KR20170026565A - 제트 잉크 조성물, 방법 및 코팅 제품 - Google Patents
제트 잉크 조성물, 방법 및 코팅 제품 Download PDFInfo
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Abstract
Description
도 1은 구체 예에 따른 미경화된 제트 잉크 조성물의 열 탈착 가스 크로마토그램 질량 분광학 (GC/MS) 스펙트럼을 나타낸다.
도 2는, 용제 조성물을 갖는 및 없는, 구체 예에 따른 미경화된 제트 잉크 조성물의 푸리에 변환 적외선 (FTIR) 스펙트럼을 나타낸다.
도 3a는 구체 예에 따른 미경화된 제트 잉크 조성물에 대한 양 이온화 전기분무 질량 스펙트럼 (positive ionization electrospray mass spectrum)을 나타낸다.
도 3b는 구체 예에 따른 미경화된 제트 잉크 조성물에 대한 음 이온화 전자분무 질량 스펙트럼을 나타낸다.
도 4는 구체 예에 따른 커버 렌즈 기판상에 코팅된 경화된 제트 잉크 조성물에 의해 실행된 실험적으로 결정된 특성 및 기능 시험 기준의 도표를 나타낸다.
Claims (21)
- 안료 물질;
미경화된 실리콘 수지 성분:
미경화된 에폭시 수지 성분: 및
미경화된 멜라민 수지 성분을 포함하는 미경화된 수지 조성물; 및
프로필렌-글리콜-모노메틸-에테르:
디에틸렌-글리콜-디메틸-에테르: 및
프로필렌-글리콜-메틸-에테르-아세테이트를 포함하는 용제 조성물을 포함하는, 잉크 조성물. - 청구항 1에 있어서,
상기 안료 물질은 약 3 내지 약 5 중량 퍼센트로 존재하는 카본 블랙 미립자 안료 물질을 포함하고;
상기 미경화된 수지 조성물은:
약 15 내지 약 20 중량 퍼센트로 존재하는 실세스퀴옥산 성분을 포함하는 미경화된 실리콘 수지;
약 0.5 내지 약 3 중량 퍼센트로 존재하는 미경화된 에폭시 수지 성분; 및
약 1 내지 약 4 중량 퍼센트로 존재하는 미경화된 멜라민 수지 성분을 포함하며; 및
상기 용제 조성물은:
약 30 내지 약 40 중량 퍼센트로 존재하는 프로필렌-글리콜-모노메틸-에테르;
약 10 내지 약 13 중량 퍼센트로 존재하는 디에틸렌-글리콜-디메틸-에테르; 및
약 10 내지 약 12 중량 퍼센트로 존재하는 프로필렌-글리콜-메틸-에테르-아세테이트를 포함하는, 잉크 조성물. - 청구항 1 또는 2에 있어서,
상기 잉크 조성물은, 첨가제 조성물을 더욱 포함하는, 잉크 조성물. - 청구항 3에 있어서,
상기 첨가제 조성물은:
약 1.5 내지 약 3.5 중량 퍼센트로 존재하는 분산제;
약 0.5 내지 약 1 중량 퍼센트로 존재하는 유동 촉진제; 및
약 3 중량 퍼센트까지 존재하는 수지 강화제; 중 적어도 하나를 포함하는, 잉크 조성물. - 청구항 4에 있어서,
상기 잉크 조성물은 약 25℃에서 약 4 내지 약 6 센티포이즈의 점도를 갖는, 잉크 조성물. - 청구항 2-5중 어느 한 항에 있어서,
상기 카본 블랙 미립자 안료 물질은 약 100 내지 약 150 nanometers의 입자 크기를 갖는, 잉크 조성물. - 청구항 1-6중 어느 한 항에 있어서,
상기 잉크 조성물은:
용제 조성물을 확인하기 위해 200℃에서 가스 크로마토그램;
도 1의 열 탈착 가스 크로마토그래피 질량 스펙트럼;
도 2의 푸리에 변환 적외선 스펙트럼; 및
도 3a 및 도 3b의 전자분무 이온화 질량 스펙트럼; 중 적어도 하나를 특징으로 하는, 잉크 조성물. - 카본 블랙 미립자 안료 물질;
미경화된 실리콘 수지 성분:
미경화된 에폭시 수지 성분: 및
미경화된 멜라민 수지 성분을 포함하는 미경화된 수지 조성물; 및
프로필렌-글리콜-모노메틸-에테르:
디에틸렌-글리콜-디메틸-에테르: 및
프로필렌-글리콜-메틸-에테르-아세테이트를 포함하는 용제 조성물을 포함하는, 제트 잉크 조성물을 기판상에 코팅하는 단계; 및
상기 기판상에 미경화된 제트 잉크 조성물을 인-시튜 경화시켜 상기 기판상에 경화된 잉크 조성물을 형성하는, 경화 단계를 포함하는, 잉크 코팅 방법. - 청구항 8에 있어서,
상기 미경화된 제트 잉크 조성물은 열적으로 경화되어 경화된 잉크 조성물을 형성하는, 잉크 코팅 방법. - 청구항 8 또는 9에 있어서,
상기 기판은 유리 기판, 세라믹 기판, 금속 산화물 기판, 금속 기판 및 중합체 기판으로 이루어진 군으로부터 선택되는, 잉크 코팅 방법. - 청구항 9에 있어서,
상기 미경화된 잉크 조성물은:
약 160℃ 내지 약 250℃의 온도; 및
약 1분 내지 약 20분의 시간 동안, 불활성 분위기에서 열적으로 경화되는, 잉크 코팅 방법. - 기판; 및
미립자 안료 물질: 및
상기 미립자 안료 물질을 결합시키고, 경화된 실리콘 수지 성분, 경화된 에폭시 수지 성분 및 경화된 멜라민 수지 성분을 포함하는, 경화된 수지 바인더 조성물을 포함하는, 상기 기판상에 위치된 경화된 코팅을 포함하는, 코팅 제품. - 청구항 12에 있어서,
상기 미립자 안료 물질은 카본 블랙 미립자 안료 물질을 포함하는, 코팅 제품. - 청구항 12 또는 13에 있어서,
상기 기판은 유리 기판, 세라믹 기판, 금속 산화물 기판, 금속 기판 및 중합체 기판으로 이루어진 군으로부터 선택되는, 코팅 제품. - 청구항 12-14중 어느 한 항에 있어서,
상기 경화된 코팅은 약 2 내지 약 6 microns의 두께를 갖는, 코팅 제품. - 청구항 12-15중 어느 한 항에 있어서,
상기 기판에 대한 경화된 코팅의 접착력은 크로스 해치 접착력 시험에서 4B 이상인, 코팅 제품. - 청구항 12-16중 어느 한 항에 있어서,
상기 경화된 코팅은 약 3 내지 약 5.5의 광학 밀도를 갖는, 코팅 제품. - 청구항 13에 있어서,
상기 카본 블랙 미립자 안료 물질 입자는 규칙적으로 배열되는, 코팅 제품. - 청구항 12-18중 어느 한 항에 있어서,
상기 코팅 제품은 커버 렌즈를 포함하고; 및
상기 코팅 제품은 기판으로부터 경화된 코팅의 박리 또는 경화된 코팅의 탈색 없이 수성 알칼리 세제 용액으로 초음파 세정될 수 있는, 코팅 제품. - 전면, 배면 및 측면을 갖는 하우징;
상기 하우징 내부에 적어도 부분적으로 제공되며, 적어도 제어장치, 메모리, 및 하우징의 전면 또는 그 근처에 제공된 디스플레이를 포함하는 전기 부품; 및
상기 하우징의 전면에 또는 그 위에 제공되어 디스플레이 위에 제공된 청구항 12의 코팅 제품을 포함하는, 소비자 전자 제품. - 청구항 20에 있어서,
상기 소비자 전자 제품은 휴대 전화, 휴대용 미디어 플레이어, 노트북 컴퓨터 또는 태블릿 컴퓨터인, 소비자 전자 제품.
Applications Claiming Priority (3)
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| US201462020455P | 2014-07-03 | 2014-07-03 | |
| US62/020,455 | 2014-07-03 | ||
| PCT/US2015/038426 WO2016003963A1 (en) | 2014-07-03 | 2015-06-30 | Jet ink composition, method and coated article |
Publications (1)
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| KR20170026565A true KR20170026565A (ko) | 2017-03-08 |
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| JP (1) | JP6764402B2 (ko) |
| KR (1) | KR20170026565A (ko) |
| CN (1) | CN106471073B (ko) |
| TW (1) | TWI675072B (ko) |
| WO (1) | WO2016003963A1 (ko) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949612A (zh) * | 2015-03-20 | 2018-04-20 | 康宁股份有限公司 | 喷墨墨组合物、墨涂覆方法和经涂覆的制品 |
| US10473829B2 (en) * | 2016-01-18 | 2019-11-12 | Corning Incorporated | Enclosures having an improved tactile surface |
| US20180371268A1 (en) * | 2017-06-27 | 2018-12-27 | Corning Incorporated | White inkjet ink composition, ink coating method, and coated article |
| US10921860B2 (en) * | 2017-11-21 | 2021-02-16 | Corning Incorporated | Articles with textured surfaces and methods of making same |
| AU2021290598A1 (en) * | 2020-06-17 | 2023-02-09 | Grst Singapore Pte. Ltd. | Method for composite delamination |
Family Cites Families (62)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62250081A (ja) * | 1986-04-23 | 1987-10-30 | Toyo Ink Mfg Co Ltd | 記録液 |
| GB9421395D0 (en) | 1994-10-24 | 1994-12-07 | Xaar Ltd | Ink jet ink composition |
| JPH107969A (ja) * | 1996-06-21 | 1998-01-13 | Showa Denko Kk | インク組成物 |
| US5888287A (en) | 1997-04-10 | 1999-03-30 | Markem Corporation | Washable fabrics ink |
| US6231654B1 (en) | 1999-04-30 | 2001-05-15 | Macdermid Acumen, Inc. | Ink composition and a method of making the ink composition |
| CA2286446C (en) | 1999-10-15 | 2007-01-09 | American Dye Source, Inc. | Hot melt ink compositions for inkjet printing applications |
| US6309452B1 (en) | 1999-12-02 | 2001-10-30 | Lexmark International, Inc. | Wet rub resistant ink compositions |
| JP2001316649A (ja) * | 2000-04-28 | 2001-11-16 | Hitachi Chem Co Ltd | 接着剤組成物、接着剤付金属箔及び金属張積層板 |
| JP2002204079A (ja) * | 2001-01-04 | 2002-07-19 | Toshiba Chem Corp | ビルドアップ型多層プリント配線板とそれに用いる樹脂組成物および樹脂フィルム |
| US6730149B2 (en) | 2001-01-22 | 2004-05-04 | Ricoh Company Limited | Ink composition and inkjet recording method and apparatus using the ink composition |
| US6827772B2 (en) | 2002-05-24 | 2004-12-07 | Cabot Corporation | Carbon black and compositions containing same |
| CN1472597A (zh) * | 2002-07-16 | 2004-02-04 | 东洋纺织株式会社 | Ir烧蚀用层压体 |
| ATE521672T1 (de) | 2002-11-01 | 2011-09-15 | Seiko Epson Corp | Tintenkombination, aufzeichnungsverfahren, aufzeichnungsgerät, aufzeichnungssystem und aufgezeichnetes objekt |
| US6881250B2 (en) | 2003-01-15 | 2005-04-19 | Xerox Corporation | Tailored ink for piston driven electrostatic liquid drop modulator |
| US7297460B2 (en) | 2003-02-26 | 2007-11-20 | Agfa-Gevaert | Radiation curable ink compositions suitable for ink-jet printing |
| DE602004004179T2 (de) * | 2003-02-26 | 2007-11-15 | Agfa Graphics N.V. | Für den Tintenstrahldruck geeignete strahlunghärtbare Tintenzusammensetzungen |
| CN1331671C (zh) | 2003-04-25 | 2007-08-15 | 富士胶片株式会社 | 喷墨记录墨水组合物及喷墨记录方法 |
| JP2005054104A (ja) * | 2003-08-06 | 2005-03-03 | Hitachi Chem Co Ltd | 着色画像形成用印刷インキ組成物並びにそれを用いたカラーフィルタの製造方法及びカラ−フィルタ |
| US7439285B2 (en) | 2004-01-23 | 2008-10-21 | Printar Ltd. | Liquid thermosetting ink |
| US20050261398A1 (en) * | 2004-05-21 | 2005-11-24 | General Electric Company | Catalyst for curing epoxy resins, epoxy resin composition, and powder coating composition |
| JP2005353770A (ja) * | 2004-06-09 | 2005-12-22 | Hitachi Chem Co Ltd | 印刷配線板の製造方法 |
| WO2007089859A1 (en) | 2006-01-31 | 2007-08-09 | Cabot Corporation | Inkjet ink compositions comprising polymeric dispersants having attached chromophore groups |
| JP5194470B2 (ja) * | 2006-02-06 | 2013-05-08 | 東洋インキScホールディングス株式会社 | インクジェット記録用インク組成物、及びカラーフィルター基板 |
| JP4666682B2 (ja) | 2006-03-17 | 2011-04-06 | 日立マクセル株式会社 | 油性インク組成物 |
| JP5223179B2 (ja) | 2006-06-14 | 2013-06-26 | コニカミノルタIj株式会社 | 非水系インクジェット用インクセット及びインクジェット記録方法 |
| US8349066B2 (en) * | 2006-09-21 | 2013-01-08 | Ppg Industries Ohio, Inc. | Low temperature, moisture curable coating compositions and related methods |
| JP2008106165A (ja) * | 2006-10-26 | 2008-05-08 | Chisso Corp | インクジェット用インクおよび当該インクにより得られる硬化膜 |
| JP5194444B2 (ja) * | 2006-12-11 | 2013-05-08 | 東洋インキScホールディングス株式会社 | インクジェットインク、及びカラーフィルタ基板 |
| TWI341319B (en) | 2007-03-06 | 2011-05-01 | Au Optronics Corp | Ink composition and method of using the same to produce color filter |
| CN101675127A (zh) * | 2007-04-02 | 2010-03-17 | 因艾克斯塞尔商标专利公司 | 使用被树脂涂覆的颜料制备油漆和油墨的方法 |
| JP2009029888A (ja) * | 2007-07-25 | 2009-02-12 | Canon Inc | 顔料インク組成物および塗料 |
| JP4935592B2 (ja) * | 2007-09-13 | 2012-05-23 | 昭栄化学工業株式会社 | 熱硬化型導電性ペースト |
| JP5470945B2 (ja) * | 2008-03-24 | 2014-04-16 | 東洋インキScホールディングス株式会社 | 分散剤、並びに、それを用いた顔料組成物、顔料分散体、及びインクジェットインキ |
| JP2009244513A (ja) * | 2008-03-31 | 2009-10-22 | The Inctec Inc | カラーフィルタ用熱硬化性インクジェットインク、及びカラーフィルタ |
| CN105062214A (zh) | 2008-04-04 | 2015-11-18 | 柯尼卡美能达株式会社 | 非水性喷墨油墨、非水性喷墨油墨的制造方法及喷墨记录方法 |
| BRPI0918771B1 (pt) | 2008-09-05 | 2019-03-26 | Toyo Ink Mfg Co., Ltd | Composição de tinta |
| JP2010111802A (ja) * | 2008-11-07 | 2010-05-20 | Toyo Ink Mfg Co Ltd | インクジェットインキ、及びカラーフィルタ基板 |
| WO2011011359A1 (en) | 2009-07-20 | 2011-01-27 | Markem-Imaje Corporation | Solvent-based inkjet ink formulations |
| US7897314B1 (en) * | 2009-08-31 | 2011-03-01 | Xerox Corporation | Poss melamine overcoated photoconductors |
| JP4664429B1 (ja) | 2009-10-23 | 2011-04-06 | 理想科学工業株式会社 | 油性インクジェットインク |
| JP5645642B2 (ja) | 2010-01-20 | 2014-12-24 | キヤノン株式会社 | インク、インクジェット記録方法、及びインクカートリッジ |
| US8758896B2 (en) * | 2010-07-02 | 2014-06-24 | Kansai Paint Co., Ltd. | Method for forming multilayer coating film |
| JP2012011740A (ja) | 2010-07-05 | 2012-01-19 | Riso Kagaku Corp | 非水系インクジェットコンポジット印刷法及びインクセット |
| WO2012042665A1 (ja) * | 2010-10-01 | 2012-04-05 | リケンテクノス株式会社 | 接着剤組成物、塗料組成物およびこれを用いたプライマー、インクジェットインク、接着方法および積層体 |
| JP2012103472A (ja) * | 2010-11-10 | 2012-05-31 | Toyo Ink Sc Holdings Co Ltd | インクジェットインキ組成物 |
| US8355242B2 (en) | 2010-11-12 | 2013-01-15 | Avx Corporation | Solid electrolytic capacitor element |
| ES2665524T3 (es) * | 2011-01-24 | 2018-04-26 | Akzo Nobel Coatings International B.V. | Composición resistente al calor elevado |
| JP2012180389A (ja) * | 2011-02-28 | 2012-09-20 | Fujifilm Corp | インク組成物、画像形成方法及び印画物 |
| EP2682438B1 (en) | 2011-02-28 | 2017-04-05 | FUJIFILM Corporation | Ink composition and image forming method |
| JP2012201703A (ja) | 2011-03-23 | 2012-10-22 | Miller Paint:Kk | インク、印刷体の製造方法及び銀鏡印刷体の製造方法 |
| JP5742383B2 (ja) * | 2011-03-31 | 2015-07-01 | 住友大阪セメント株式会社 | 黒色膜、黒色膜付き基材及び画像表示装置 |
| WO2013019752A1 (en) * | 2011-07-29 | 2013-02-07 | Sun Color Corporation | Dispersions and related coatings and cured articles |
| JP2015516671A (ja) | 2012-02-08 | 2015-06-11 | ダウ コーニング コリア リミテッド | 硬化性パターン化可能インク並びに印刷方法 |
| WO2013120908A1 (en) * | 2012-02-17 | 2013-08-22 | Sony Dadc Austria Ag | Microstructured polymer devices |
| US20130273259A1 (en) * | 2012-04-13 | 2013-10-17 | Mélanie Emilie Céline Depardieu | Marking coating |
| JP6056369B2 (ja) * | 2012-10-19 | 2017-01-11 | 住友大阪セメント株式会社 | 黒色材料、黒色材料分散液、黒色樹脂組成物、黒色膜、黒色膜付き基材、及び固体撮像素子 |
| CN104955905B (zh) * | 2013-02-27 | 2017-11-28 | 株式会社朝日橡胶 | 白色反射膜用油墨、粉体涂料、白色反射膜及其制造方法、光源支架及照明器具遮光罩 |
| MX2015014620A (es) * | 2013-04-22 | 2016-03-01 | Ethox Chemicals Llc | Aditivos para composiciones de resina para mejorar la resistencia al impacto y la flexibilidad. |
| CN104116289A (zh) * | 2013-04-29 | 2014-10-29 | 富泰华工业(深圳)有限公司 | 平板型电子装置保护套 |
| EP2865527B1 (en) * | 2013-10-22 | 2018-02-21 | Agfa Nv | Manufacturing of decorative surfaces by inkjet |
| CN103778703A (zh) * | 2014-02-10 | 2014-05-07 | 马要武 | 一种携带电器 |
| WO2015101210A1 (zh) | 2013-12-31 | 2015-07-09 | 马要武 | 钥匙和锁 |
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2015
- 2015-06-30 US US14/754,939 patent/US9683119B2/en not_active Expired - Fee Related
- 2015-06-30 KR KR1020177002730A patent/KR20170026565A/ko not_active Ceased
- 2015-06-30 WO PCT/US2015/038426 patent/WO2016003963A1/en not_active Ceased
- 2015-06-30 JP JP2017521016A patent/JP6764402B2/ja not_active Expired - Fee Related
- 2015-06-30 CN CN201580036418.0A patent/CN106471073B/zh not_active Expired - Fee Related
- 2015-06-30 EP EP15736757.4A patent/EP3164456A1/en not_active Withdrawn
- 2015-07-03 TW TW104121719A patent/TWI675072B/zh not_active IP Right Cessation
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Also Published As
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| TWI675072B (zh) | 2019-10-21 |
| CN106471073A (zh) | 2017-03-01 |
| US20190233668A1 (en) | 2019-08-01 |
| CN106471073B (zh) | 2021-11-23 |
| WO2016003963A1 (en) | 2016-01-07 |
| JP6764402B2 (ja) | 2020-09-30 |
| JP2017528582A (ja) | 2017-09-28 |
| EP3164456A1 (en) | 2017-05-10 |
| US11021623B2 (en) | 2021-06-01 |
| US10280325B2 (en) | 2019-05-07 |
| TW201610004A (zh) | 2016-03-16 |
| US9683119B2 (en) | 2017-06-20 |
| US20170253755A1 (en) | 2017-09-07 |
| US20160002479A1 (en) | 2016-01-07 |
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