KR20000000061A - 경화성 에폭시 조성물 - Google Patents
경화성 에폭시 조성물 Download PDFInfo
- Publication number
- KR20000000061A KR20000000061A KR1019990035545A KR19990035545A KR20000000061A KR 20000000061 A KR20000000061 A KR 20000000061A KR 1019990035545 A KR1019990035545 A KR 1019990035545A KR 19990035545 A KR19990035545 A KR 19990035545A KR 20000000061 A KR20000000061 A KR 20000000061A
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- parts
- epoxy
- composition
- pts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
| 중량부 | 실시예 1 | 실시예 2 | 비교예 1 | 비교예 2 |
| 비스페놀A형 에폭시수지 | 17 | 17 | 59 | 59 |
| NBR변성 에폭시수지 | 42 | 42 | 0 | 0 |
| 디시안디아미드 (경화제) | 5 | 5 | 5 | 5 |
| 이미다졸 (경화촉진제) | 2 | 2 | 2 | 2 |
| 감마 글리시드옥시프로필트리메톡시 실란 (커플링제) | 0 | 0.1 | 0 | 0 |
| 도전성 카본블랙 | 1.5 | 1.5 | 1.5 | 0 |
| 실리카 | 17 | 17 | 17 | 17 |
| 탄산칼슘 | 25 | 25 | 25 | 25 |
| 산화칼슘 코팅분말(흡습제) | 4 | 4 | 4 | 4 |
| 벤토니트(흐름방지제) | 5 | 5 | 5 | 5 |
| 에폭시화 대두유(안정화제) | 2 | 2 | 2 | 2 |
| 실시예 1 | 실시예 2 | 비교예 1 | 비교예 2 | |
| 굴곡강도(kgf) | 10.97 | 9.12 | 7.23 | 6.34 |
| 전단강도(kg/cm2) | 156.2 | 146.7 | 123.7 | 131.7 |
| 금속변형 | 거의 없음 | 없음 | 심함 | 심함 |
| 전착도료 피복여부 | ○ | ○ | ○ | × |
Claims (3)
- 분자당 적어도 두개의 에폭시기를 포함하는 하나 또는 그 이상의 에폭시수지 20 중량부 이하, 고무변성 에폭시수지 30-50 중량부, 경화제 2-10 중량부, 도전성 충진제 0.5-10 중량부, 무기충진제 10-50 중량부로 이루어지며, 도전성을 지님을 특징으로 하는 경화성 에폭시 조성물.
- 제1항에 있어서, 실란계 커플링제를 0.1-1 중량부 더 포함하여 경화시 수축률을 더욱 개선함을 특징으로 하는 경화성 에폭시 조성물.
- 제1항과 제2항에 있어서, 경화촉진제 4 중량부 이하, 수분흡수제 3-5 중량부, 흐름방지제 4-7 중량부, 안정화제 3-4 중량부를 더 포함함을 특징으로 하는 경화성 에폭시 조성물.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990035545A KR20000000061A (ko) | 1999-08-26 | 1999-08-26 | 경화성 에폭시 조성물 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990035545A KR20000000061A (ko) | 1999-08-26 | 1999-08-26 | 경화성 에폭시 조성물 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20000000061A true KR20000000061A (ko) | 2000-01-15 |
Family
ID=19608712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019990035545A Ceased KR20000000061A (ko) | 1999-08-26 | 1999-08-26 | 경화성 에폭시 조성물 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20000000061A (ko) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010094688A (ko) * | 2000-04-01 | 2001-11-01 | 이계안 | 도전성 도포형 강판 보강제 실러 조성물 |
| KR100501651B1 (ko) * | 2001-07-09 | 2005-07-18 | 현대자동차주식회사 | 차체 외판 보강용 실러 조성물 |
| KR100633889B1 (ko) * | 2004-07-19 | 2006-10-16 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지 |
| KR100811946B1 (ko) * | 2006-08-24 | 2008-03-10 | 기아자동차주식회사 | 강판 보강용 실러 조성물 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4077927A (en) * | 1974-05-01 | 1978-03-07 | Western Electric Company, Incorporated | Cured epoxy polymer having improved adhesive properties |
| US5250228A (en) * | 1991-11-06 | 1993-10-05 | Raychem Corporation | Conductive polymer composition |
| KR0158033B1 (ko) * | 1994-10-07 | 1999-01-15 | 황국환 | 자동차용 에폭시 수지조성물 |
-
1999
- 1999-08-26 KR KR1019990035545A patent/KR20000000061A/ko not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4077927A (en) * | 1974-05-01 | 1978-03-07 | Western Electric Company, Incorporated | Cured epoxy polymer having improved adhesive properties |
| US5250228A (en) * | 1991-11-06 | 1993-10-05 | Raychem Corporation | Conductive polymer composition |
| US5382384A (en) * | 1991-11-06 | 1995-01-17 | Raychem Corporation | Conductive polymer composition |
| KR0158033B1 (ko) * | 1994-10-07 | 1999-01-15 | 황국환 | 자동차용 에폭시 수지조성물 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010094688A (ko) * | 2000-04-01 | 2001-11-01 | 이계안 | 도전성 도포형 강판 보강제 실러 조성물 |
| KR100501651B1 (ko) * | 2001-07-09 | 2005-07-18 | 현대자동차주식회사 | 차체 외판 보강용 실러 조성물 |
| KR100633889B1 (ko) * | 2004-07-19 | 2006-10-16 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지 |
| KR100811946B1 (ko) * | 2006-08-24 | 2008-03-10 | 기아자동차주식회사 | 강판 보강용 실러 조성물 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3170877B1 (en) | Structural adhesive with improved failure mode | |
| ES2335546T3 (es) | Materiales adhesivos de obturacion a base de cauchos liquidos. | |
| CN102947403B (zh) | 结构粘合剂的改进或涉及它的改进 | |
| EP3170860B1 (en) | Structural adhesive with improved corrosion resistance | |
| US10435600B2 (en) | Epoxy resin compositions for pre-gel ovens | |
| SK4562001A3 (en) | Impact-resistant epoxide resin compositions | |
| KR101806739B1 (ko) | 테이프형 구조용 접착제 조성물 | |
| US20090258985A1 (en) | Compositions for humidity proof heat sealer having low specific gravity | |
| WO1995016741A1 (en) | Sealant and adhesive with damping properties | |
| CN114207076B (zh) | 粘接剂组合物、固化物及接合体 | |
| PT793697E (pt) | Produtos elastomericos com propriedades de isolamento sonoro | |
| KR102445300B1 (ko) | 열 경화성 접착제 조성물과, 접착층을 포함한 구조체 및 이의 제조 방법 | |
| KR20240155849A (ko) | 비경화 및 경화 시의 습윤 노출에 저항성이 있는 에폭시 구조용 접착제 | |
| KR20000000061A (ko) | 경화성 에폭시 조성물 | |
| KR102445301B1 (ko) | 열 경화성 접착제 조성물과, 접착층을 포함한 구조체 및 이의 제조 방법 | |
| JP2020029470A (ja) | 二液混合型硬化性樹脂組成物 | |
| KR102445303B1 (ko) | 열 경화성 접착제 조성물과, 접착층을 포함한 구조체 및 이의 제조 방법 | |
| KR100811946B1 (ko) | 강판 보강용 실러 조성물 | |
| US20240166862A1 (en) | Two-component curable resin composition and cured product thereof | |
| KR100763409B1 (ko) | 재생 폐페인트 분말을 이용한 금속접합용 구조접착 실러조성물 | |
| KR100776325B1 (ko) | 충돌성능을 향상시키는 실란트 조성물 | |
| KR100534884B1 (ko) | 도포형 강판 보강제 실러 조성물 | |
| JPH0441581A (ja) | フレキシブル基板用接着組成物 | |
| KR100895944B1 (ko) | 실리콘 실란트 | |
| KR20010047927A (ko) | 미끄럼방지 고형재 함유 에폭시 조성물 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19990826 |
|
| PA0201 | Request for examination | ||
| G15R | Request for early publication | ||
| PG1501 | Laying open of application |
Comment text: Request for Early Opening Patent event code: PG15011R01I Patent event date: 19991004 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20010927 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20020604 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20010927 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |