KR20010104439A - 폴더형 휴대 전화기의 열 소산 장치 - Google Patents
폴더형 휴대 전화기의 열 소산 장치 Download PDFInfo
- Publication number
- KR20010104439A KR20010104439A KR1020000023213A KR20000023213A KR20010104439A KR 20010104439 A KR20010104439 A KR 20010104439A KR 1020000023213 A KR1020000023213 A KR 1020000023213A KR 20000023213 A KR20000023213 A KR 20000023213A KR 20010104439 A KR20010104439 A KR 20010104439A
- Authority
- KR
- South Korea
- Prior art keywords
- heat
- mobile phone
- phone
- heat dissipation
- heat dispersion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000006185 dispersion Substances 0.000 title 1
- 230000017525 heat dissipation Effects 0.000 claims abstract description 12
- 101100456282 Caenorhabditis elegans mcm-4 gene Proteins 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
- H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
- H04M1/0216—Foldable in one direction, i.e. using a one degree of freedom hinge
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Telephone Set Structure (AREA)
Abstract
Description
Claims (1)
- 힌지(1)(1')가 형성된 두개의 몸체(2)(2')로 휴대 전화기(3)에 있어서, 몸체(2) 내부에 형성된 multi chip module(4)에 히트 파이프(5)를 연결하여, 몸체(2')에 형성된 열 소산판(6)과 몸체(2)(2')의 힌지(1)(1')를 이용하여 결합하여서 된 폴더형 휴대 전화기의 열 소산 장치.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000023213A KR20010104439A (ko) | 2000-04-27 | 2000-04-27 | 폴더형 휴대 전화기의 열 소산 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000023213A KR20010104439A (ko) | 2000-04-27 | 2000-04-27 | 폴더형 휴대 전화기의 열 소산 장치 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20010104439A true KR20010104439A (ko) | 2001-11-26 |
Family
ID=45812020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020000023213A Ceased KR20010104439A (ko) | 2000-04-27 | 2000-04-27 | 폴더형 휴대 전화기의 열 소산 장치 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20010104439A (ko) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7362579B2 (en) * | 2005-03-07 | 2008-04-22 | Samsung Electronics Co., Ltd. | Portable electronic apparatus having a cooling device |
| KR101135567B1 (ko) * | 2010-10-29 | 2012-04-17 | 충남대학교산학협력단 | 휴대용 단말기의 방열메커니즘 |
| US10798849B2 (en) | 2016-02-18 | 2020-10-06 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
| US11627654B2 (en) | 2019-09-03 | 2023-04-11 | Samsung Electronics Co., Ltd. | Electronic device including heat dissipation structure |
-
2000
- 2000-04-27 KR KR1020000023213A patent/KR20010104439A/ko not_active Ceased
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7362579B2 (en) * | 2005-03-07 | 2008-04-22 | Samsung Electronics Co., Ltd. | Portable electronic apparatus having a cooling device |
| KR101135567B1 (ko) * | 2010-10-29 | 2012-04-17 | 충남대학교산학협력단 | 휴대용 단말기의 방열메커니즘 |
| US10798849B2 (en) | 2016-02-18 | 2020-10-06 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
| US11047628B2 (en) | 2016-02-18 | 2021-06-29 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
| US11098959B2 (en) | 2016-02-18 | 2021-08-24 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
| US11555657B2 (en) | 2016-02-18 | 2023-01-17 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
| US11627654B2 (en) | 2019-09-03 | 2023-04-11 | Samsung Electronics Co., Ltd. | Electronic device including heat dissipation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20000427 |
|
| PA0201 | Request for examination | ||
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20020222 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20020430 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20020222 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |