KR20150118582A - 감광성 수지 조성물, 그것을 열경화시켜서 이루어지는 보호막 또는 절연막, 그것을 사용한 터치 패널 및 그 제조 방법 - Google Patents

감광성 수지 조성물, 그것을 열경화시켜서 이루어지는 보호막 또는 절연막, 그것을 사용한 터치 패널 및 그 제조 방법 Download PDF

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KR20150118582A
KR20150118582A KR1020157017378A KR20157017378A KR20150118582A KR 20150118582 A KR20150118582 A KR 20150118582A KR 1020157017378 A KR1020157017378 A KR 1020157017378A KR 20157017378 A KR20157017378 A KR 20157017378A KR 20150118582 A KR20150118582 A KR 20150118582A
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South Korea
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group
carbon atoms
compound
resistance
maleimide
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Korean (ko)
Inventor
유고 타니가키
타케노리 후지와라
미츠히토 스와
쇼 후쿠하라
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도레이 카부시키가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
KR1020157017378A 2013-02-12 2014-01-22 감광성 수지 조성물, 그것을 열경화시켜서 이루어지는 보호막 또는 절연막, 그것을 사용한 터치 패널 및 그 제조 방법 Withdrawn KR20150118582A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-024039 2013-02-12
JP2013024039 2013-02-12
PCT/JP2014/051249 WO2014125884A1 (fr) 2013-02-12 2014-01-22 Composition de résine photosensible, film protecteur ou film isolant obtenu par thermodurcissement de ladite composition, écran tactile utilisant ledit film et procédé de production pour ledit écran tactile

Publications (1)

Publication Number Publication Date
KR20150118582A true KR20150118582A (ko) 2015-10-22

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KR1020157017378A Withdrawn KR20150118582A (ko) 2013-02-12 2014-01-22 감광성 수지 조성물, 그것을 열경화시켜서 이루어지는 보호막 또는 절연막, 그것을 사용한 터치 패널 및 그 제조 방법

Country Status (5)

Country Link
JP (1) JP6319082B2 (fr)
KR (1) KR20150118582A (fr)
CN (1) CN104981737A (fr)
TW (1) TWI596427B (fr)
WO (1) WO2014125884A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
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KR20180071807A (ko) * 2016-12-20 2018-06-28 솔브레인 주식회사 오버코팅 조성물 및 이를 이용하여 제조된 도전막
KR20180134196A (ko) * 2017-06-08 2018-12-18 마이크로크래프트코리아 주식회사 잉크젯용 수지 조성물 및 이를 이용하여 제조된 인쇄 배선판

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JP6417669B2 (ja) * 2013-03-05 2018-11-07 東レ株式会社 感光性樹脂組成物、保護膜及び絶縁膜並びにタッチパネルの製造方法
WO2015129443A1 (fr) * 2014-02-26 2015-09-03 株式会社日本触媒 Composition de résine durcissable et utilisation associée
TWI512058B (zh) * 2014-12-25 2015-12-11 Chi Mei Corp 光硬化性塗佈組成物、光硬化塗佈膜及觸控面板
CN107849361B (zh) 2015-07-06 2020-10-16 三菱瓦斯化学株式会社 树脂组合物、预浸料、树脂片、覆金属箔层叠板和印刷电路板
JP6714493B2 (ja) * 2015-12-24 2020-06-24 信越化学工業株式会社 有機膜形成用化合物、有機膜形成用組成物、有機膜形成方法、及びパターン形成方法
CN107957655A (zh) * 2016-10-18 2018-04-24 广州亦盛环保科技有限公司 一种3d盖板玻璃用负型感光性白色油墨及其制备方法、使用方法
TWI778031B (zh) * 2017-03-17 2022-09-21 日商大阪有機化學工業股份有限公司 感光性樹脂組成物及聚合性（甲基）丙烯酸系聚合物
KR102254366B1 (ko) * 2017-03-28 2021-05-24 도레이 카부시키가이샤 감광성 수지 조성물, 경화막, 경화막을 구비하는 소자, 경화막을 구비하는 유기 el 표시 장치, 경화막의 제조 방법, 및 유기 el 표시 장치의 제조 방법
WO2019059169A1 (fr) * 2017-09-22 2019-03-28 東レ株式会社 Composition de résine photosensible transparente, photo-espaceur, dispositif d'affichage à cristaux liquides, procédé de production de photo-espaceur, procédé de production de dispositif d'affichage à cristaux liquides, et utilisation d'une composition de résine photosensible transparente pour exposition par balayage de lentille
WO2019065687A1 (fr) * 2017-09-26 2019-04-04 大阪有機化学工業株式会社 Composition de résine photosensible pour former un photo-espaceur, procédé de formation de photo-espaceur, substrat équipé d'un photo-espaceur, et filtre coloré
JP7274496B2 (ja) 2018-03-23 2023-05-16 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング ネガ作動型超厚膜フォトレジスト
EP3793750A4 (fr) * 2018-05-14 2022-06-22 NBD Nanotechnologies, Inc. Compositions de revêtement organosilane
JPWO2020040092A1 (ja) * 2018-08-20 2021-09-02 Jsr株式会社 パターン形成方法及び感放射線性組成物
JP2020166214A (ja) * 2019-03-29 2020-10-08 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JP7428491B2 (ja) * 2019-08-20 2024-02-06 東京応化工業株式会社 硬化性組成物、硬化物、及び絶縁膜の形成方法
KR20210122066A (ko) * 2020-03-30 2021-10-08 동우 화인켐 주식회사 절연막 형성용 수지 조성물, 이를 이용하여 제조된 절연막, 화상표시장치 및 절연막 제조 방법
CN114236966B (zh) * 2021-12-21 2025-01-21 潍坊星泰克微电子材料有限公司 用于干法刻蚀的丙烯酸酯类负性光刻胶膜及其制备方法
KR102882784B1 (ko) 2022-03-31 2025-11-06 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 감광성 엘리먼트

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KR101009733B1 (ko) * 2007-05-15 2011-01-20 주식회사 엘지화학 전자파 차폐층 제조시 무전해도금에 대한 촉매 전구체수지조성물, 이를 이용한 금속패턴 형성방법 및 이에 따라제조된 금속패턴
KR100994605B1 (ko) * 2007-09-21 2010-11-15 동우 화인켐 주식회사 착색 감광성 수지 조성물, 컬러필터 및 이를 구비한 액정표시장치
JP5481844B2 (ja) * 2007-12-14 2014-04-23 住友化学株式会社 着色感光性樹脂組成物
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JP5696665B2 (ja) * 2010-06-09 2015-04-08 東レ株式会社 感光性シロキサン組成物、それから形成された硬化膜および硬化膜を有する素子
JP5765235B2 (ja) * 2010-09-02 2015-08-19 東レ株式会社 感光性組成物、それから形成された硬化膜および硬化膜を有する素子
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Publication number Priority date Publication date Assignee Title
KR20180071807A (ko) * 2016-12-20 2018-06-28 솔브레인 주식회사 오버코팅 조성물 및 이를 이용하여 제조된 도전막
KR20180134196A (ko) * 2017-06-08 2018-12-18 마이크로크래프트코리아 주식회사 잉크젯용 수지 조성물 및 이를 이용하여 제조된 인쇄 배선판
US11390766B2 (en) 2017-06-08 2022-07-19 Microcraft Korea Co., Ltd. Resin composition for inkjet printing and printed wiring board prepared by using same

Also Published As

Publication number Publication date
TW201435493A (zh) 2014-09-16
JP6319082B2 (ja) 2018-05-09
TWI596427B (zh) 2017-08-21
WO2014125884A1 (fr) 2014-08-21
CN104981737A (zh) 2015-10-14
JPWO2014125884A1 (ja) 2017-02-02

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Patent event date: 20150629

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid