렉션 시간 구간 내에 상기 빔의 방향을 변경시킬 수 있고, 그리고상기 방사 에너지 펄스들은 상기 리디렉션 시간 구간보다 작은 시간차만큼 시간상으로 서로로부터 이격되는 것을 특징으로 하는 에너지 전달 시스템.
- 제 3 항에 있어서, 선택적으로 위치설정가능한 상기 다수의 디플렉터 각각이 선택적으로 틸트가능한 한개 이상의 액츄에이터에 장착되는 반사기를 포함하는 것을 특징으로 하는 에너지 전달 시스템.
- 제 17 항에 있어서, 선택적으로 위치설정가능한 상기 다수의 디플렉터 각각이 선택적으로 틸트가능한 한개 이상의 액츄에이터에 장착되는 반사기를 포함하는 것을 특징으로 하는 에너지 전달 시스템.
- 제 17 항에 있어서, 선택적으로 위치설정가능한 상기 다수의 제 1 디플렉터들의 수가 상기 다수의 빔에 포함된 빔들의 수보다 크며, 상기 다수의 빔들 중 일부 이상이 선택적으로 위치설정가능한 상기 다수의 디플렉터 중 일부 이상에게로 향하며, 이때, 선택적으로 위치설정가능한 상기 다수의 디플렉터 중 다른 일부가 위치재설정되는 것을 특징으로 하는 에너지 전달 시스템.
- 제 5 항에 있어서, 상기 선택가능한 숫자의 빔들 모두가 한 평면에 놓이는 것을 특징으로 하는 에너지 전달 시스템.
- 제 1 항에 있어서, 선택적으로 위치설정가능한 상기 다수의 제 1 디플렉터들이 선택적으로 위치설정가능한 디플렉터들의 2차원 어레이를 포함하는 것을 특징으로 하는 에너지 전달 시스템.
- 제 22 항에 있어서,- 선택적으로 위치설정가능한 상기 다수의 디플렉터들과 상기 한개 이상의 방사 에너지 소스 사이에 광학적으로 삽입되는 고정 디플렉터들의 어레이를 추가로 포함하는 것을 특징으로 하는 에너지 전달 시스템.
- 제 1 항에 있어서, 선택적으로 위치설정가능한 다수의 상기 제 2 디플렉터들이 상기 다수의 제 2 위치에서 상기 기판의 일부분을 제거하도록 상기 다수의 방사 빔을 향하게 하는 것을 특징으로 하는 에너지 전달 시스템.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29745301P | 2001-06-13 | 2001-06-13 | |
| US60/297,453 | 2001-06-13 | ||
| PCT/IL2002/000461 WO2002101888A2 (en) | 2001-06-13 | 2002-06-13 | Multi-beam micro-machining system and method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020037016348A Division KR101012913B1 (ko) | 2001-06-13 | 2002-06-13 | 다중빔 미세가공 시스템 및 방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20090108653A KR20090108653A (ko) | 2009-10-15 |
| KR100938325B1 true KR100938325B1 (ko) | 2010-01-22 |
Family
ID=23146371
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097018127A Expired - Lifetime KR100990300B1 (ko) | 2001-06-13 | 2002-06-13 | 에너지 전달 시스템 |
| KR1020097018128A Expired - Lifetime KR100992262B1 (ko) | 2001-06-13 | 2002-06-13 | 기판 미세가공 시스템 |
| KR1020097018129A Expired - Lifetime KR100938325B1 (ko) | 2001-06-13 | 2002-06-13 | 에너지 전달 시스템 |
| KR1020037016348A Expired - Lifetime KR101012913B1 (ko) | 2001-06-13 | 2002-06-13 | 다중빔 미세가공 시스템 및 방법 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097018127A Expired - Lifetime KR100990300B1 (ko) | 2001-06-13 | 2002-06-13 | 에너지 전달 시스템 |
| KR1020097018128A Expired - Lifetime KR100992262B1 (ko) | 2001-06-13 | 2002-06-13 | 기판 미세가공 시스템 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020037016348A Expired - Lifetime KR101012913B1 (ko) | 2001-06-13 | 2002-06-13 | 다중빔 미세가공 시스템 및 방법 |
Country Status (9)
| Country | Link |
|---|---|
| US (7) | US7642484B2 (ko) |
| EP (1) | EP1451907A4 (ko) |
| JP (2) | JP4113495B2 (ko) |
| KR (4) | KR100990300B1 (ko) |
| CN (1) | CN1538893B (ko) |
| AU (1) | AU2002311597A1 (ko) |
| IL (1) | IL159199A0 (ko) |
| TW (1) | TW574082B (ko) |
| WO (1) | WO2002101888A2 (ko) |
Families Citing this family (98)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8217304B2 (en) * | 2001-03-29 | 2012-07-10 | Gsi Group Corporation | Methods and systems for thermal-based laser processing a multi-material device |
| US7838794B2 (en) | 1999-12-28 | 2010-11-23 | Gsi Group Corporation | Laser-based method and system for removing one or more target link structures |
| US7723642B2 (en) | 1999-12-28 | 2010-05-25 | Gsi Group Corporation | Laser-based system for memory link processing with picosecond lasers |
| US20030222324A1 (en) * | 2000-01-10 | 2003-12-04 | Yunlong Sun | Laser systems for passivation or link processing with a set of laser pulses |
| US20060141681A1 (en) * | 2000-01-10 | 2006-06-29 | Yunlong Sun | Processing a memory link with a set of at least two laser pulses |
| US7671295B2 (en) * | 2000-01-10 | 2010-03-02 | Electro Scientific Industries, Inc. | Processing a memory link with a set of at least two laser pulses |
| US20070173075A1 (en) * | 2001-03-29 | 2007-07-26 | Joohan Lee | Laser-based method and system for processing a multi-material device having conductive link structures |
| KR100990300B1 (ko) * | 2001-06-13 | 2010-10-26 | 오르보테크 엘티디. | 에너지 전달 시스템 |
| EP1280007B1 (en) * | 2001-07-24 | 2008-06-18 | ASML Netherlands B.V. | Imaging apparatus |
| TW529172B (en) | 2001-07-24 | 2003-04-21 | Asml Netherlands Bv | Imaging apparatus |
| AU2003228303A1 (en) * | 2002-03-19 | 2003-10-08 | Lightwave Electronics Corporation | Phase-locked loop control of passively q-switched lasers |
| US6951995B2 (en) | 2002-03-27 | 2005-10-04 | Gsi Lumonics Corp. | Method and system for high-speed, precise micromachining an array of devices |
| US7563695B2 (en) | 2002-03-27 | 2009-07-21 | Gsi Group Corporation | Method and system for high-speed precise laser trimming and scan lens for use therein |
| KR20030095313A (ko) * | 2002-06-07 | 2003-12-18 | 후지 샤신 필름 가부시기가이샤 | 레이저 어닐링장치 및 레이저 박막형성장치 |
| AU2003274671A1 (en) * | 2002-10-28 | 2004-05-13 | Orbotech Ltd. | Selectable area laser assisted processing of substrates |
| JP2004259153A (ja) * | 2003-02-27 | 2004-09-16 | Canon Inc | 情報処理装置とその制御方法及び制御プログラム |
| US6784400B1 (en) * | 2003-03-03 | 2004-08-31 | Paul S. Banks | Method of short pulse hole drilling without a resultant pilot hole and backwall damage |
| DE10317363B3 (de) * | 2003-04-15 | 2004-08-26 | Siemens Ag | Verfahren und Vorrichtung zum Bohren von Löchern in einem elektrischen Schaltungssubstrat |
| US6873398B2 (en) * | 2003-05-21 | 2005-03-29 | Esko-Graphics A/S | Method and apparatus for multi-track imaging using single-mode beams and diffraction-limited optics |
| DE10339472A1 (de) * | 2003-08-27 | 2005-03-24 | Ralph Schmid | Verfahren und Vorrichtung zur Laserbeschriftung |
| US7521651B2 (en) * | 2003-09-12 | 2009-04-21 | Orbotech Ltd | Multiple beam micro-machining system and method |
| US7238913B2 (en) * | 2003-10-17 | 2007-07-03 | Gsi Group Corporation | Flexible scan field |
| JP2005144487A (ja) * | 2003-11-13 | 2005-06-09 | Seiko Epson Corp | レーザ加工装置及びレーザ加工方法 |
| DE10360640B4 (de) * | 2003-12-23 | 2016-02-18 | Jochen Strenkert | Vorrichtung mit einer Einheit zum Betätigen einer verstellbaren Antriebseinheit eines Kraftfahrzeugs |
| US7885311B2 (en) * | 2007-03-27 | 2011-02-08 | Imra America, Inc. | Beam stabilized fiber laser |
| US20060000811A1 (en) * | 2004-06-30 | 2006-01-05 | Matsushita Electric Industrial Co., Ltd. | Diffractive optical element changer for versatile use in laser manufacturing |
| US7525654B2 (en) * | 2004-10-20 | 2009-04-28 | Duquesne University Of The Holy Spirit | Tunable laser-based chemical imaging system |
| US20060191884A1 (en) * | 2005-01-21 | 2006-08-31 | Johnson Shepard D | High-speed, precise, laser-based material processing method and system |
| US7391794B2 (en) * | 2005-05-25 | 2008-06-24 | Jds Uniphase Corporation | Injection seeding of frequency-converted Q-switched laser |
| JP5030512B2 (ja) * | 2005-09-30 | 2012-09-19 | 日立ビアメカニクス株式会社 | レーザ加工方法 |
| US7385768B2 (en) * | 2005-11-22 | 2008-06-10 | D + S Consulting, Inc. | System, method and device for rapid, high precision, large angle beam steering |
| US7945087B2 (en) * | 2006-06-26 | 2011-05-17 | Orbotech Ltd. | Alignment of printed circuit board targets |
| US8084706B2 (en) * | 2006-07-20 | 2011-12-27 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
| JP4917382B2 (ja) * | 2006-08-09 | 2012-04-18 | 株式会社ディスコ | レーザー光線照射装置およびレーザー加工機 |
| KR100791005B1 (ko) * | 2006-12-01 | 2008-01-04 | 삼성전자주식회사 | 사입사 조건에서의 포토마스크의 투과율 측정장치 및 그를이용한 측정방법 |
| JP2008212999A (ja) * | 2007-03-06 | 2008-09-18 | Disco Abrasive Syst Ltd | レーザー加工装置 |
| US7897924B2 (en) * | 2007-04-12 | 2011-03-01 | Imra America, Inc. | Beam scanning imaging method and apparatus |
| DE102007024700A1 (de) * | 2007-05-25 | 2008-12-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Materialbearbeitung mit Laserstrahlung sowie Vorrichtung zur Durchführung des Verfahrens |
| JP4880561B2 (ja) * | 2007-10-03 | 2012-02-22 | 新光電気工業株式会社 | フリップチップ実装装置 |
| JP5259154B2 (ja) * | 2007-10-24 | 2013-08-07 | オリンパス株式会社 | 走査型レーザ顕微鏡 |
| US9123114B2 (en) * | 2007-12-06 | 2015-09-01 | The United States Of America As Represented By The Secretary Of The Army | System and processor implemented method for improved image quality and enhancement based on quantum properties |
| US8390795B2 (en) * | 2008-01-10 | 2013-03-05 | Orbotech Ltd. | Multiple mirror calibration system |
| JP5274085B2 (ja) * | 2008-04-09 | 2013-08-28 | 株式会社アルバック | レーザー加工装置、レーザービームのピッチ可変方法、及びレーザー加工方法 |
| DE102008022014B3 (de) * | 2008-05-02 | 2009-11-26 | Trumpf Laser- Und Systemtechnik Gmbh | Dynamische Strahlumlenkung eines Laserstrahls |
| WO2009153792A2 (en) * | 2008-06-19 | 2009-12-23 | Utilight Ltd. | Light induced patterning |
| WO2010042833A1 (en) * | 2008-10-10 | 2010-04-15 | J.P. Sercel Associates Inc. | Laser machining systems and methods with multiple beamlet laser beam delivery systems |
| WO2010041262A2 (en) * | 2008-10-12 | 2010-04-15 | Utilight Ltd. | Solar cells and method of manufacturing thereof |
| US8680430B2 (en) * | 2008-12-08 | 2014-03-25 | Electro Scientific Industries, Inc. | Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features |
| EP2463051A4 (en) * | 2009-08-03 | 2017-06-14 | Toshiba Kikai Kabushiki Kaisha | Pulse laser machining apparatus and pulse laser machining method |
| KR100958745B1 (ko) * | 2009-11-30 | 2010-05-19 | 방형배 | 레이저를 이용한 스크라이빙 장치, 방법 및 스크라이빙 헤드 |
| WO2011100041A1 (en) * | 2009-12-30 | 2011-08-18 | Resonetics Llc | Laser machining system and method for machining three-dimensional objects from a plurality of directions |
| US9035673B2 (en) * | 2010-01-25 | 2015-05-19 | Palo Alto Research Center Incorporated | Method of in-process intralayer yield detection, interlayer shunt detection and correction |
| US20120102907A1 (en) | 2010-10-28 | 2012-05-03 | Dole Fresh Vegetables, Inc. | Mechanical Produce Harvester |
| JP5727518B2 (ja) * | 2011-01-05 | 2015-06-03 | 清之 近藤 | ビーム加工装置 |
| US8312701B1 (en) | 2011-06-10 | 2012-11-20 | Dole Fresh Vegetables, Inc. | Decoring mechanism with mechanized harvester |
| US9434025B2 (en) | 2011-07-19 | 2016-09-06 | Pratt & Whitney Canada Corp. | Laser drilling methods of shallow-angled holes |
| US20130020291A1 (en) * | 2011-07-19 | 2013-01-24 | Pratt & Whitney Canada Corp. | Laser drilling methods of shallow-angled holes |
| EP2564972B1 (en) * | 2011-09-05 | 2015-08-26 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Marking apparatus with a plurality of lasers, deflection means and telescopic means for each laser beam |
| EP2564975B1 (en) * | 2011-09-05 | 2014-12-10 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Marking apparatus with a plurality of lasers and individually adjustable sets of deflection means |
| DK2565994T3 (en) | 2011-09-05 | 2014-03-10 | Alltec Angewandte Laserlicht Technologie Gmbh | Laser device and method for marking an object |
| EP2564973B1 (en) * | 2011-09-05 | 2014-12-10 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Marking apparatus with a plurality of lasers and a combining deflection device |
| EP2565996B1 (en) | 2011-09-05 | 2013-12-11 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Laser device with a laser unit, and a fluid container for a cooling means of said laser unit |
| EP2565673B1 (en) | 2011-09-05 | 2013-11-13 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Device and method for marking of an object by means of a laser beam |
| ES2544269T3 (es) * | 2011-09-05 | 2015-08-28 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Aparato de marcado con una pluralidad de láseres de gas con tubos de resonancia y medios de deflexión ajustables individualmente |
| EP2564976B1 (en) | 2011-09-05 | 2015-06-10 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Marking apparatus with at least one gas laser and heat dissipator |
| US9442286B2 (en) | 2011-12-22 | 2016-09-13 | Intel Corporation | Spaced configuration of acousto-optic deflectors for laser beam scanning of a semiconductor substrate |
| CN103379681B (zh) * | 2012-04-28 | 2016-03-30 | 清华大学 | 加热垫 |
| US9279722B2 (en) | 2012-04-30 | 2016-03-08 | Agilent Technologies, Inc. | Optical emission system including dichroic beam combiner |
| DE102013206363A1 (de) * | 2013-04-11 | 2014-10-16 | Tesa Scribos Gmbh | Scanvorrichtung |
| JP2015025901A (ja) * | 2013-07-25 | 2015-02-05 | 船井電機株式会社 | レーザ走査装置 |
| CA2890373C (en) | 2013-10-20 | 2022-04-12 | Mtt Innovation Incorporated | Light field projectors and methods |
| EP2902148B1 (en) | 2013-11-25 | 2019-08-28 | Preco, Inc. | High density galvo housing for use with multiple laser beams ; galvo system and laser beam processing system with such housing |
| US10239155B1 (en) * | 2014-04-30 | 2019-03-26 | The Boeing Company | Multiple laser beam processing |
| US9269149B2 (en) | 2014-05-08 | 2016-02-23 | Orbotech Ltd. | Calibration of a direct-imaging system |
| JP6788504B2 (ja) | 2014-05-15 | 2020-11-25 | エムティティ イノベーション インコーポレイテッドMtt Innovation Incorporated | マルチプルプロジェクタシステムのための駆動スキームの最適化 |
| US20150343560A1 (en) * | 2014-06-02 | 2015-12-03 | Fracturelab, Llc | Apparatus and method for controlled laser heating |
| JP6791840B2 (ja) * | 2014-08-14 | 2020-11-25 | エムティティ イノベーション インコーポレイテッドMtt Innovation Incorporated | 光源 |
| HUE044462T2 (hu) * | 2014-10-15 | 2019-10-28 | Inst Nat Sante Rech Med | Eljárás fázisban és amplitúdóban térbeli fénymoduláció létrehozására alkalmas rendszer jellemzõinek meghatározására nagy frissítési frekvenciával |
| US9855626B2 (en) * | 2015-01-29 | 2018-01-02 | Rohr, Inc. | Forming a pattern of apertures in an object with a plurality of laser beams |
| KR101586219B1 (ko) * | 2015-07-02 | 2016-01-19 | 대륭포장산업 주식회사 | Uv 레이저를 이용한 통기성 필름 제조 장치 |
| KR102406333B1 (ko) * | 2016-11-18 | 2022-06-08 | 아이피지 포토닉스 코포레이션 | 재료 가공 레이저 시스템 및 방법 |
| KR102618163B1 (ko) * | 2016-12-05 | 2023-12-27 | 삼성디스플레이 주식회사 | 레이저 가공 장치 |
| MX2020010479A (es) * | 2018-04-10 | 2021-01-20 | Talens Systems S L U | Aparato y método para procesar cartón. |
| TWI892641B (zh) | 2019-01-31 | 2025-08-01 | 美商伊雷克托科學工業股份有限公司 | 光學系統 |
| WO2020178813A1 (en) * | 2019-03-06 | 2020-09-10 | Orbotech Ltd. | High-speed dynamic beam shaping |
| CN113874790B (zh) | 2019-03-29 | 2024-05-28 | 迈康尼股份公司 | 长扫掠长度duv微光刻光束扫描声光偏转器和光学器件设计 |
| DE102019009326B4 (de) * | 2019-04-03 | 2025-08-07 | Ii-Vi Delaware, Inc. | Vorrichtung zur erzeugung eines doppelspots in der lasermaterialbearbeitung |
| DE102019115554A1 (de) * | 2019-06-07 | 2020-12-10 | Bystronic Laser Ag | Bearbeitungsvorrichtung zur Laserbearbeitung eines Werkstücks und Verfahren zur Laserbearbeitung eines Werkstücks |
| DE102020102077B4 (de) | 2020-01-29 | 2022-03-31 | Pulsar Photonics Gmbh | Laserbearbeitungsvorrichtung und Verfahren zur Laserbearbeitung eines Werkstücks |
| BE1027700B1 (fr) * | 2020-04-24 | 2021-05-18 | Laser Eng Applications | Dispositif pour un système optique d’usinage laser |
| DE102020134422A1 (de) * | 2020-12-21 | 2022-06-23 | Trumpf Laser Gmbh | Vorrichtung zur Strahlbeeinflussung eines Laserstrahls |
| KR20230121726A (ko) * | 2020-12-28 | 2023-08-21 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 음향-광학 편향기를 작동시키기 위한 장치 및 방법 |
| FR3121760B1 (fr) * | 2021-04-12 | 2023-12-29 | Commissariat Energie Atomique | Dispositif reflecteur destine a emettre une pluralite de faisceaux reflechis a partir d’un unique faisceau lumineux principal |
| TW202500296A (zh) * | 2021-09-15 | 2025-01-01 | 南韓商Eo科技股份有限公司 | 溝槽形成裝置 |
| FR3128140B1 (fr) | 2021-10-19 | 2024-09-27 | Steelemat S A R L | Dispositif de test non destructif à ultrasons hybride Transducteurs électromagnétiques acoustiques/Laser à assemblage optique rotatif monolithique de transmetteurs laser agiles matriciels pour le contrôle d'objets métallurgiques |
| DE102023210480A1 (de) | 2023-10-24 | 2025-04-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Telezentrische abbildung mehrere lichtstrahlen in einen zielbereich |
| CN118664067B (zh) * | 2024-06-29 | 2025-05-02 | 剑芯光电(苏州)有限公司 | 一种激光分束加工方法及装置 |
| IL314177B2 (en) * | 2024-07-08 | 2026-02-01 | Applied Materials Israel Ltd | Split lighting system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5309178A (en) * | 1992-05-12 | 1994-05-03 | Optrotech Ltd. | Laser marking apparatus including an acoustic modulator |
| US5475416A (en) * | 1992-06-03 | 1995-12-12 | Eastman Kodak Company | Printing system for printing an image with lasers emitting diverging laser beams |
| JPH0847789A (ja) * | 1994-04-14 | 1996-02-20 | Carl Zeiss:Fa | 加工装置 |
| JPH10229266A (ja) * | 1998-03-26 | 1998-08-25 | Matsushita Electric Works Ltd | 回路板の製造方法 |
Family Cites Families (76)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10A (en) * | 1836-08-10 | Bariah Swift | Dye-wood and dye-stuff cutting and shaving machine | |
| US3594081A (en) * | 1968-11-04 | 1971-07-20 | Werner Tschink | Adjustable illuminating device |
| US4060322A (en) * | 1974-07-10 | 1977-11-29 | Canon Kabushiki Kaisha | Image information handling device |
| US4038108A (en) * | 1976-05-10 | 1977-07-26 | Union Carbide Corporation | Method and apparatus for making an instantaneous thermochemical start |
| US4279472A (en) * | 1977-12-05 | 1981-07-21 | Street Graham S B | Laser scanning apparatus with beam position correction |
| JPS5581095A (en) | 1978-12-12 | 1980-06-18 | Ricoh Co Ltd | Ultra-fine hole processing method |
| US4258468A (en) | 1978-12-14 | 1981-03-31 | Western Electric Company, Inc. | Forming vias through multilayer circuit boards |
| DE3138745A1 (de) * | 1981-09-29 | 1983-04-07 | Siemens AG, 1000 Berlin und 8000 München | Akustooptischer lichtablenker mit hoher aufloesung |
| GB2138584B (en) * | 1983-04-23 | 1986-09-17 | Standard Telephones Cables Ltd | Acousto-optic deflector systems |
| US4447291A (en) | 1983-08-31 | 1984-05-08 | Texas Instruments Incorporated | Method for via formation in HgCdTe |
| US4950962A (en) * | 1985-05-20 | 1990-08-21 | Quantum Diagnostics, Ltd. | High voltage switch tube |
| GB2187592B (en) * | 1985-12-26 | 1989-10-18 | Yokogawa Electric Corp | Semiconductor laser wavelength stabilizer |
| US4838631A (en) * | 1986-12-22 | 1989-06-13 | General Electric Company | Laser beam directing system |
| JPH01316415A (ja) * | 1988-06-17 | 1989-12-21 | Nippon Steel Corp | ポリゴンミラーを用いたレーザ熱処理装置及び方法 |
| JP2663560B2 (ja) * | 1988-10-12 | 1997-10-15 | 日本電気株式会社 | レーザ加工装置 |
| JPH082511B2 (ja) * | 1989-05-08 | 1996-01-17 | 松下電器産業株式会社 | レーザ加工装置 |
| JPH03142092A (ja) | 1989-10-25 | 1991-06-17 | Matsushita Electric Ind Co Ltd | レーザ光学系及びこれを用いたレーザ加工方法 |
| US5302798A (en) * | 1991-04-01 | 1994-04-12 | Canon Kabushiki Kaisha | Method of forming a hole with a laser and an apparatus for forming a hole with a laser |
| US5408553A (en) | 1992-08-26 | 1995-04-18 | The United States Of America As Represented By The United States Department Of Energy | Optical power splitter for splitting high power light |
| DE69415484T2 (de) * | 1993-06-04 | 1999-06-24 | Seiko Epson Corp | Vorrichtung und verfahren zum laserbearbeiten |
| US5404247A (en) | 1993-08-02 | 1995-04-04 | International Business Machines Corporation | Telecentric and achromatic f-theta scan lens system and method of use |
| US5460921A (en) | 1993-09-08 | 1995-10-24 | International Business Machines Corporation | High density pattern template: materials and processes for the application of conductive pastes |
| US6037968A (en) * | 1993-11-09 | 2000-03-14 | Markem Corporation | Scanned marking of workpieces |
| US6480334B1 (en) * | 1994-01-18 | 2002-11-12 | Massachusetts Institute Of Technology | Agile beam steering using phased-array-like elements |
| EP0683007B1 (de) | 1994-04-14 | 1998-05-20 | Carl Zeiss | Materialbearbeitungseinrichtung |
| US5614114A (en) | 1994-07-18 | 1997-03-25 | Electro Scientific Industries, Inc. | Laser system and method for plating vias |
| US5841099A (en) * | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
| US5593606A (en) | 1994-07-18 | 1997-01-14 | Electro Scientific Industries, Inc. | Ultraviolet laser system and method for forming vias in multi-layered targets |
| JPH08108289A (ja) | 1994-10-07 | 1996-04-30 | Sumitomo Electric Ind Ltd | レーザ加工用光学装置 |
| US5674414A (en) * | 1994-11-11 | 1997-10-07 | Carl-Zeiss Stiftung | Method and apparatus of irradiating a surface of a workpiece with a plurality of beams |
| JPH08243765A (ja) * | 1995-03-07 | 1996-09-24 | Komatsu Ltd | レーザ刻印装置 |
| US5585019A (en) | 1995-03-10 | 1996-12-17 | Lumonics Inc. | Laser machining of a workpiece through adjacent mask by optical elements creating parallel beams |
| US6373026B1 (en) * | 1996-07-31 | 2002-04-16 | Mitsubishi Denki Kabushiki Kaisha | Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board |
| KR100198832B1 (ko) * | 1995-12-28 | 1999-06-15 | 김덕중 | 레이저 빔을 이용한 용접장치 |
| DE19707834A1 (de) * | 1996-04-09 | 1997-10-16 | Zeiss Carl Fa | Materialbestrahlungsgerät und Verfahren zum Betrieb von Materialbestrahlungsgeräten |
| US5948288A (en) | 1996-05-28 | 1999-09-07 | Komag, Incorporated | Laser disk texturing apparatus |
| US5837962A (en) * | 1996-07-15 | 1998-11-17 | Overbeck; James W. | Faster laser marker employing acousto-optic deflection |
| DE19734983A1 (de) | 1996-09-04 | 1998-03-05 | Zeiss Carl Fa | Optische Anordnung |
| AT407312B (de) * | 1996-11-20 | 2001-02-26 | Sez Semiconduct Equip Zubehoer | Rotierbarer träger für kreisrunde, scheibenförmige gegenstände, insbesondere halbleiterwafer oder -substrate |
| US6233044B1 (en) | 1997-01-21 | 2001-05-15 | Steven R. J. Brueck | Methods and apparatus for integrating optical and interferometric lithography to produce complex patterns |
| US6040552A (en) | 1997-01-30 | 2000-03-21 | Jain; Kanti | High-speed drilling system for micro-via pattern formation, and resulting structure |
| US5973290A (en) * | 1997-02-26 | 1999-10-26 | W. L. Gore & Associates, Inc. | Laser apparatus having improved via processing rate |
| US5948291A (en) | 1997-04-29 | 1999-09-07 | General Scanning, Inc. | Laser beam distributor and computer program for controlling the same |
| KR100446052B1 (ko) | 1997-05-15 | 2004-10-14 | 스미도모쥬기가이고교 가부시키가이샤 | 다수의갈바노스캐너를사용한레이저빔가공장치 |
| US6172331B1 (en) * | 1997-09-17 | 2001-01-09 | General Electric Company | Method and apparatus for laser drilling |
| US5933216A (en) | 1997-10-16 | 1999-08-03 | Anvik Corporation | Double-sided patterning system using dual-wavelength output of an excimer laser |
| US5969877A (en) * | 1997-11-26 | 1999-10-19 | Xerox Corporation | Dual wavelength F-theta scan lens |
| DE19801364A1 (de) | 1998-01-16 | 1999-07-22 | Zeiss Carl Fa | Werkstückbestrahlungsanlage |
| US6037564A (en) * | 1998-03-31 | 2000-03-14 | Matsushita Electric Industrial Co., Ltd. | Method for scanning a beam and an apparatus therefor |
| CN1310871A (zh) * | 1998-08-20 | 2001-08-29 | 奥宝科技有限公司 | 激光重复率放大器 |
| US6252667B1 (en) | 1998-09-18 | 2001-06-26 | Zygo Corporation | Interferometer having a dynamic beam steering assembly |
| US6313918B1 (en) | 1998-09-18 | 2001-11-06 | Zygo Corporation | Single-pass and multi-pass interferometery systems having a dynamic beam-steering assembly for measuring distance, angle, and dispersion |
| JP3945951B2 (ja) * | 1999-01-14 | 2007-07-18 | 日立ビアメカニクス株式会社 | レーザ加工方法およびレーザ加工機 |
| EP1661656B1 (en) * | 1999-04-02 | 2008-03-19 | Murata Manufacturing Co., Ltd. | Laser method for machining through holes only in a ceramic green sheet, the latter provided with a carrier film |
| KR100691924B1 (ko) | 1999-04-27 | 2007-03-09 | 지에스아이 루모닉스 인코퍼레이티드 | 재료 가공 장치 및 방법 |
| JP3346374B2 (ja) * | 1999-06-23 | 2002-11-18 | 住友電気工業株式会社 | レーザ穴開け加工装置 |
| US6295171B1 (en) | 1999-07-09 | 2001-09-25 | Advanced Optical Technologies, Inc. | Piezoelectric light beam deflector |
| EP1072350A1 (de) * | 1999-07-12 | 2001-01-31 | MDC Max Dätwyler AG Bleienbach | Verfahren zur Erzeugung einer Intensitätsverteilung über einen Arbeitslaserstrahl sowie Vorrichtung hierzu |
| EP1224999A4 (en) | 1999-09-28 | 2007-05-02 | Sumitomo Heavy Industries | LASER BORING METHOD AND LASER DRILLING DEVICE |
| JP2001102886A (ja) * | 1999-09-30 | 2001-04-13 | Seiko Epson Corp | 圧電振動素子の電極形成方法及び圧電振動素子の電極形成装置 |
| US6310701B1 (en) * | 1999-10-08 | 2001-10-30 | Nanovia Lp | Method and apparatus for ablating high-density array of vias or indentation in surface of object |
| US6420675B1 (en) | 1999-10-08 | 2002-07-16 | Nanovia, Lp | Control system for ablating high-density array of vias or indentation in surface of object |
| EP1236383A2 (en) * | 1999-12-07 | 2002-09-04 | Electro Scientific Industries, Inc. | Switchable wavelength laser-based etched circuit board processing system |
| US8217304B2 (en) * | 2001-03-29 | 2012-07-10 | Gsi Group Corporation | Methods and systems for thermal-based laser processing a multi-material device |
| US6423935B1 (en) * | 2000-02-18 | 2002-07-23 | The Regents Of The University Of California | Identification marking by means of laser peening |
| US6386992B1 (en) * | 2000-05-04 | 2002-05-14 | Acushnet Company | Golf ball compositions including microcellular materials and methods for making same |
| US6605796B2 (en) * | 2000-05-25 | 2003-08-12 | Westar Photonics | Laser beam shaping device and apparatus for material machining |
| US6696008B2 (en) * | 2000-05-25 | 2004-02-24 | Westar Photonics Inc. | Maskless laser beam patterning ablation of multilayered structures with continuous monitoring of ablation |
| JP4228552B2 (ja) * | 2000-07-04 | 2009-02-25 | 宇部興産株式会社 | 1,5,9−シクロドデカトリエンのエポキシ化反応混合液の精製処理方法 |
| US6329634B1 (en) * | 2000-07-17 | 2001-12-11 | Carl-Zeiss-Stiftung | Workpiece irradiation system |
| US6566627B2 (en) * | 2000-08-11 | 2003-05-20 | Westar Photonics, Inc. | Laser method for shaping of optical lenses |
| US6491361B1 (en) * | 2000-11-09 | 2002-12-10 | Encad, Inc. | Digital media cutter |
| US6515257B1 (en) * | 2001-03-26 | 2003-02-04 | Anvik Corporation | High-speed maskless via generation system |
| KR100990300B1 (ko) * | 2001-06-13 | 2010-10-26 | 오르보테크 엘티디. | 에너지 전달 시스템 |
| US6674564B2 (en) * | 2001-06-15 | 2004-01-06 | Maniabarco, Inc. | System, method and article of manufacture for a beam splitting acousto-optical modulator |
| JP4777826B2 (ja) * | 2006-05-25 | 2011-09-21 | 日本碍子株式会社 | シート加工機 |
-
2002
- 2002-06-13 KR KR1020097018127A patent/KR100990300B1/ko not_active Expired - Lifetime
- 2002-06-13 KR KR1020097018128A patent/KR100992262B1/ko not_active Expired - Lifetime
- 2002-06-13 IL IL15919902A patent/IL159199A0/xx unknown
- 2002-06-13 EP EP02738586A patent/EP1451907A4/en not_active Withdrawn
- 2002-06-13 AU AU2002311597A patent/AU2002311597A1/en not_active Abandoned
- 2002-06-13 US US10/170,212 patent/US7642484B2/en not_active Expired - Fee Related
- 2002-06-13 KR KR1020097018129A patent/KR100938325B1/ko not_active Expired - Lifetime
- 2002-06-13 KR KR1020037016348A patent/KR101012913B1/ko not_active Expired - Lifetime
- 2002-06-13 WO PCT/IL2002/000461 patent/WO2002101888A2/en not_active Ceased
- 2002-06-13 CN CN028155564A patent/CN1538893B/zh not_active Expired - Lifetime
- 2002-06-13 JP JP2003504516A patent/JP4113495B2/ja not_active Expired - Fee Related
- 2002-06-21 TW TW91113617A patent/TW574082B/zh not_active IP Right Cessation
- 2002-10-07 US US10/265,420 patent/US7633036B2/en not_active Expired - Fee Related
- 2002-10-07 US US10/265,455 patent/US7176409B2/en not_active Expired - Lifetime
- 2002-10-07 US US10/265,335 patent/US6809290B2/en not_active Expired - Lifetime
- 2002-10-07 US US10/265,425 patent/US20030047546A1/en not_active Abandoned
-
2003
- 2003-09-02 US US10/652,688 patent/US7629555B2/en not_active Expired - Lifetime
-
2006
- 2006-02-24 US US11/276,356 patent/US20060146395A1/en not_active Abandoned
-
2008
- 2008-02-20 JP JP2008038177A patent/JP5231039B2/ja not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5309178A (en) * | 1992-05-12 | 1994-05-03 | Optrotech Ltd. | Laser marking apparatus including an acoustic modulator |
| US5475416A (en) * | 1992-06-03 | 1995-12-12 | Eastman Kodak Company | Printing system for printing an image with lasers emitting diverging laser beams |
| JPH0847789A (ja) * | 1994-04-14 | 1996-02-20 | Carl Zeiss:Fa | 加工装置 |
| JPH10229266A (ja) * | 1998-03-26 | 1998-08-25 | Matsushita Electric Works Ltd | 回路板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20060146395A1 (en) | 2006-07-06 |
| KR100990300B1 (ko) | 2010-10-26 |
| JP2004533724A (ja) | 2004-11-04 |
| IL159199A0 (en) | 2004-06-01 |
| US20030047546A1 (en) | 2003-03-13 |
| JP4113495B2 (ja) | 2008-07-09 |
| KR100992262B1 (ko) | 2010-11-05 |
| US6809290B2 (en) | 2004-10-26 |
| US7629555B2 (en) | 2009-12-08 |
| AU2002311597A1 (en) | 2002-12-23 |
| EP1451907A2 (en) | 2004-09-01 |
| US7633036B2 (en) | 2009-12-15 |
| WO2002101888A2 (en) | 2002-12-19 |
| KR20040060853A (ko) | 2004-07-06 |
| US20030042230A1 (en) | 2003-03-06 |
| US20030048814A1 (en) | 2003-03-13 |
| JP5231039B2 (ja) | 2013-07-10 |
| KR20090108651A (ko) | 2009-10-15 |
| JP2008207247A (ja) | 2008-09-11 |
| KR101012913B1 (ko) | 2011-02-08 |
| US20030024912A1 (en) | 2003-02-06 |
| EP1451907A4 (en) | 2007-05-09 |
| TW574082B (en) | 2004-02-01 |
| US7642484B2 (en) | 2010-01-05 |
| CN1538893A (zh) | 2004-10-20 |
| US20030019854A1 (en) | 2003-01-30 |
| KR20090108652A (ko) | 2009-10-15 |
| KR20090108653A (ko) | 2009-10-15 |
| CN1538893B (zh) | 2012-01-04 |
| US20040056009A1 (en) | 2004-03-25 |
| US7176409B2 (en) | 2007-02-13 |
| WO2002101888A3 (en) | 2004-05-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100990300B1 (ko) | 에너지 전달 시스템 | |
| KR101115643B1 (ko) | 다중 빔 마이크로 기계 가공 시스템 및 방법 | |
| US10471538B2 (en) | Control of lift ejection angle | |
| CN113518684A (zh) | 高速动态射束整形 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A107 | Divisional application of patent | ||
| A201 | Request for examination | ||
| PA0104 | Divisional application for international application |
Comment text: Divisional Application for International Patent Patent event code: PA01041R01D Patent event date: 20090831 |
|
| PA0201 | Request for examination | ||
| PG1501 | Laying open of application | ||
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20091210 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20100114 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20100114 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| FPAY | Annual fee payment |
Payment date: 20121226 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20121226 Start annual number: 4 End annual number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20131220 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20131220 Start annual number: 5 End annual number: 5 |
|
| FPAY | Annual fee payment |
Payment date: 20141231 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20141231 Start annual number: 6 End annual number: 6 |
|
| FPAY | Annual fee payment |
Payment date: 20151217 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
Payment date: 20151217 Start annual number: 7 End annual number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20161220 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
Payment date: 20161220 Start annual number: 8 End annual number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20171219 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
Payment date: 20171219 Start annual number: 9 End annual number: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20181226 Year of fee payment: 10 |
|
| PR1001 | Payment of annual fee |
Payment date: 20181226 Start annual number: 10 End annual number: 10 |
|
| FPAY | Annual fee payment |
Payment date: 20200103 Year of fee payment: 11 |
|
| PR1001 | Payment of annual fee |
Payment date: 20200103 Start annual number: 11 End annual number: 11 |
|
| PR1001 | Payment of annual fee |
Payment date: 20201231 Start annual number: 12 End annual number: 12 |
|
| PR1001 | Payment of annual fee |
Payment date: 20211229 Start annual number: 13 End annual number: 13 |
|
| PC1801 | Expiration of term |
Termination date: 20221213 Termination category: Expiration of duration |