KR20100052182A - Retractor pin device for semiconductor package mold - Google Patents

Abstract

The present invention relates to a retractor pin device for a semiconductor package molding device, and more particularly, in the manufacture of a semiconductor package using a lead frame, the retractor pin is firmly shaken by the supply pressure of the molding compound resin during the molding process. The present invention relates to a retractor pin device for a semiconductor package molding device, which can easily prevent a defect from occurring during a molding process.

That is, according to the present invention, the retractor pin driving means which catches the chip mounting plate from being shaken by the supply pressure of the molding compound resin in the molding process during the semiconductor package manufacturing process using the lead frame is mechanically installed in the lower mold. It is possible to reduce the installation cost by eliminating the servo motor that raises and lowers the retractor pins and the control unit having control programming for lifting and lowering of the retractor pins. To provide a tractor pin device.

Description

Retractor pin device for semiconductor package molding device {RETRACTOR PIN DEVICE FOR SEMICONDUCTOR PACKAGE MOLD}

The present invention relates to a retractor pin device for a semiconductor package molding device, and more particularly, in the manufacture of a semiconductor package using a lead frame, the retractor pin is firmly shaken by the supply pressure of the molding compound resin during the molding process. The present invention relates to a retractor pin device for a semiconductor package molding device, which can easily prevent a defect from occurring during a molding process.

In general, as a kind of substrate for manufacturing a semiconductor package, a lead frame is formed by integrally connecting the side frames forming the entire skeleton, the chip mounting plate to which the semiconductor chip is mounted and bonded, and the positions of the vertices of the side frame and the chip mounting plate. It comprises a tie bar and a plurality of leads and the like arranged adjacent to four corners of the chip mounting plate from the side frame.

Recently, the semiconductor package has been made thinner and smaller in order to be applied to small electronic devices such as mobile phones, digital cameras, laptops, and the like, and leadframes for manufacturing semiconductor packages have been manufactured with very small structures. In addition, the structure is designed and manufactured according to the type of package, such as a structure that can improve the heat dissipation effect, a structure that can increase the bonding strength with the molding compound resin.

Looking at the manufacturing process of the semiconductor package using the lead frame briefly, a chip attaching step of attaching the semiconductor chip by the adhesive means such as epoxy resin on the chip mounting plate of the lead frame, and between the bonding pad of the semiconductor chip and the lead of the lead frame Wire bonding process for connecting the wires to the gold wire for electrical signal exchange, and the like, and a molding process for wrapping the molding compound resin to protect the semiconductor chip and the wire from the outside.

Here, the mold structure used in the molding process of the semiconductor package manufacturing process will be described.

1 is a cross-sectional view showing a mold structure used in a conventional molding process.

Conventional molds are divided into upper molds and lower molds.

The upper mold includes a first upper mold 10 having an upper cavity 12 filled with a molding compound resin, and a retractor pin 22 arranged above the first upper mold 10. And a retractor pin plate 20 and a second upper mold 30 arranged above the retractor pin plate 20 and having an eject pin 32 assembled thereon.

In addition, a retractor pin 22 assembled to the retractor pin plate 20 is inserted into and lifted from the upper surface of the first upper die 10 to a side of the upper side 12 of the upper cavity 12. A guide hole 14 penetrates through the center of the upper cavity 12 on the upper surface of the first upper mold 10 as a path through which the eject pin 32 assembled to the second upper mold 30 is inserted and lifted. Until the second guide hole 16 is formed through.

In addition, the retractor pin plate 20 is assembled with a servo motor 76 that adjusts the lifting movement distance and the lifting drive means of the retractor pin 22.

The lower mold has a first lower mold 40 having a lower cavity 42 corresponding to the upper cavity 12 up and down, and is positioned below the first lower mold 40 and supports the first lower mold 40. The second lower mold 50 and the lower lower mold 50 are positioned below the second lower mold 50 so as to pressurize the molding compound resin while pressing and supporting the first and second lower molds 40 and 50 toward the first upper mold 10. And a plunger plate 60 having a plunger 66.

In this case, a central supply port 44 for supplying the molding compound resin to the lower cavity 42 of the first lower mold 40 is formed at the center of the first lower mold 40, and The central portion is formed with a plunger elevating path in which the upper end of the plunger 66 for pressurizing the molding compound resin supplied to the supply port 44 is embedded.

In particular, the upper end of the plunger plate 60 is fixed to the lower end of the plunger 66 in the plunger elevating path of the second lower mold 50, the plunger plate and the plunger plate 60 side A hydraulic cylinder 98 for lifting up and down is assembled.

Referring to the operational flow for a conventional mold having such a configuration is as follows.

First, when the first upper mold 10 and the first lower mold 40 are in close contact with each other, a lead frame in which a chip attaching process and a wire bonding process are completed in the upper cavity 12 and the lower cavity 42 is clamped and arranged. In this state, the solid molding compound resin supplied to the central supply port 44 of the first lower mold 40 is melted by a heater (not shown), and at the same time, the hydraulic cylinder 98 The plunger 66 mounted on the plunger plate 60 presses the molding compound resin to a predetermined pressure by the lifting operation.

At this time, the inner lead 94 in the one side space in the upper cavity 12 of the first upper die 10 and the lower cavity 42 of the first lower die 40 forming one molding space corresponding to each other. And one side end of the chip mounting plate 92 which is integrally connected by the inner lead and the tie bar, and at the same time, the upper cavity 12 of the first upper mold 10 and the lower cavity of the first lower mold 40 Within the space 42, the other end of the chip mounting plate 92 is positioned as if floating in the air.

Therefore, since the other end of the chip mounting plate 92 is floating in the air like a free end, it is easily flowed by the flow pressure of the molding compound resin filled in the upper cavity 12 and the lower cavity 42, As a result, a phenomenon in which the chip mounting plate is bent or deformed may occur, and a defect may occur in which an interface between the chip mounting plate and the molding compound resin is peeled off.

In view of this, the lower end of the retractor pin 22 assembled to the retractor pin plate 20 passes through the first guide hole 14 formed in the first upper die 10 and at the same time. The upper cavity 12 of the upper die 10 and the lower cavity 42 of the first lower die 40 are in close contact with the upper surface of the other end of the chip mounting plate 92 to catch the flow of the chip mounting plate 92. The role is to give.

That is, the molding compound resin 74 is filled in the upper cavity 12 and the lower cavity 42, but gradually filled from the bottom of the chip mounting plate 92 according to the position of the mold gate, the molding compound The flow pressure of the resin 74 acts upward from the bottom of the chip mounting plate, and even if the flow pressure of the molding compound resin 74 is applied from the bottom of the chip mounting plate, the retractor pin 22 Since the lower end is in close contact with the upper surface of the chip mounting plate 92, the chip mounting plate is not shaken even by the flow pressure of the molding compound resin.

In this way, when the molding compound resin 74 is filled in the upper cavity 12 and the lower cavity 42, for example, at a predetermined level of about 80% or more, the mold program of the controller to automatically advance the mold process. As a result, the servomotor 76 assembled to the retractor pin plate 20 is operated.

Thus, the retractor pin plate 20 is raised by the driving of the servo motor 76, and at the same time the retractor pin 22 assembled to the retractor pin plate 20 is raised together. The lower end of the retractor pin 22 is also lifted out of the upper cavity 12 of the first upper die 10.

Subsequently, when the molding compound resin 74 is almost filled in the upper and lower cavities 12 and 42, the retractor pin 22 is moved to the retractor pin plate 20 by driving the servomotor 76. With a gradual rise, it completely exits the upper cavity 12, and the semiconductor chip, the chip mounting plate 92 on which the semiconductor chip is mounted, the wire, the inner lead 94, and the like are wrapped with the molding compound resin 74. It is possible.

Thereafter, the first lower mold 40 and the plunger plate 60 are lowered and at the same time, the semiconductor package in which the molding process is completed by the pressing force of the eject pin 32 assembled to the second upper mold 30 is easily demolded from the upper cavity. It is done.

However, the conventional mold having the configuration and operation relationship as described above has the following problems.

First, as a driving device for raising and lowering the retractor pin for holding the chip mounting plate, there is a disadvantage in that the cost of using a servo motor assembled to the retractor pin plate is high.

In both cases, there is a costly disadvantage of establishing a means for detecting that the molding compound resin is filled above a predetermined level in the upper and lower cavities and the operation programming of the control unit for controlling the same.

Third, as the servomotor, which is the lifting drive means of the retractor pin, is assembled in the mold, there is a disadvantage in that the weight and volume of the mold facility itself increase.

The present invention has been made in view of the above, and in the process of manufacturing a semiconductor package using a lead frame, the drive means of the retractor pin to hold the chip mounting plate to shake in accordance with the supply pressure of the molding compound resin during the molding process By mechanically in-mold in the mold, it is possible to reduce the installation cost by eliminating the servomotor that raises and lowers the existing retractor pins and the control unit having control programming for the lifting and lowering operation of the retractor pins, thereby minimizing the mold facility itself. It is an object of the present invention to provide a retractor pin device for a semiconductor package molding device.

The present invention for achieving the above object and the retractor pin plate 20 in conjunction with the vertical motion of the plunger plate 60 by the linkage device; The semiconductor package molding is characterized in that it comprises a retractor pin 22 fixed to the retractor pin plate 20 to move up and down in the cavity 12 in accordance with the up and down movement of the retractor pin plate 20. Provided is a retractor pin device for a device.

In a preferred embodiment, the linkage comprises: a lower retractor return pin (62) fixed to the plunger plate (60); And an upper retractor return pin 24 fixed to the retractor pin plate 20, wherein the lower retractor return pin 62 and the upper retractor return pin 24 are spaced at predetermined intervals. do.

In addition, the predetermined interval between the lower retractor return pin 62 and the upper retractor return pin 24 is characterized in that to adjust the lifting time of the retractor pin 22.

In addition, the upper end of the lower retractor return pin 62 is characterized in that the insert 64 for adjusting the lifting time of the retractor pin 22 is assembled replaceably.

In another preferred embodiment, the retractor pin plate 20 further comprises a pressing means for pressing downward, the pressing means is a first assembly hole 26 vertically penetrated through the retractor pin plate 20 ); A head portion 82 positioned on a bottom surface of the retractor pin plate 20, a rod portion 84 integrally formed on an upper surface of the head portion 82 and continuously inserted into the first assembly hole 26, And a connecting rod (80) having a finger tip (86) fixed to an upper end of the rod (84); A return spring (72) inserted into an outer diameter of the rod (84) of the connecting rod (80) and elastically supported between an upper surface of the retractor pin plate (20) and a finger tip (86) of the connecting rod (80); .

In addition, the second assembly 30 is provided with a second assembling hole 36 vertically penetrated, the connecting rod 80 is characterized in that it is inserted into the second assembly hole (36).

In addition, the elastic member 70 for elastic support of the retractor return pin is characterized in that it is embedded in at least one of the retractor pin plate 20 and the plunger plate 60.

Through the above problem solving means, the present invention provides the following effects.

According to the present invention, as a driving means of the retractor pin to hold the chip mounting plate to shake due to the supply pressure of the molding compound resin in the molding process of the semiconductor package, the upper retractor return pin is built in the upper mold, the lower retractor return By incorporating the pin into the lower mold, the retractor pin can easily hold the chip mounting plate by interlocking the upper and lower retractor return pins.

In particular, as the driving device for raising and lowering the retractor pin for holding the chip mounting plate, there is an advantage that the cost is greatly reduced as it is not necessary to build a conventional operation of the servo motor and a control unit for controlling the same.

In addition, since the servomotor and the like, which are driving means for the conventional retractor pins, are excluded from the mold, miniaturization of the mold facility can be realized.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view showing a pre-operational state of a mold for manufacturing a semiconductor package according to the present invention, FIG. 3 is a cross-sectional view showing a post-operational state, FIG. 4 is an enlarged view of a portion “A” of FIG. 5 is an enlarged view of a portion “B” of FIG. 3.

The mold for manufacturing a semiconductor package according to the present invention is divided into an upper mold and a lower mold, but a conventional servomotor and a controller for controlling the same are excluded.

First, the configuration of the upper mold is as follows.

The upper mold includes a first upper mold 10, a retractor pin plate 20, and a second upper mold 30 arranged in such a manner as to be sequentially stacked from the bottom to the upper mold.

The first upper mold 10 has a recessed upper cavity 12 in which a molding compound resin is filled on its bottom surface.

In addition, a first guide hole 14 penetrates from an upper surface of the first upper mold 10 to one side of the upper cavity 12, and an eject pin 32 assembled into the second upper mold 30 is inserted. The second guide hole 16 penetrates from the upper surface of the first upper die 10 to the center portion of the upper cavity 12 as a path for lifting up and down.

In particular, the third guide hole 18 penetrates up and down at a predetermined position around the upper cavity 12 on the upper surface of the first upper die 10.

At this time, the upper end of the retractor pin 22 is integrally assembled to the bottom of the retractor pin plate 20, the middle portion of the retractor pin 22 is the first guide of the first upper die 10 Inserted into the hole 14, the lower end of the retractor pin 22 is positioned in the upper cavity 12 until the molding compound resin is completely filled in the upper cavity 12 as described below.

In addition, an upper end of the upper retractor return pin 24 inserted into the third guide hole 18 to be lowered and lowered is integrally assembled on the bottom of the retractor pin plate 20, and the upper retractor return pin is integrally assembled. The lower surface of the 24 is exposed through the lower opening of the third guide hole 18.

In addition, an eject pin, which is a type of demolding means that is inserted into the second guide hole 16 of the retractor pin plate 20 and pushes the molding surface of the semiconductor package in which the molding process is completed, is formed on the bottom surface of the second upper die 30. 32 is assembled.

On the other hand, the pressing means for providing an elastic force for pressing the retractor pin plate 20 toward the first upper die 10 is assembled between the retractor pin plate 20 and the second upper die 30.

More specifically, the first assembly hole 26 of the configuration of the pressing means is formed through the predetermined position of the retractor pin plate 20, the first assembly hole 26 and the first corresponding up and down The two assembling holes 36 are formed through the second upper die 30 at a predetermined position.

In addition, a connecting rod 80 is installed over the first and second assembly holes 26 and 36, and the connecting rod 80 has a head part having a predetermined thickness located on a bottom surface of the retractor pin plate 20. 82, a rod portion 84 which is integrally formed on an upper surface of the head portion 82 and continuously inserted into the first assembling hole 26 and the second assembling hole 36, and the rod portion 84 It is formed integrally at the upper end of the second end of the assembly hole 36 is fixed to the press-fitting 86.

At this time, the return spring 72 is inserted into the outer diameter of the rod portion 84 of the connecting rod 80, the return spring 72 is the upper end of the retractor pin plate 20 and the outer end of the connecting rod 80 It is supported between the 86 and exerts an elastic force.

Therefore, the head portion 82 of the connecting rod 80 is arranged between the upper surface of the first upper die 10 and the bottom surface of the retractor pin plate 20, thereby retracting the retractor pin plate 20 to the first upper die 10. The retractor pin plate 20 is lowered again by the elastic restoring force of the return spring 72 which has been compressed together with its own weight.

The operation of the pressing means will be described in more detail in the following description of the operation relationship.

Here, look at the configuration for the lower mold as follows.

A first lower mold 40 is arranged on the uppermost side of the lower mold, and a lower cavity 42 corresponding to the upper cavity 12 is formed in a concave shape on the upper surface of the first lower mold 40. In the central portion of the lower mold 40, a supply port 44 is formed in the upper and lower cavities 12 and 42 to supply molding compound resin.

A second lower mold 50 is arranged below the first lower mold 40, and the second lower mold 50 has a third guide hole 18 which is vertically aligned with the third guide hole 18 of the first upper mold 10. Four guide holes 52 are formed therein, and a plunger 66 for pressing the molding compound resin in the supply port 44 is inserted at the center of the second lower mold 50.

In addition, since the plunger plate 60 is arranged below the second lower mold 50, a lower end of the plunger 66 is assembled to a central portion of the upper surface of the plunger plate 60, and the lower retractor has a predetermined length. The lower end of the return pin 62 is assembled.

At this time, the upper end portion of the lower retractor return pin 62 faces the lower end of the upper retractor return pin 24 inserted into the third guide hole 18 of the first upper die 18. The fourth guide hole 52 is inserted into the state.

In particular, as shown in Figure 7 attached to the upper end of the lower retractor return pin 62, the insert 64 for adjusting the lifting distance of the retractor pin 22 is replaceably assembled.

For example, a bolt hole may be formed in the insert 64, and a bolt hole may also be formed on an upper surface of the lower retractor return pin 62 to be assembled to each other using a headless bolt.

Therefore, the elevating timing of the retractor pin 22 can be easily adjusted by simply replacing only the insert 64.

On the other hand, a support spring 70 in which a lower end of the lower retractor return pin 62 is elastically supported is provided at a predetermined position on the upper surface of the plunger plate 60, and the support spring 70 is formed on the lower reel. When the tractor return pin 62 moves up and down when the plunger plate 60 is lifted to push the lower end of the upper retractor return pin 24 to balance the lower retractor return pin 62. Play a role.

That is, according to the amount of the molding compound resin filled in the supply port 44 of the first lower mold 40, the plunger 66 of the plunger plate 60 is raised and lowered, thereby causing a deviation in the force for pressing the molding compound resin. As such, even if the deviation of the pressing force is transmitted to the lower retractor return pin 62, the deviation of the pressing force is absorbed by the support spring 70, so that the lower retractor return pin 62 is finally connected to the upper retractor. The tractor return pin 24 can be easily pushed up.

Here, a description will be given of the operation relationship for the mold for manufacturing a semiconductor package of the present invention having the above configuration.

6A to 6D are enlarged cross-sectional views illustrating main parts of an operation of a retractor pin of a mold for manufacturing a semiconductor package according to the present invention, in order.

First, the semiconductor chip is attached to the chip mounting plate 92, and the lead frame 90 after the bonding pad and the lead 94 of the semiconductor chip are connected with the conductive wire is connected to the upper cavity 12 of the first upper mold 10. And the mold to be positioned in the lower cavity 42 of the second lower mold 20.

At this time, in the upper cavity 12 of the first upper mold 10 and the lower cavity 22 of the first lower mold 20, the inner lead 94 and the inner lead 94 and the tie bar are formed in one space thereof. One side end of the chip mounting plate 92 connected integrally is located, and at the same time, the other side space in the upper cavity 12 of the first upper die 10 and the lower cavity 22 of the first lower die 20. The other end of the chip mounting plate 92 is positioned as if floating in the air.

Thus, the retractor pin 22 assembled to the retractor pin plate 20 passes through the first guide hole 14 of the first upper die 10 and is attached as shown in FIG. 6A. The lower end of the pin is introduced into the upper cavity 12 of the first upper mold 10 to be in close contact with the upper surface of the chip mounting plate 92 to be in a state of catching the shaking of the chip mounting plate 92.

Subsequently, in a state in which the molding compound resin 74 in the solid state is supplied to the supply port 44 formed in the center portion of the first lower mold 40, the molding compound resin is gradually melted by the temperature of the mold itself in a high temperature state. At the same time, the plunger plate 60 is raised by the upward operation of the hydraulic cylinder 98, and the plunger 66 mounted on the plunger plate 60 presses the molding compound resin 74 at a predetermined pressure. Will be pressed.

Subsequently, as shown in FIG. 6B, the molding compound resin 74 is formed through the mold gate 96 formed along the clamping interface portion of the first upper mold 10 and the second lower mold 20. And the lower cavity (12, 42) is gradually filled, wherein the retractor pin 22 is the chip mounting plate even if the flow pressure of the molding compound resin 74 acts on the bottom surface of the chip mounting plate 92 Since the upper surface of the 92 is not shaken, the chip mounting plate 92 is easily maintained in position.

During this molding process, the lower end of the retractor return pin 62 is supported by the support spring 70 on the plunger plate 60, and the assembled lower retractor return pin 62 also rises together with the plunger plate 60.

Subsequently, when the molding compound resin 74 is filled in the upper and lower cavities 12 and 42, but filled to a predetermined level or more, for example, about 80%, the lower retractor return pin 62 The bottom of the upper retractor return pin 24 is in contact with and pushed up.

At the same time, when the upper retractor return pin 24 is pushed up along the third guide hole 18 of the first upper die 10, the retractor pin plate 20 assembled with the upper retractor return pin 24 ) Is also pushed up to the same height, and also the retractor pin 22 assembled to the retractor pin plate 20 is also elevated to the same height.

Thus, the retractor pin 22 is separated from the chip mounting plate 92 and ascends upward from the upper cavity 12 of the first upper mold 10 via the first guide hole 14.

At this time, even if the retractor pin 22 is separated from the chip mounting plate 92, the chip mounting plate 92 is wrapped and molded by the molding compound resin 74 as shown in FIG. 6C. Therefore, the shaking phenomenon no longer occurs.

Subsequently, when the molding compound resin 74 is completely filled in the upper and lower cavities 12 and 42 as shown in FIG. 6D, the retractor pins 22 completely close the upper cavity 12. Get out.

After the molding process by the molding compound resin is completed, the plunger plate 60 is lowered by the driving of the hydraulic cylinder 98 to demold the molded semiconductor package from the upper and lower cavities 12 and 42. The retractor pin plate 10 and the retractor pin 22 are moved back into position by the elastic restoring force of the spring 70, and the molding operation as described above is repeated.

As described above, according to the present invention, the upper retractor return pin 24 is installed on the upper mold side, and the lower retractor return pin 62 is installed on the lower mold side, so that the upper and lower retractor return pins 24, 62 are installed. Since the retractor pin 22 holding the chip mounting plate 92 can be easily lifted by the mutual interlocking operation of the servomotor and the servo motor as a lifting and lowering driving means of the retractor pin holding the chip mounting plate in the related art, It is not necessary to establish operation programming of the control unit for controlling, so that the cost can be greatly reduced and the size of the facility itself can be realized.

1 is a cross-sectional view showing a mold for manufacturing a conventional semiconductor package,

2 is a cross-sectional view showing a state before operation of the retractor pin device for a semiconductor package molding apparatus according to the present invention;

3 is a cross-sectional view showing a state after an operation of a retractor pin device for a semiconductor package molding apparatus;

4 is an enlarged view of a portion “A” of FIG. 2;

5 is an enlarged view of a portion “B” of FIG. 3;

6A to 6D are enlarged cross-sectional views of principal parts illustrating the operations of the retractor pins of the mold for manufacturing a semiconductor package according to the present invention in order;

7 is an enlarged cross-sectional view illustrating main parts explaining that inserts are replaceably assembled to a lower retractor return pin employed in a mold for manufacturing a semiconductor package according to the present invention;

<Explanation of symbols for the main parts of the drawings>

10: first upper type 12: upper cavity

14: 1st guide hall 16: 2nd guide hall

18: third guide hole 20: retractor pin plate

22: retractor pin 24: upper retractor return pin

26: 1st assembly hole 30: 2nd upper type

32: eject pin 36: second assembling hole

40: first lower type 42: lower cavity

44: supply port 50: the second lower type

52: fourth guide hole 60: plunger plate

62: lower retractor return pin 64: insert

66: plunger 70: support spring

72: return spring 74: molding compound resin

76: servo motor 80: connecting rod

82: head portion 84: rod portion

86: bullet tip 90: lead frame

92 chip mounting plate 94 lead

96: mold gate 98: hydraulic cylinder

Claims (8)

A retractor pin plate 20 interlocked with the vertical movement of the plunger plate 60 by an interlocking device; The semiconductor package molding is characterized in that it comprises a retractor pin 22 fixed to the retractor pin plate 20 to move up and down in the cavity 12 in accordance with the up and down movement of the retractor pin plate 20. Retractor pin device for the device. The method according to claim 1, The interlock is: A lower retractor return pin (62) fixed to the plunger plate (60); An upper retractor return pin 24 fixed to the retractor pin plate 20, And the lower retractor return pin (62) and the upper retractor return pin (24) are spaced at predetermined intervals. 3. The semiconductor package molding of claim 2, wherein a predetermined distance between the lower retractor return pin 62 and the upper retractor return pin 24 is to adjust a lift timing of the retractor pin 22. Retractor pin device for the device. The method according to claim 3, Mold for manufacturing a semiconductor package, characterized in that the insert (64) for adjusting the lifting time of the retractor pin (22) is replaceably assembled on the upper end of the lower retractor return pin (62). The method according to claim 1, Retractor pin apparatus for a semiconductor package molding device, characterized in that it further comprises a pressing means for pressing the retractor pin plate 20 downward. The method according to claim 5, The pressing means, A first assembly hole 26 vertically penetrating the retractor pin plate 20; A head portion 82 positioned on a bottom surface of the retractor pin plate 20, a rod portion 84 integrally formed on an upper surface of the head portion 82 and continuously inserted into the first assembly hole 26, And a connecting rod (80) having a finger tip (86) fixed to an upper end of the rod (84); A return spring (72) inserted into an outer diameter of the rod (84) of the connecting rod (80) and elastically supported between an upper surface of the retractor pin plate (20) and a finger tip (86) of the connecting rod (80); Retractor pin device for semiconductor package molding device, characterized in that consisting of. The method according to claim 6, And a second assembly hole 36 vertically penetrated through the second upper mold 30, and the connecting rod 80 is inserted into the second assembly hole 36. Tractor pin device. The method according to claim 1, The retractor pin device for the semiconductor package molding apparatus, characterized in that the elastic member 70 for elastic support of the retractor return pin is built in at least one of the retractor pin plate 20 and the plunger plate 60. .

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