KR20020044080A - 포지티브형 포토레지스트조성물 - Google Patents
포지티브형 포토레지스트조성물 Download PDFInfo
- Publication number
- KR20020044080A KR20020044080A KR1020010076097A KR20010076097A KR20020044080A KR 20020044080 A KR20020044080 A KR 20020044080A KR 1020010076097 A KR1020010076097 A KR 1020010076097A KR 20010076097 A KR20010076097 A KR 20010076097A KR 20020044080 A KR20020044080 A KR 20020044080A
- Authority
- KR
- South Korea
- Prior art keywords
- photoresist composition
- acid
- positive
- monomer unit
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/115—Cationic or anionic
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims (11)
- 유기용매중의 균일용액으로서,(A) 산의 작용에 의해 알칼리수용액에 대한 용해성이 증대하는 수지화합물 100중량부;(B) 방사선조사에 의해 산을 발생가능한 감방사선성 산발생화합물 0.5 내지 30중량부; 및(C) 상기 (A) 및 (B)성분을 용해시키기에 충분한 양의 유기용매를 함유하는 포지티브형 포토레지스트조성물에 있어서,상기 (A)성분이,(a1) 2-알킬-2-아다만틸 (메타)아크릴레이트단위 20 내지 80몰%,(a2) 2-옥소옥사펜틸 (메타)아크릴레이트단위 10 내지 60몰% 및(a3) 1-하이드록시아다만틸 (메타)아크릴레이트단위 10 내지 60몰%의 모노머단위로 이루어진 공중합체인 것을 특징으로 하는 포지티브형 포토레지스트조성물.
- 제 1항에 있어서, 상기 모노머단위(a1)가 하기 일반식:(식중, R1은 수소원자 또는 메틸기이고, R2는 탄소수 1 내지 4의 알킬기임)으로 표시되는 단위인 것을 특징으로 하는 포지티브형 포토레지스트조성물.
- 제 1항에 있어서, 상기 모노머단위(a2)가 하기 일반식:(식중, R1은 수소원자 또는 메틸기임)으로 표시되는 단위인 것을 특징으로 하는 포지티브형 포토레지스트조성물.
- 제 1항에 있어서, 상기 모노머단위(a3)가 하기 일반식:(식중, R1은 수소원자 또는 메틸기이임)으로 표시되는 단위인 것을 특징으로 하는 포지티브형 포토레지스트조성물.
- 제 1항에 있어서, 상기 모노머단위(a1)의 몰분율이 30 내지 60%의 범위인 것을 특징으로 하는 포지티브형 포토레지스트조성물.
- 제 1항에 있어서, 상기 모노머단위(a2)의 몰분율이 20 내지 50%인 것을 특징으로 하는 포지티브형 포토레지스트조성물.
- 제 1항에 있어서, 상기 모노머단위(a3)의 몰분율이 20 내지 40%인 것을 특징으로 하는 포지티브형 포토레지스트조성물.
- 제 1항에 있어서, 상기 (B)성분이 불소화 알킬술폰산을 대응하는 음이온으로 지닌 오늄염화합물인 것을 특징으로 하는 포지티브형 포토레지스트조성물.
- 제 1항에 있어서, 상기 (C)성분이 (c1) 프로필렌글리콜 모노메틸에테르아세테이트, 락트산 에틸 또는 그 조합물과, (c2) γ-부티로락톤을 70:30 내지 95:5의 중량비로 혼합한 혼합물인 것을 특징으로 하는 포지티브형 포토레지스트조성물.
- 제 1항에 있어서, (D) 제 2급 또는 제 3급 지방족 아민화합물을 상기 (A)성분 100중량부에 대해서 0.01 내지 0.2중량부 또 함유하는 것을 특징으로 하는 포지티브형 포토레지스트조성물.
- 제 10항에 있어서, 상기 (D)성분이 트리알칸올 아민인 것을 특징으로 하는 포지티브형 포토레지스트조성물.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2000-00369225 | 2000-12-04 | ||
| JP2000369225A JP3945741B2 (ja) | 2000-12-04 | 2000-12-04 | ポジ型レジスト組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20020044080A true KR20020044080A (ko) | 2002-06-14 |
| KR100489312B1 KR100489312B1 (ko) | 2005-05-17 |
Family
ID=18839294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2001-0076097A Expired - Fee Related KR100489312B1 (ko) | 2000-12-04 | 2001-12-04 | 포지티브형 포토레지스트조성물 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6749989B2 (ko) |
| JP (1) | JP3945741B2 (ko) |
| KR (1) | KR100489312B1 (ko) |
| TW (1) | TWI285793B (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100865997B1 (ko) * | 2003-10-08 | 2008-10-29 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 중합성 화합물, 고분자 화합물 및 포지티브형 레지스트재료, 및 이것을 이용한 패턴 형성 방법 |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7579308B2 (en) * | 1998-07-06 | 2009-08-25 | Ekc/Dupont Electronics Technologies | Compositions and processes for photoresist stripping and residue removal in wafer level packaging |
| JP3901997B2 (ja) * | 2001-11-27 | 2007-04-04 | 富士通株式会社 | レジスト材料、レジストパターン及びその製造方法、並びに、半導体装置及びその製造方法 |
| US7543592B2 (en) * | 2001-12-04 | 2009-06-09 | Ekc Technology, Inc. | Compositions and processes for photoresist stripping and residue removal in wafer level packaging |
| JP3822101B2 (ja) * | 2001-12-26 | 2006-09-13 | 株式会社ルネサステクノロジ | 感放射線組成物及びパタン形成方法及び半導体装置の製造方法 |
| JP2004093832A (ja) * | 2002-08-30 | 2004-03-25 | Renesas Technology Corp | 微細パターン形成材料、微細パターン形成方法および半導体装置の製造方法 |
| JP4637967B2 (ja) * | 2002-12-19 | 2011-02-23 | 東京応化工業株式会社 | ホトレジスト組成物の製造方法 |
| JP4637476B2 (ja) * | 2002-12-19 | 2011-02-23 | 東京応化工業株式会社 | ホトレジスト組成物の製造方法 |
| JP4434762B2 (ja) | 2003-01-31 | 2010-03-17 | 東京応化工業株式会社 | レジスト組成物 |
| DE112004003061B4 (de) * | 2003-02-26 | 2017-04-13 | Tokyo Ohka Kogyo Co., Ltd. | Verwendung einer Positivresist-Zusammensetzung |
| JP2004333548A (ja) * | 2003-04-30 | 2004-11-25 | Tokyo Ohka Kogyo Co Ltd | ポジ型ホトレジスト組成物およびレジストパターン形成方法 |
| TWI300165B (en) * | 2003-08-13 | 2008-08-21 | Tokyo Ohka Kogyo Co Ltd | Resin for resist, positive resist composition and resist pattern formation method |
| JP4694153B2 (ja) * | 2004-04-13 | 2011-06-08 | 東京応化工業株式会社 | 高分子化合物、該高分子化合物を含有するフォトレジスト組成物、およびレジストパターン形成方法 |
| KR100848031B1 (ko) * | 2004-04-13 | 2008-07-23 | 도오꾜오까고오교 가부시끼가이샤 | 고분자 화합물, 이 고분자 화합물을 함유하는 포토레지스트조성물, 및 레지스트 패턴 형성 방법 |
| JP2005300998A (ja) * | 2004-04-13 | 2005-10-27 | Tokyo Ohka Kogyo Co Ltd | ポジ型レジスト組成物及びレジストパターン形成方法 |
| TWI291473B (en) * | 2004-06-08 | 2007-12-21 | Tokyo Ohka Kogyo Co Ltd | Polymer, positive resist composition, and method for forming resist pattern |
| JP4942925B2 (ja) * | 2004-06-18 | 2012-05-30 | 東京応化工業株式会社 | 高分子化合物、ポジ型レジスト組成物及びレジストパターン形成方法 |
| JP4472586B2 (ja) * | 2005-06-20 | 2010-06-02 | 東京応化工業株式会社 | ポジ型レジスト組成物およびレジストパターン形成方法 |
| JP4786238B2 (ja) * | 2005-07-19 | 2011-10-05 | 東京応化工業株式会社 | レジスト組成物の製造方法、ろ過装置、レジスト組成物の塗布装置 |
| US8153346B2 (en) | 2007-02-23 | 2012-04-10 | Fujifilm Electronic Materials, U.S.A., Inc. | Thermally cured underlayer for lithographic application |
| US8182978B2 (en) * | 2009-02-02 | 2012-05-22 | International Business Machines Corporation | Developable bottom antireflective coating compositions especially suitable for ion implant applications |
| US9994538B2 (en) | 2015-02-02 | 2018-06-12 | Basf Se | Latent acids and their use |
| WO2023012864A1 (ja) * | 2021-08-02 | 2023-02-09 | 昭和電工マテリアルズ株式会社 | 配線基板を製造する方法、及び配線基板 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2881969B2 (ja) | 1990-06-05 | 1999-04-12 | 富士通株式会社 | 放射線感光レジストとパターン形成方法 |
| JP3236073B2 (ja) | 1992-06-16 | 2001-12-04 | 富士通株式会社 | レジスト組成物及びそれを用いたパターン形成方法 |
| JPH07196743A (ja) * | 1993-12-28 | 1995-08-01 | Fujitsu Ltd | 放射線感光材料及びパターン形成方法 |
| US6004720A (en) | 1993-12-28 | 1999-12-21 | Fujitsu Limited | Radiation sensitive material and method for forming pattern |
| JPH08262717A (ja) * | 1995-03-27 | 1996-10-11 | Fujitsu Ltd | レジスト組成物及びレジストパターンの形成方法 |
| US6013416A (en) | 1995-06-28 | 2000-01-11 | Fujitsu Limited | Chemically amplified resist compositions and process for the formation of resist patterns |
| JPH09166871A (ja) * | 1995-12-15 | 1997-06-24 | Sumitomo Chem Co Ltd | フォトレジスト組成物 |
| JP3819531B2 (ja) | 1997-05-20 | 2006-09-13 | 富士通株式会社 | レジスト組成物及びレジストパターン形成方法 |
| JP4012600B2 (ja) | 1997-06-23 | 2007-11-21 | 富士通株式会社 | 酸感応性重合体、レジスト組成物、レジストパターン形成方法、および半導体装置の製造方法 |
| JP3948795B2 (ja) * | 1997-09-30 | 2007-07-25 | ダイセル化学工業株式会社 | 放射線感光材料及びそれを用いたパターン形成方法 |
| JP3972438B2 (ja) * | 1998-01-26 | 2007-09-05 | 住友化学株式会社 | 化学増幅型のポジ型レジスト組成物 |
| JP3761322B2 (ja) * | 1998-04-23 | 2006-03-29 | 東京応化工業株式会社 | 化学増幅型ポジ型ホトレジスト |
| JP3876571B2 (ja) | 1998-08-26 | 2007-01-31 | 住友化学株式会社 | 化学増幅型ポジ型レジスト組成物 |
| KR100574574B1 (ko) | 1998-08-26 | 2006-04-28 | 스미또모 가가꾸 가부시키가이샤 | 화학 증폭형 포지티브 내식막 조성물 |
| TWI263866B (en) * | 1999-01-18 | 2006-10-11 | Sumitomo Chemical Co | Chemical amplification type positive resist composition |
| JP2000275843A (ja) * | 1999-03-26 | 2000-10-06 | Sumitomo Chem Co Ltd | 化学増幅型ポジ型レジスト組成物 |
| JP3989132B2 (ja) * | 1999-06-04 | 2007-10-10 | 富士フイルム株式会社 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
| US6479211B1 (en) * | 1999-05-26 | 2002-11-12 | Fuji Photo Film Co., Ltd. | Positive photoresist composition for far ultraviolet exposure |
| JP2001215704A (ja) * | 2000-01-31 | 2001-08-10 | Sumitomo Chem Co Ltd | 化学増幅型ポジ型レジスト組成物 |
| JP3972568B2 (ja) * | 2000-05-09 | 2007-09-05 | 住友化学株式会社 | 化学増幅型ポジ型レジスト組成物及びスルホニウム塩 |
-
2000
- 2000-12-04 JP JP2000369225A patent/JP3945741B2/ja not_active Expired - Lifetime
-
2001
- 2001-11-30 US US09/996,676 patent/US6749989B2/en not_active Expired - Lifetime
- 2001-12-03 TW TW090129852A patent/TWI285793B/zh not_active IP Right Cessation
- 2001-12-04 KR KR10-2001-0076097A patent/KR100489312B1/ko not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100865997B1 (ko) * | 2003-10-08 | 2008-10-29 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 중합성 화합물, 고분자 화합물 및 포지티브형 레지스트재료, 및 이것을 이용한 패턴 형성 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100489312B1 (ko) | 2005-05-17 |
| US20020068238A1 (en) | 2002-06-06 |
| JP3945741B2 (ja) | 2007-07-18 |
| TWI285793B (en) | 2007-08-21 |
| US6749989B2 (en) | 2004-06-15 |
| JP2002169292A (ja) | 2002-06-14 |
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Legal Events
| Date | Code | Title | Description |
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