KR20160114601A - Uv-led용 폴리실세스퀴옥산계 밀봉재 조성물 및 그것을 위한 인산계 촉매의 용도 - Google Patents
Uv-led용 폴리실세스퀴옥산계 밀봉재 조성물 및 그것을 위한 인산계 촉매의 용도 Download PDFInfo
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- KR20160114601A KR20160114601A KR1020167020362A KR20167020362A KR20160114601A KR 20160114601 A KR20160114601 A KR 20160114601A KR 1020167020362 A KR1020167020362 A KR 1020167020362A KR 20167020362 A KR20167020362 A KR 20167020362A KR 20160114601 A KR20160114601 A KR 20160114601A
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- South Korea
- Prior art keywords
- sealing material
- polysilsesquioxane
- group
- phosphoric acid
- ether
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
- C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
-
- H01L33/56—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2190/00—Compositions for sealing or packing joints
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/321—Phosphates
-
- C09K2003/10—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Silicon Polymers (AREA)
- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
도 2는 실시예 2에서 얻어진 경화물의 자외 가시 투과율 측정 결과이다.
도 3은 비교예 1에서 얻어진 경화물의 자외 가시 투과율 측정 결과이다.
Claims (2)
- 경화물의 260㎚에 있어서의 광의 투과율이 65% 이상인 UV-LED용 폴리실세스퀴옥산계 밀봉재의 경화 촉진제로서의 인산계 촉매의 용도.
- 폴리실세스퀴옥산계 밀봉재와 인산계 촉매를 포함하는 UV-LED용 폴리실세스퀴옥산계 밀봉재 조성물.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2014-016595 | 2014-01-31 | ||
| JP2014016595 | 2014-01-31 | ||
| PCT/JP2015/051946 WO2015115344A1 (ja) | 2014-01-31 | 2015-01-20 | Uv-led用ポリシルセスキオキサン系封止材組成物及びそのためのリン酸系触媒の使用 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20160114601A true KR20160114601A (ko) | 2016-10-05 |
Family
ID=53756918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167020362A Ceased KR20160114601A (ko) | 2014-01-31 | 2015-01-20 | Uv-led용 폴리실세스퀴옥산계 밀봉재 조성물 및 그것을 위한 인산계 촉매의 용도 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9765190B2 (ko) |
| EP (1) | EP3101068B1 (ko) |
| JP (1) | JP6512108B2 (ko) |
| KR (1) | KR20160114601A (ko) |
| CN (1) | CN105934483A (ko) |
| TW (1) | TWI622605B (ko) |
| WO (1) | WO2015115344A1 (ko) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106008979A (zh) * | 2015-03-27 | 2016-10-12 | 豪雅冠得股份有限公司 | 固化性树脂组合物及光半导体装置 |
| JP6694568B2 (ja) * | 2015-03-27 | 2020-05-20 | Hoya株式会社 | 硬化性樹脂組成物、および光半導体装置 |
| KR20160148449A (ko) * | 2015-06-16 | 2016-12-26 | 호야 칸데오 옵트로닉스 가부시키가이샤 | 경화성 수지 조성물, 광학 소자 및 광반도체 장치 |
| WO2017110621A1 (ja) * | 2015-12-21 | 2017-06-29 | 住友化学株式会社 | シリコーン樹脂組成物およびその使用 |
| DE102022205823A1 (de) | 2021-09-27 | 2023-03-30 | Robert Bosch Gesellschaft mit beschränkter Haftung | Silanol-basierte Kompositzusammensetzung |
| WO2023046995A1 (de) | 2021-09-27 | 2023-03-30 | Robert Bosch Gmbh | (poly-)silsesquioxan ausbildende kompositzusammensetzung |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007112975A (ja) | 2005-02-23 | 2007-05-10 | Mitsubishi Chemicals Corp | 半導体発光デバイス用部材及びその製造方法、並びにそれを用いた半導体発光デバイス |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4885186A (en) * | 1988-12-29 | 1989-12-05 | Bell Communications Research, Inc. | Method for preparation of silicate glasses of controlled index of refraction |
| US5962067A (en) * | 1997-09-09 | 1999-10-05 | Lucent Technologies Inc. | Method for coating an article with a ladder siloxane polymer and coated article |
| US6368535B1 (en) * | 1999-08-06 | 2002-04-09 | Dow Corning Corporation | Condensation reaction curable silsesquioxane resin composition and methods for the synthesis and cure thereof |
| WO2005051636A1 (en) * | 2003-11-17 | 2005-06-09 | Dow Corning Corporation | Method of embossing cured silicone resin substrates |
| JP5075680B2 (ja) * | 2007-03-28 | 2012-11-21 | リンテック株式会社 | 光素子用封止材および光素子封止体 |
| JP5186668B2 (ja) * | 2008-03-07 | 2013-04-17 | ナガセケムテックス株式会社 | 硬化性シルセスキオキサン組成物 |
| EP2412747B1 (en) * | 2009-03-27 | 2016-11-02 | Asahi Glass Company, Limited | Hard coating composite, and resin substrate having a hard coat layer |
| JP5707607B2 (ja) * | 2009-04-24 | 2015-04-30 | Jnc株式会社 | 有機ケイ素化合物及びそれを含む熱硬化性樹脂組成物 |
| US8182646B2 (en) * | 2009-09-30 | 2012-05-22 | Federal-Mogul Corporation | Substrate and rubber composition and method of making the composition |
| JP2011202154A (ja) | 2010-03-01 | 2011-10-13 | Yokohama Rubber Co Ltd:The | 加熱硬化性光半導体封止用シリコーン樹脂組成物およびこれを用いる光半導体封止体 |
| EP2573129B1 (en) | 2010-05-18 | 2016-08-17 | JNC Corporation | Novel organosilicon compound and thermosetting resin composition, cured resin, and semiconductor sealing material containing said organosilicon compound |
| KR101968641B1 (ko) * | 2012-01-27 | 2019-04-12 | 삼성전자주식회사 | 화합물, 이를 포함하는 조성물, 이로부터 형성된 복합체, 이를 이용한 전극과 복합막 및 이를 채용한 연료전지 |
-
2015
- 2015-01-20 US US15/112,300 patent/US9765190B2/en not_active Expired - Fee Related
- 2015-01-20 EP EP15743471.3A patent/EP3101068B1/en not_active Not-in-force
- 2015-01-20 WO PCT/JP2015/051946 patent/WO2015115344A1/ja not_active Ceased
- 2015-01-20 JP JP2015559919A patent/JP6512108B2/ja not_active Expired - Fee Related
- 2015-01-20 CN CN201580005745.XA patent/CN105934483A/zh active Pending
- 2015-01-20 KR KR1020167020362A patent/KR20160114601A/ko not_active Ceased
- 2015-01-26 TW TW104102551A patent/TWI622605B/zh not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007112975A (ja) | 2005-02-23 | 2007-05-10 | Mitsubishi Chemicals Corp | 半導体発光デバイス用部材及びその製造方法、並びにそれを用いた半導体発光デバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201540750A (zh) | 2015-11-01 |
| WO2015115344A1 (ja) | 2015-08-06 |
| US20160340474A1 (en) | 2016-11-24 |
| CN105934483A (zh) | 2016-09-07 |
| US9765190B2 (en) | 2017-09-19 |
| EP3101068A4 (en) | 2017-10-25 |
| JPWO2015115344A1 (ja) | 2017-03-23 |
| EP3101068B1 (en) | 2018-10-03 |
| EP3101068A1 (en) | 2016-12-07 |
| JP6512108B2 (ja) | 2019-05-15 |
| TWI622605B (zh) | 2018-05-01 |
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Patent event date: 20160726 Patent event code: PA01051R01D Comment text: International Patent Application |
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Patent event code: PA02012R01D Patent event date: 20191106 Comment text: Request for Examination of Application |
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