KR20200043977A - 유기 일렉트로 루미네센스 소자용 봉지제 - Google Patents
유기 일렉트로 루미네센스 소자용 봉지제 Download PDFInfo
- Publication number
- KR20200043977A KR20200043977A KR1020207002163A KR20207002163A KR20200043977A KR 20200043977 A KR20200043977 A KR 20200043977A KR 1020207002163 A KR1020207002163 A KR 1020207002163A KR 20207002163 A KR20207002163 A KR 20207002163A KR 20200043977 A KR20200043977 A KR 20200043977A
- Authority
- KR
- South Korea
- Prior art keywords
- formula
- organic electroluminescent
- group
- compound
- encapsulant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H01L23/293—
-
- H01L27/32—
-
- H01L51/5246—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Epoxy Resins (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Sealing Material Composition (AREA)
Abstract
Description
Claims (15)
- (A) 양이온 중합성 화합물과, (B) 광양이온 중합 개시제와, (C) 인산 에스테르 및 아인산 에스테르로 이루어지는 군에서 선택되는 1종 이상의 인산 화합물을 함유하고,
(A) 양이온 중합성 화합물이 (A-1) 에폭시기를 갖는 지환식 화합물 및 (A-2) 에폭시기를 갖는 방향족 화합물을 함유하는 유기 일렉트로 루미네센스 소자용 봉지제. - 청구항 1에 있어서,
(C) 인산 화합물이 (C1) 인산 에스테르인 유기 일렉트로 루미네센스 소자용 봉지제. - 청구항 1에 있어서,
(C) 인산 화합물이 (C2) 아인산 에스테르인 유기 일렉트로 루미네센스 소자용 봉지제. - 청구항 4에 있어서,
(C2) 아인산 에스테르가 식(C2-1)으로 나타나는 화합물, 식(C2-2)으로 나타나는 화합물, 식(C2-3)으로 나타나는 화합물, 식(C2-4)으로 나타나는 화합물, 식(C2-5)으로 나타나는 화합물 및 식(C2-6)으로 나타나는 화합물로 이루어지는 군에서 선택되는 적어도 1종을 함유하는 유기 일렉트로 루미네센스 소자용 봉지제.
[화학식 4]
[화학식 5]
[화학식 6]
[화학식 7]
[화학식 8]
[화학식 9]
[식 중, R7, R8, R9, R10, R11, R12, R13, R14, R15, R16 및 R17은 각각 독립적으로 치환기를 가지고 있어도 되는 탄화수소기를 나타낸다.] - 청구항 1 내지 청구항 5 중 어느 한 항에 있어서,
(A-2) 에폭시기를 갖는 방향족 화합물이 비스페놀 A형 에폭시 수지, 비스페놀 F형 에폭시 수지로 이루어지는 군에서 선택되는 1종 이상인 유기 일렉트로 루미네센스 소자용 봉지제. - 청구항 1 내지 청구항 6 중 어느 한 항에 있어서,
(B) 광양이온 중합 개시제가 오늄염인 유기 일렉트로 루미네센스 소자용 봉지제. - 청구항 1 내지 청구항 7 중 어느 한 항에 있어서,
(B) 광양이온 중합 개시제의 사용량이 (A) 양이온 중합성 화합물 100질량부에 대해 0.05~5.0질량부인 유기 일렉트로 루미네센스 소자용 봉지제. - 청구항 1 내지 청구항 8 중 어느 한 항에 있어서,
광 증감제를 더 함유하는 유기 일렉트로 루미네센스 소자용 봉지제. - 청구항 1 내지 청구항 9 중 어느 한 항에 있어서,
실란 커플링제를 더 함유하는 유기 일렉트로 루미네센스 소자용 봉지제. - 청구항 1 내지 청구항 10 중 어느 한 항에 기재된 유기 일렉트로 루미네센스 소자용 봉지제의 경화체.
- 청구항 11에 기재된 경화체를 포함하는 유기 일렉트로 루미네센스 소자용 봉지재.
- 유기 일렉트로 루미네센스 소자와,
청구항 12에 기재된 유기 일렉트로 루미네센스 소자용 봉지재를 포함하는 유기 일렉트로 루미네센스 표시 장치. - 제1 부재에 청구항 1 내지 청구항 10 중 어느 한 항에 기재된 유기 일렉트로 루미네센스 소자용 봉지제를 부착시키는 부착 공정과,
부착시킨 상기 유기 일렉트로 루미네센스 소자용 봉지제에 광을 조사하는 조사 공정과,
광 조사된 상기 유기 일렉트로 루미네센스 소자용 봉지제를 통해 상기 제1 부재와 제2 부재를 맞추어붙이는 첩합 공정을 갖는 유기 일렉트로 루미네센스 표시 장치의 제조 방법. - 청구항 14에 있어서,
상기 제1 부재가 기판이며,
상기 제2 부재가 유기 일렉트로 루미네센스 소자인 유기 일렉트로 루미네센스 표시 장치의 제조 방법.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2017-160727 | 2017-08-24 | ||
| JP2017160727 | 2017-08-24 | ||
| PCT/JP2018/031335 WO2019039587A1 (ja) | 2017-08-24 | 2018-08-24 | 有機エレクトロルミネッセンス素子用封止剤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20200043977A true KR20200043977A (ko) | 2020-04-28 |
| KR102536932B1 KR102536932B1 (ko) | 2023-05-30 |
Family
ID=65438970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207002163A Active KR102536932B1 (ko) | 2017-08-24 | 2018-08-24 | 유기 일렉트로 루미네센스 소자용 봉지제 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7123943B2 (ko) |
| KR (1) | KR102536932B1 (ko) |
| CN (1) | CN110999537B (ko) |
| TW (1) | TWI761583B (ko) |
| WO (1) | WO2019039587A1 (ko) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112470551B (zh) * | 2018-09-26 | 2024-05-14 | 电化株式会社 | 有机电致发光显示元件用密封剂 |
| KR102801734B1 (ko) * | 2018-12-18 | 2025-04-28 | 세키스이가가쿠 고교가부시키가이샤 | 경화성 수지 조성물, 경화물, 및 유기 el 표시 소자 |
| WO2020196669A1 (ja) * | 2019-03-27 | 2020-10-01 | デンカ株式会社 | 組成物 |
| DE102022102650A1 (de) * | 2022-02-04 | 2023-08-10 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Kationisch polymerisierbare flammgeschützte Massen |
| JP2025164342A (ja) * | 2024-04-19 | 2025-10-30 | デンカ株式会社 | 光電変換素子用封止材、フィル材、およびフィル材を用いた装置の製造方法 |
| JP2025164333A (ja) * | 2024-04-19 | 2025-10-30 | デンカ株式会社 | 光電変換素子用封止材、ダム材、およびダム材を用いた装置の製造方法 |
| WO2025220565A1 (ja) * | 2024-04-19 | 2025-10-23 | デンカ株式会社 | 光電変換素子用封止材、ダム材、フィル材、ダム材を用いた装置の製造方法、およびフィル材を用いた装置の製造方法 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5919574B2 (ja) | 1980-03-06 | 1984-05-07 | 東亞合成株式会社 | 塩化ビニル系単量体の懸濁重合法 |
| JPH07247342A (ja) | 1994-01-21 | 1995-09-26 | Toyo Ink Mfg Co Ltd | 紫外線硬化型樹脂組成物およびこれを含む被覆剤 |
| JP2001357973A (ja) | 2000-06-15 | 2001-12-26 | Sony Corp | 表示装置 |
| JP2007513234A (ja) | 2003-12-02 | 2007-05-24 | ディーエスエム アイピー アセッツ ビー.ブイ. | 難燃性の放射線硬化性組成物 |
| JP2009079230A (ja) * | 2005-01-26 | 2009-04-16 | Sekisui Chem Co Ltd | 有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置 |
| JP4384509B2 (ja) | 2003-01-09 | 2009-12-16 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス素子の封止方法及び有機エレクトロルミネッセンス素子 |
| JP4800247B2 (ja) | 2002-06-17 | 2011-10-26 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス素子封止用接着剤、有機エレクトロルミネッセンス素子封止用粘着テープ、有機エレクトロルミネッセンス素子封止用両面粘着テープ、有機エレクトロルミネッセンス素子の封止方法、及び、有機エレクトロルミネッセンス素子 |
| JP2012116935A (ja) * | 2010-11-30 | 2012-06-21 | Daicel Corp | 硬化性エポキシ樹脂組成物 |
| JP2016058273A (ja) | 2014-09-10 | 2016-04-21 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子用封止剤 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3623530B2 (ja) * | 1994-04-18 | 2005-02-23 | 日東電工株式会社 | 光半導体装置 |
| JP2003342450A (ja) * | 2002-05-28 | 2003-12-03 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| KR101028649B1 (ko) * | 2002-06-17 | 2011-04-11 | 세키스이가가쿠 고교가부시키가이샤 | 유기 전계 발광 소자 밀봉용 접착제 및 그의 응용 |
| JP5319082B2 (ja) * | 2007-05-28 | 2013-10-16 | パナソニック株式会社 | 封止用の液状エポキシ樹脂組成物と封止半導体装置 |
| JP5812993B2 (ja) * | 2010-08-12 | 2015-11-17 | 株式会社ダイセル | 低透湿性樹脂組成物及びその硬化物 |
| CN105246940B (zh) * | 2013-05-28 | 2018-09-04 | 株式会社大赛璐 | 光半导体密封用固化性组合物 |
-
2018
- 2018-08-24 WO PCT/JP2018/031335 patent/WO2019039587A1/ja not_active Ceased
- 2018-08-24 KR KR1020207002163A patent/KR102536932B1/ko active Active
- 2018-08-24 TW TW107129666A patent/TWI761583B/zh active
- 2018-08-24 CN CN201880053942.2A patent/CN110999537B/zh active Active
- 2018-08-24 JP JP2019537707A patent/JP7123943B2/ja active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5919574B2 (ja) | 1980-03-06 | 1984-05-07 | 東亞合成株式会社 | 塩化ビニル系単量体の懸濁重合法 |
| JPH07247342A (ja) | 1994-01-21 | 1995-09-26 | Toyo Ink Mfg Co Ltd | 紫外線硬化型樹脂組成物およびこれを含む被覆剤 |
| JP2001357973A (ja) | 2000-06-15 | 2001-12-26 | Sony Corp | 表示装置 |
| JP4800247B2 (ja) | 2002-06-17 | 2011-10-26 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス素子封止用接着剤、有機エレクトロルミネッセンス素子封止用粘着テープ、有機エレクトロルミネッセンス素子封止用両面粘着テープ、有機エレクトロルミネッセンス素子の封止方法、及び、有機エレクトロルミネッセンス素子 |
| JP4384509B2 (ja) | 2003-01-09 | 2009-12-16 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス素子の封止方法及び有機エレクトロルミネッセンス素子 |
| JP2007513234A (ja) | 2003-12-02 | 2007-05-24 | ディーエスエム アイピー アセッツ ビー.ブイ. | 難燃性の放射線硬化性組成物 |
| JP2009079230A (ja) * | 2005-01-26 | 2009-04-16 | Sekisui Chem Co Ltd | 有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置 |
| JP2012116935A (ja) * | 2010-11-30 | 2012-06-21 | Daicel Corp | 硬化性エポキシ樹脂組成物 |
| JP2016058273A (ja) | 2014-09-10 | 2016-04-21 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子用封止剤 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102536932B1 (ko) | 2023-05-30 |
| JP7123943B2 (ja) | 2022-08-23 |
| CN110999537A (zh) | 2020-04-10 |
| WO2019039587A1 (ja) | 2019-02-28 |
| TWI761583B (zh) | 2022-04-21 |
| CN110999537B (zh) | 2022-08-26 |
| TW201920586A (zh) | 2019-06-01 |
| JPWO2019039587A1 (ja) | 2020-07-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7397151B2 (ja) | 組成物 | |
| JP6578339B2 (ja) | 樹脂組成物 | |
| KR102536932B1 (ko) | 유기 일렉트로 루미네센스 소자용 봉지제 | |
| KR102385321B1 (ko) | 수지 조성물 | |
| KR102784453B1 (ko) | 유기 일렉트로루미네센스 표시 소자용 봉지제 | |
| KR20210114412A (ko) | 봉지제, 경화체, 유기 일렉트로 루미네센스 표시 장치 및 장치의 제조 방법 | |
| JP7440498B2 (ja) | 組成物 | |
| JP2025164342A (ja) | 光電変換素子用封止材、フィル材、およびフィル材を用いた装置の製造方法 | |
| WO2025220565A1 (ja) | 光電変換素子用封止材、ダム材、フィル材、ダム材を用いた装置の製造方法、およびフィル材を用いた装置の製造方法 | |
| JP2025164333A (ja) | 光電変換素子用封止材、ダム材、およびダム材を用いた装置の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| U11 | Full renewal or maintenance fee paid |
Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE) Year of fee payment: 4 |



































